CN108169664A - Board failure detection method and device, computer equipment and storage medium - Google Patents

Board failure detection method and device, computer equipment and storage medium Download PDF

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Publication number
CN108169664A
CN108169664A CN201711488840.7A CN201711488840A CN108169664A CN 108169664 A CN108169664 A CN 108169664A CN 201711488840 A CN201711488840 A CN 201711488840A CN 108169664 A CN108169664 A CN 108169664A
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China
Prior art keywords
network
capacitance
test point
information
sample
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CN201711488840.7A
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CN108169664B (en
Inventor
欧阳云轩
王星
张恂
翟学涛
杨朝辉
高云峰
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Shenzhen Hans CNC Technology Co Ltd
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Han s Laser Technology Industry Group Co Ltd
Shenzhen Hans CNC Technology Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors

Abstract

The present invention relates to a kind of board failure detection method and device, computer equipment and storage mediums.This method includes:The test point capacitance of circuit board under test is obtained using baseline network as reference electrode, network capacitance is obtained according to test point capacitance, fault detect is carried out according to test point capacitance and network capacitance, generates Fisrt fault detection information.By the test point capacitance that circuit board under test is obtained using baseline network as reference electrode, and network capacitance is obtained according to the test point capacitance, and then according to the fault detect of the test point capacitance and network capacitance realization to circuit board, the detection of the subtle failure to circuit board can be realized by way of detecting capacitance, and then improves the precision of board failure detection.

Description

Board failure detection method and device, computer equipment and storage medium
Technical field
The present invention relates to technical field of circuit board detection, more particularly to a kind of board failure detection method and device, Computer equipment and storage medium.
Background technology
PCB (Printed Circuit Board, printed circuit board) is electronic components common at present, and characteristic exists In by external entity electric wire, the electronic building brick for being inserted in circuit board can be by circuit designed on circuit board (layout) other electronic building bricks are electrically connected at, reduce the setting of entity circuit to save outside space.
In PCB production processes, for the product quality of PCB, need to be detected PCB, to exclude PCB failures, When breaking down during PCB uses, it is also desirable to failure cause is rapidly found out, to repair, to replace, after troubleshooting etc. Continuous processing, and with the trend that current PCB volumes are miniaturized increasingly, it is higher and higher to the required precision of PCB fault detects, such as What, which improves PCB fault detection accuracies, becomes current urgent problem to be solved.
Invention content
Based on this, it is necessary to for the required precision to PCB fault detects it is higher and higher the problem of, a kind of circuit board is provided Fault detection method and device, computer equipment and storage medium.
A kind of board failure detection method, including:
The test point capacitance of circuit board under test is obtained using baseline network as reference electrode;
Network capacitance is obtained according to the test point capacitance;
Fault detect is carried out according to the test point capacitance and the network capacitance, generates Fisrt fault detection information.
It is described in one of the embodiments, that fault detect is carried out according to the test point capacitance and the network capacitance, The step of generating Fisrt fault detection information, including:
The test point capacitance and test point capacitance sample are compared, obtain abnormality test point;
First open fault information is generated according to the abnormality test point;
The network capacitance and network capacitance sample are compared, obtain abnormal network;
First short trouble information is generated according to the abnormal network;
According to the first open fault information and the first short trouble information generation Fisrt fault detection information.
In one of the embodiments, it is characterized in that, it is described by the test point capacitance and test point capacitance sample into The step of going and compare, obtaining abnormality test point, including:
The test point capacitance and test point capacitance sample are compared, obtain the first deviation;
When detecting that first deviation is more than first threshold, the corresponding abnormality test of first deviation is obtained Point.
It is described in one of the embodiments, to be compared the network capacitance and network capacitance sample, obtain exception The step of network, including:
The network capacitance and network capacitance sample are compared, obtain the second deviation;
When detecting that second deviation is more than second threshold, the corresponding abnormal net of second deviation is obtained Network.
It is described according to the first open fault information and the first short trouble information in one of the embodiments, After the step of generating Fisrt fault detection information, further include:
Obtain the first network resistance of the abnormality test point corresponding network;
Second open fault information is obtained according to the first network resistance;
Obtain the second network resistor of the abnormal network;
Second short trouble information is obtained according to second network resistor;
According to the second open fault information and the second short trouble information, the second fault detection information is generated.
It is described in one of the embodiments, to be believed according to the second open fault information and second short trouble After the step of breath, the second fault detection information of generation, further include:
Non- abnormality test point and non-abnormal network are obtained according to second fault detection information;
The test point capacitance sample is updated according to the test point capacitance of the non-abnormality test point, according to the non-exception The network capacitance of network updates the network capacitance sample.
The test point capacitance that circuit board under test is obtained using baseline network as reference electrode in one of the embodiments, The step of before, further include:
The network capacitance set of each network in sampler plate is obtained using each projection network as reference electrode respectively;
The corresponding projection network of maximum capacitor value in the network capacitance set of each network is obtained, obtains the base of each network Pseudo-crystalline lattice.
A kind of board failure detection device, including:
Test point capacitance module, for obtaining the test point capacitance of circuit board under test using baseline network as reference electrode;
Network capacitance module, for obtaining network capacitance according to the test point capacitance;
Fisrt fault module, for carrying out fault detect according to the test point capacitance and the network capacitance, generation the One fault detection information.
A kind of computer equipment can be run on a memory and on a processor including memory, processor and storage Computer program, processor any one of realizes the board failure detection method described in embodiment when performing program.
A kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the program is by processor The board failure detection method described in any one embodiment is realized during execution.
Foregoing circuit plate fault detection method and device, computer equipment and storage medium, by using baseline network as ginseng It examines electrode and obtains the test point capacitance of circuit board under test, and network capacitance is obtained, and then according to institute according to the test point capacitance It states test point capacitance and the network capacitance and realizes fault detect to circuit board, can be realized by way of detecting capacitance pair The detection of the subtle failure of circuit board, and then improve the precision of board failure detection.
Description of the drawings
Fig. 1 is the flow diagram of board failure detection method in an embodiment;
Fig. 2 is the flow diagram of board failure detection method in another embodiment;
Fig. 3 is the flow diagram of board failure detection method in another embodiment;
Fig. 4 is the structure diagram of board failure detection device in an embodiment.
Specific embodiment
It is with reference to the accompanying drawings and embodiments, right in order to which the object, technical solution and advantage for making the application are more clearly understood The application is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the application, and It is not used in restriction the application.
In one embodiment, a kind of board failure detection method is provided, as shown in Figure 1, the method comprising the steps of S110 To step S130:
S110 obtains the test point capacitance of circuit board under test using baseline network as reference electrode.
When being tested PCB (Printed Circuit Board, printed circuit board), in order to avoid test uses Probe directly contact part and its leg and damage electronic component, and then influence test effect, it is additional at the both ends of part A pair of circular dot is drawn as test point, does not have anti-welding above test point, probe engaged test point can be allowed to be tested, And without directly contacting tested electronic component, the test for avoiding electronic component is damaged, and also promote test indirectly can By degree.
In the present embodiment, test point capacitance inspection is being carried out to one baseline network of every network settings of PCB to be measured in advance It surveys, using the baseline network of test point belonging network as reference electrode, capacitance detecting is carried out to the test point of circuit board under test, is obtained Test point capacitance.
Specifically, can capacitance detecting be carried out to the test point of PCB to be measured by flying probe tester, obtains test point capacitance.
S120 obtains network capacitance according to test point capacitance.
After test point capacitance is obtained, network capacitance is obtained according to all test point capacitances of every network.Specifically, divide Other all test point capacitance averageds in every network, using obtained average value as the network capacitance of the network.
S130 carries out fault detect according to test point capacitance and network capacitance, generates Fisrt fault detection information.
Different length, different area coverage different circuits and reference electrode between can generate a capacitance, when having When open circuit or short circuit occur, capacitance can also change, such as apart from network endpoint proximity, there are open faults When, the side capacitance variations of circuit length will be very small, and the capacitance variations that the short side of circuit generates are very big, therefore even if very Small open circuit can be also detected.In the present embodiment, after each test point capacitance and each network capacitance is obtained, you can according to survey Pilot capacitance and network capacitance carry out fault detect, obtain abnormal test point and network, and generate Fisrt fault detection information.
Specifically, Fisrt fault detection information can include abnormality test point identification and its capacitance, abnormal network and its Capacitance and fail result.Wherein, fail result refers to being diagnosed extremely as a result, such as including open circuit event Barrier, short trouble etc..
Foregoing circuit plate fault detection method, by the test point that circuit board under test is obtained using baseline network as reference electrode Capacitance, and network capacitance is obtained, and then realize to circuit board according to test point capacitance and network capacitance according to test point capacitance Fault detect, can realize the detection of the subtle failure to circuit board by way of detecting capacitance, and then improve circuit board event Hinder the precision of detection.
In another embodiment, as shown in Fig. 2, carrying out fault detect according to test point capacitance and network capacitance, generation the The step of one fault detection information, including step S210 to step S250:
Test point capacitance and test point capacitance sample are compared by S210, obtain abnormality test point.
In the present embodiment, test point capacitance sample is pre-established with, wherein, test point capacitance sample refers to sample The test point of PCB carries out the obtained and without exception capacitance of capacity measurement.
When the test point capacitance for getting PCB to be measured, by the corresponding test point capacitance sample of test point capacitance into Row compares, and obtains the abnormality test point of capacitance exception.
S220 generates the first open fault information according to abnormality test point.
When detecting abnormality test point, then the network belonging to the test point is judged there are open fault, and generate first Open fault information.Specifically, the first open fault information includes the capacitance and exception of abnormality test point, abnormality test point Network belonging to test point.
Network capacitance and network capacitance sample are compared, obtain abnormal network by S230.
In the present embodiment, network capacitance sample is pre-established with, wherein, network capacitance sample refers to sample PCB's Network carries out the obtained and without exception capacitance of capacity measurement.
When the network capacitance for getting PCB to be measured, the corresponding network capacitance sample of network capacitance is compared, Obtain the abnormal network of capacitance exception.
S240 generates the first short trouble information according to abnormal network.
When detecting abnormal network, then the network is judged there are short trouble, and generate the first short trouble information.Tool Body, the first short trouble information includes the capacitance of abnormal network, abnormal network.
S250 generates Fisrt fault detection information according to the first open fault information and the first short trouble information.
According to the first open fault information and the first short trouble information generation Fisrt fault detection information, wherein, first Fault detection information includes the first open fault information and the first short trouble information.It can be fast according to Fisrt fault detection information Speed knows the fault details of PCB to be measured, and Breakdown Maintenance and improvement are carried out to PCB convenient for staff.
Further, the step of test point capacitance and test point capacitance sample being compared, obtaining abnormality test point, packet It includes:Test point capacitance and test point capacitance sample are compared, obtain the first deviation;When detecting that the first deviation is more than During first threshold, the corresponding abnormality test point of the first deviation is obtained.
Wherein, the first deviation can be the capacitive differential of the test point capacitance and test point capacitance sample of PCB to be measured, Can be the deviation ratio of the test point capacitance of PCB to be measured, further, deviation ratio refers to test point capacitance and the survey of PCB to be measured The capacitive differential of pilot capacitance sample, the ratio with test point capacitance sample.When the first deviation is more than first threshold, then recognize It is abnormality test point for the test point.Wherein, first threshold is to pre-set ground, for judging the whether abnormal number of test point Value, concrete numerical value can be depending on actual conditions.
In one embodiment, the test point capacitance and test point capacitance sample bias that the first deviation is PCB to be measured Rate, first threshold 10%, that is to say, that when the deviation ratio of the test point capacitance of PCB to be measured is more than 10%, then it is assumed that the survey The corresponding test point of pilot capacitance is abnormal.
Further, the step of network capacitance being compared with network capacitance sample, obtains abnormal network, including:It will Network capacitance is compared with network capacitance sample, obtains the second deviation;When detect the second deviation be more than second threshold When, obtain the corresponding abnormal network of the second deviation.
Wherein, the second deviation can be capacitive differential of the network capacitance with network capacitance sample of PCB to be measured, can also The deviation ratio of network capacitance for PCB to be measured, further, deviation ratio refer to the network capacitance of PCB to be measured and network capacitance sample This capacitive differential, the ratio with network capacitance sample.When the second deviation is more than second threshold, then it is assumed that the network is different Normal network.Wherein, second threshold is to pre-set ground, for judging the whether abnormal numerical value of network, and concrete numerical value can basis Depending on actual conditions.
In one embodiment, the network capacitance and network capacitance sample bias rate that the second deviation is PCB to be measured, the Two threshold values are 10%, that is to say, that when the deviation ratio of the network capacitance of PCB to be measured is more than 10%, then it is assumed that the network capacitance Corresponding Network Abnormal.
In another embodiment, as shown in figure 3, according to the first open fault information and the first short trouble information generation the After the step of one fault detection information, step S310 is further included to step S350:
S310 obtains the first network resistance of abnormality test point corresponding network.
First network resistance refers to carry out resistance test to the network belonging to abnormality test point namely open network, obtain The network resistance.Specifically, it is powered, obtained by the endpoint of two probes of flying probe tester while contact network The network resistor.
S320 obtains the second open fault information according to first network resistance.
Second open fault information refers to after being tested by electric-resistivity method that the network with open fault further determined that is believed Breath.In the present embodiment, the first network resistance of acquisition is passed through into electricity compared with the offresistance set so as to further determine that The open network that appearance method measures whether there is open fault.
Specifically, the second open fault information includes the open network and its network resistor that further determine that.
S330 obtains the second network resistor of abnormal network.
Second network resistor refers to carry out resistance test, the electricity of the obtained network to abnormal network namely short-circuit network Resistance.Specifically, it is powered by the endpoint of two probes of flying probe tester while contact network, obtains the network resistor.
S340 obtains the second short trouble information according to the second network resistor.
Second short trouble information refers to after being tested by electric-resistivity method that the network with short trouble further determined that is believed Breath.In the present embodiment, the second network resistor of acquisition is passed through into electricity compared with the short-circuit resistance set so as to further determine that The short-circuit network that appearance method measures whether there is short trouble.
Specifically, the second short trouble information includes the short-circuit network further determined that and its network resistor.
S350 according to the second open fault information and the second short trouble information, generates the second fault detection information.
Second fault detection information is the final identified fault detect letter after capacitance detecting and resistance repetition measurement Breath, compared to Fisrt fault detection information accuracy higher.Wherein, the second fault detection information includes the second open fault information With the second short trouble information.
Further, according to the second open fault information and the second short trouble information, the second fault detection information is generated The step of after, further include:Non- abnormality test point and non-abnormal network are obtained according to the second fault detection information;According to non-exception The test point capacitance update test point capacitance sample of test point, updates network capacitance sample according to the network capacitance of non-abnormal network This.
In the present embodiment, non-abnormality test point refers to according to the second fault detection information is finally determining, there is no different Normal test point, non-abnormal network refer to network finally determined according to the second fault detection information, there is no exception.Pass through The test point capacitance of non-abnormality test point is replaced into its corresponding test point capacitance sample, the network capacitance of non-abnormal network is replaced Its corresponding network capacitance sample is changed, updates test point capacitance sample and network capacitance sample, to improve the accuracy of sample value, And then improve accuracy of detection when follow-up PCB to be measured is detected.
In another embodiment, using baseline network as reference electrode obtain circuit board under test test point capacitance the step of it Before, it further includes:The network capacitance set of each network in sampler plate is obtained using each projection network as reference electrode respectively;It obtains The corresponding projection network of maximum capacitor value, obtains the baseline network of each network in the network capacitance set of each network.
In the present embodiment, the extraction projection network information unites the corresponding projection network of every network of sample PCB Meter, and takes a little every network, is used as respectively using its corresponding all projection network with reference to electrode progress capacitance detecting, every Network respectively obtains a network capacitance set, and network capacitance set includes corresponding network respectively using different projection networks as ginseng The capacitance for examine electrode when being tested, obtaining, then chooses the corresponding projection network of maximum capacitor value in network capacitance set, Baseline network as corresponding network.Specifically, can capacitance detecting be carried out to each network of PCB to be measured by flying probe tester, Obtain network capacitance set.
In addition, also classification can be grouped to the all-network of PCB, the network for possessing same baseline network is classified as one Class.
Further, board failure detection method further includes step:It obtains maximum in the network capacitance set of each network Capacitance obtains network capacitance sample;The test point capacitance of sampler plate is obtained using baseline network as reference electrode, is surveyed Pilot capacitance sample.
In one embodiment, maximum capacitor value in the network capacitance set of each network is obtained, obtains network capacitance sample Before this step of, further include:The third network resistor of sampler plate all-network is obtained, is obtained according to third network resistor Third open fault information and third short trouble information.
Further, the step of obtaining maximum capacitor value in the network capacitance set of each network, obtaining network capacitance sample, Including:According to maximum in third open fault information and the network capacitance set of the non-abnormal network of third short trouble acquisition of information Capacitance obtains network capacitance sample.
Further, the test point capacitance of sampler plate is obtained using baseline network as reference electrode, obtains test point electricity The step of holding sample, including:The test point capacitance of sampler plate is obtained using baseline network as reference electrode, is opened a way according to third Fault message and third short trouble information obtain non-abnormal test point capacitance sample in the test point capacitance of sampler plate.
Being measured by electric-resistivity method has the network of open fault and short trouble in sample PCB, and removes sampler plate Test point capacitance and network capacitance in there are open fault or the test point capacitance and network capacitance of short trouble, so as to obtain Test point capacitance sample and network capacitance sample, ensure that the quality of test point capacitance sample and network capacitance sample, Jin Erke Improve the accuracy of PCB fault detects.
Foregoing circuit plate fault detection method, by the test point that circuit board under test is obtained using baseline network as reference electrode Capacitance, and network capacitance is obtained, and then realize to circuit board according to test point capacitance and network capacitance according to test point capacitance Fault detect, can realize the detection of the subtle failure to circuit board by way of detecting capacitance, and pass through capacitance method and electricity The detection mode that resistance method is combined further improves the precision of board failure detection.
In another embodiment, a kind of board failure detection device is also provided, as shown in figure 4, the device includes:Test Point capacitance module 110, network capacitance module 120 and Fisrt fault module 130.
Test point capacitance module 110, for obtaining the test point capacitance of circuit board under test using baseline network as reference electrode.
In the present embodiment, test point capacitance inspection is being carried out to one baseline network of every network settings of PCB to be measured in advance It surveys, using the baseline network of test point belonging network as reference electrode, capacitance detecting is carried out to the test point of circuit board under test, is obtained Test point capacitance.
Specifically, can capacitance detecting be carried out to the test point of PCB to be measured by flying probe tester, obtains test point capacitance.
Network capacitance module 120, for obtaining network capacitance according to test point capacitance.
After test point capacitance is obtained, network capacitance is obtained according to all test point capacitances of every network.Specifically, divide Other all test point capacitance averageds in every network, using obtained average value as the network capacitance of the network.
Fisrt fault module 130 for carrying out fault detect according to test point capacitance and network capacitance, generates Fisrt fault Detection information.
Different length, different area coverage different circuits and reference electrode between can generate a capacitance, when having When open circuit or short circuit occur, capacitance can also change, such as apart from network endpoint proximity, there are open faults When, the side capacitance variations of circuit length will be very small, and the capacitance variations that the short side of circuit generates are very big, therefore even if very Small open circuit can be also detected.In the present embodiment, after each test point capacitance and each network capacitance is obtained, you can according to survey Pilot capacitance and network capacitance carry out fault detect, obtain abnormal test point and network, and generate Fisrt fault detection information.
Specifically, Fisrt fault detection information can include abnormality test point identification and its capacitance, abnormal network and its Capacitance and fail result.Wherein, fail result refers to being diagnosed extremely as a result, such as including open circuit event Barrier, short trouble etc..
Foregoing circuit plate failure detector, by the test point that circuit board under test is obtained using baseline network as reference electrode Capacitance, and network capacitance is obtained, and then realize to circuit board according to test point capacitance and network capacitance according to test point capacitance Fault detect, can realize the detection of the subtle failure to circuit board by way of detecting capacitance, and then improve circuit board event Hinder the precision of detection.
In another embodiment, board failure detection device further includes:First open fault module and the first short circuit event Barrier module.
First open fault module for test point capacitance and test point capacitance sample to be compared, obtains abnormal survey Pilot;First open fault information is generated according to abnormality test point.
First short trouble module, for network capacitance and network capacitance sample to be compared, obtains abnormal network;Root The first short trouble information is generated according to abnormal network.
Further, Fisrt fault module 130 is additionally operable to according to the first open fault information and the first short trouble information Generate Fisrt fault detection information.
Specifically, the first open fault module is additionally operable to test point capacitance and test point capacitance sample being compared, obtain To the first deviation;When detecting that the first deviation is more than first threshold, the corresponding abnormality test point of the first deviation is obtained.
First short trouble module is additionally operable to network capacitance and network capacitance sample being compared, obtains the second deviation Value;When detecting that the second deviation is more than second threshold, the corresponding abnormal network of the second deviation is obtained.
In another embodiment, board failure detection device further includes:Second open fault module, the second short trouble Module and the second malfunctioning module.
Second open fault module, for obtaining the first network resistance of abnormality test point corresponding network;According to the first net Network resistance obtains the second open fault information.
Second short trouble module, for obtaining the second network resistor of abnormal network;It is obtained according to the second network resistor Second short trouble information.
Second malfunctioning module, for according to the second open fault information and the second short trouble information, generating the second failure Detection information.
In another embodiment, board failure detection device further includes sample module, for according to the second fault detect Information obtains non-abnormality test point and non-abnormal network;Test point capacitance sample is updated according to the test point capacitance of non-abnormality test point This, updates network capacitance sample according to the network capacitance of non-abnormal network.
In another embodiment, board failure detection device further includes baseline network module, for respectively with each projection Network obtains the network capacitance set of each network in sampler plate for reference electrode;In the network capacitance set for obtaining each network The corresponding projection network of maximum capacitor value, obtains the baseline network of each network
Further, sample module is additionally operable to maximum capacitor value in the network capacitance set for obtaining each network, obtains network Capacitance sample;The test point capacitance of sampler plate is obtained using baseline network as reference electrode, obtains test point capacitance sample.
In another embodiment, board failure detection device further includes third malfunctioning module, for obtaining sampler The third network resistor of plate all-network obtains third open fault information according to third network resistor and third short trouble is believed Breath.
Further, sample module is additionally operable to non-different according to third open fault information and third short trouble acquisition of information Maximum capacitor value in the network capacitance set of normal network, obtains network capacitance sample;Sample is obtained by reference electrode of baseline network The test point capacitance of this circuit board obtains the survey of sampler plate according to third open fault information and third short trouble information Non- abnormal test point capacitance sample in pilot capacitance.
Foregoing circuit plate failure detector, by the test point that circuit board under test is obtained using baseline network as reference electrode Capacitance, and network capacitance is obtained, and then realize to circuit board according to test point capacitance and network capacitance according to test point capacitance Fault detect, can realize the detection of the subtle failure to circuit board by way of detecting capacitance, and pass through capacitance method and electricity The detection mode that resistance method is combined further improves the precision of board failure detection.
In another embodiment, a kind of computer equipment is also provided, including memory, processor and is stored in memory Computer program that is upper and can running on a processor, processor realize the board failure of any one embodiment when performing program Detection method.
Specifically, computer equipment can be flying probe tester, and the electricity of any one embodiment is performed by flying probe tester Road plate fault detection method, flying probe tester can realize the detection of the subtle failure to circuit board using the mode of capacitance detecting, And the detection mode being combined by capacitance method and electric-resistivity method further improves flying probe tester and board failure is detected Precision.
In another embodiment, a kind of computer readable storage medium is also provided, is stored thereon with computer program, it is special Sign is, the board failure detection method of any one embodiment is realized when which is executed by processor.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (10)

1. a kind of board failure detection method, which is characterized in that including:
The test point capacitance of circuit board under test is obtained using baseline network as reference electrode;
Network capacitance is obtained according to the test point capacitance;
Fault detect is carried out according to the test point capacitance and the network capacitance, generates Fisrt fault detection information.
2. board failure detection method according to claim 1, which is characterized in that described according to the test point capacitance The step of carrying out fault detect with the network capacitance, generate Fisrt fault detection information, including:
The test point capacitance and test point capacitance sample are compared, obtain abnormality test point;
First open fault information is generated according to the abnormality test point;
The network capacitance and network capacitance sample are compared, obtain abnormal network;
First short trouble information is generated according to the abnormal network;
According to the first open fault information and the first short trouble information generation Fisrt fault detection information.
3. board failure detection method according to claim 2, which is characterized in that it is described by the test point capacitance with Test point capacitance sample is compared, the step of obtaining abnormality test point, including:
The test point capacitance and test point capacitance sample are compared, obtain the first deviation;
When detecting that first deviation is more than first threshold, the corresponding abnormality test point of first deviation is obtained.
4. board failure detection method according to claim 2, which is characterized in that described by the network capacitance and net The step of network capacitance sample is compared, obtains abnormal network, including:
The network capacitance and network capacitance sample are compared, obtain the second deviation;
When detecting that second deviation is more than second threshold, the corresponding abnormal network of second deviation is obtained.
5. board failure detection method according to claim 2, which is characterized in that described according to the described first open circuit event After the step of hindering information and the first short trouble information generation Fisrt fault detection information, further include:
Obtain the first network resistance of the abnormality test point corresponding network;
Second open fault information is obtained according to the first network resistance;
Obtain the second network resistor of the abnormal network;
Second short trouble information is obtained according to second network resistor;
According to the second open fault information and the second short trouble information, the second fault detection information is generated.
6. board failure detection method according to claim 5, which is characterized in that described according to the described second open circuit event After the step of hindering information and the second short trouble information, generating the second fault detection information, further include:
Non- abnormality test point and non-abnormal network are obtained according to second fault detection information;
The test point capacitance sample is updated according to the test point capacitance of the non-abnormality test point, according to the non-abnormal network Network capacitance update the network capacitance sample.
7. board failure detection method according to claim 1, which is characterized in that described using baseline network as with reference to electricity Before pole obtains the step of test point capacitance of circuit board under test, further include:
The network capacitance set of each network in sampler plate is obtained using each projection network as reference electrode respectively;
The corresponding projection network of maximum capacitor value in the network capacitance set of each network is obtained, obtains the reference net of each network Network.
8. a kind of board failure detection device, which is characterized in that including:
Test point capacitance module, for obtaining the test point capacitance of circuit board under test using baseline network as reference electrode;
Network capacitance module, for obtaining network capacitance according to the test point capacitance;
Fisrt fault module, for carrying out fault detect, the first event of generation according to the test point capacitance and the network capacitance Hinder detection information.
9. a kind of computer equipment, can run on a memory and on a processor including memory, processor and storage Computer program, which is characterized in that processor realizes the inspection of claim 1-7 any one of them board failure when performing program Survey method.
10. a kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the program is by processor Claim 1-7 any one of them board failure detection methods are realized during execution.
CN201711488840.7A 2017-12-29 2017-12-29 Circuit board fault detection method and device, computer equipment and storage medium Active CN108169664B (en)

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Application Number Priority Date Filing Date Title
CN201711488840.7A CN108169664B (en) 2017-12-29 2017-12-29 Circuit board fault detection method and device, computer equipment and storage medium

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109696616A (en) * 2019-01-30 2019-04-30 大族激光科技产业集团股份有限公司 The test method and device of flying probe tester

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402072A (en) * 1992-02-28 1995-03-28 International Business Machines Corporation System and method for testing and fault isolation of high density passive boards and substrates
CN1378088A (en) * 2001-02-19 2002-11-06 日本电产丽德株式会社 Circuit board detection equipment and circuit board detection method
CN1769916A (en) * 2004-11-02 2006-05-10 安捷伦科技有限公司 Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections
CN101135713A (en) * 2006-09-01 2008-03-05 黄桃 PCB non-contact type test method and apparatus
CN101198879A (en) * 2005-06-17 2008-06-11 Atg测试系统股份有限公司 Method of testing unloaded, large-area printed circuit boards with a finger tester
CN101799507A (en) * 2009-02-10 2010-08-11 迈克珂来富株式会社 Printed circuit board testing device and testing method
CN103063922A (en) * 2012-11-22 2013-04-24 中国电子科技集团公司第四十五研究所 Resistor-capacitor measurement module applied to flying probe tests
CN104820177A (en) * 2015-04-09 2015-08-05 中国电子科技集团公司第四十五研究所 Probe switching control system for flying probe test and method thereof
CN105425094A (en) * 2015-11-24 2016-03-23 深圳怡化电脑股份有限公司 Short-circuit point detection method and apparatus of PCBA
CN205263218U (en) * 2015-12-31 2016-05-25 珠海市芬诺科技有限公司 Ann's rule tester with open short circuit testing capabilities

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402072A (en) * 1992-02-28 1995-03-28 International Business Machines Corporation System and method for testing and fault isolation of high density passive boards and substrates
CN1378088A (en) * 2001-02-19 2002-11-06 日本电产丽德株式会社 Circuit board detection equipment and circuit board detection method
CN1769916A (en) * 2004-11-02 2006-05-10 安捷伦科技有限公司 Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections
CN101198879A (en) * 2005-06-17 2008-06-11 Atg测试系统股份有限公司 Method of testing unloaded, large-area printed circuit boards with a finger tester
CN101135713A (en) * 2006-09-01 2008-03-05 黄桃 PCB non-contact type test method and apparatus
CN101799507A (en) * 2009-02-10 2010-08-11 迈克珂来富株式会社 Printed circuit board testing device and testing method
CN103063922A (en) * 2012-11-22 2013-04-24 中国电子科技集团公司第四十五研究所 Resistor-capacitor measurement module applied to flying probe tests
CN104820177A (en) * 2015-04-09 2015-08-05 中国电子科技集团公司第四十五研究所 Probe switching control system for flying probe test and method thereof
CN105425094A (en) * 2015-11-24 2016-03-23 深圳怡化电脑股份有限公司 Short-circuit point detection method and apparatus of PCBA
CN205263218U (en) * 2015-12-31 2016-05-25 珠海市芬诺科技有限公司 Ann's rule tester with open short circuit testing capabilities

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109696616A (en) * 2019-01-30 2019-04-30 大族激光科技产业集团股份有限公司 The test method and device of flying probe tester

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