CN109696616A - The test method and device of flying probe tester - Google Patents
The test method and device of flying probe tester Download PDFInfo
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- CN109696616A CN109696616A CN201910101772.7A CN201910101772A CN109696616A CN 109696616 A CN109696616 A CN 109696616A CN 201910101772 A CN201910101772 A CN 201910101772A CN 109696616 A CN109696616 A CN 109696616A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- Microelectronics & Electronic Packaging (AREA)
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- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The embodiment of the invention discloses a kind of test method of flying probe tester and devices, this method comprises: carrying out flying probe to test sample plate based on flying probe tester, the sample resistance value of every group of test point in the test sample plate is obtained according to test result；Deviation setting is carried out according to the sample resistance value, range is determined with the resistance value of every group of test point of determination；The sample resistance value and resistance value are determined that range is added in circuit board data file, flying probe is carried out to circuit board under test according to the circuit board data file；Defect present in the circuit board under test is selected, test result report is generated.By the above method, the measuring accuracy to circuit board can be improved, and can accurately test out the defect of low resistance route with the specific resistance value of precise measurement circuit board test point.
Description
Technical field
The present invention relates to printed circuit board the field of test technology more particularly to the test methods and dress of a kind of flying probe tester
It sets.
Background technique
Flying probe tester is to arrange that high density, the number of plies is more, wiring density is big, measuring point is apart from small PCB for element
A kind of instrument that (Printed Circuit Board, printed circuit board) is tested.Multiaxis flying probe tester is complete by four
Independent mobile test needle composition, under software control in detected PCB two sides (positive 2 testing needles, reverse side 2 tests
Needle) it carries out three-dimensional motion and touches tested point and obtain different tests by applying certain voltage, electric current to testing needle
Signal, to judge the break-make situation of PCB to be measured.
With the rapid development of electronic technology, the production number of plies of PCB is higher and higher, line density is increasing, pad ruler
Very little to become small, the requirement to PCB is higher and higher.Under normal conditions, the open circuit in the parameter value of open-short circuit is carried out to PCB
Impedance is set as 20 Ω, when route resistance value be greater than 20 Ω when be judged as open circuit, less than 20 Ω when be judged as qualification, resistance value is less than
The route of 20 Ω then can not accurately test out its actual resistance, therefore 20 Ω route below becomes testing blind zone.In reality
Certain defects of PCB are found in production, such as having no copper in the holes, the problems such as cavity, copper is thin, line is young, route notch influence whether line
Roadlock value, when resistance value is less than 20 Ω, when testing disadvantages described above plate with common open short circuit test method, test result is shown
Pass through, but resistance value changes after being actually passed through high-temperature soldering, open circuit problem is caused to occur, therefore conventional test method can not
Detection high precision plates are opened, are short-circuit.
Summary of the invention
The embodiment of the present invention provides the test method and device of a kind of flying probe tester, can promote the test to circuit board
Precision can accurately test out the defect of low resistance route.
A kind of test method of flying probe tester, comprising:
Flying probe is carried out to test sample plate based on flying probe tester, the test sample plate is obtained according to test result
In every group of test point sample resistance value；
Deviation setting is carried out according to the sample resistance value, range is determined with the resistance value of every group of test point of determination；
The sample resistance value and resistance value are determined that range is added in circuit board data file, according to the circuit board number
Flying probe is carried out to circuit board under test according to file；
Defect present in the circuit board under test is selected, test result report is generated.
Optionally, flying needle survey is carried out to test sample plate based on flying probe tester described in one of the embodiments,
Examination, obtains in the test sample plate before the sample resistance value of every group of test point according to test result, further includes:
Reading circuit plate data file extracts the data information in the circuit board data file, and according to the data
Information establishes test data file；The data information includes through-hole information, pad information, neighbouring network information, soldermask layer letter
At least one of breath, line information, tooling hole information, reference bore information and typesetting command information.
It is optionally, described in one of the embodiments, that flying probe is carried out to test sample plate based on flying probe tester,
The sample resistance value of every group of test point in the test sample plate is obtained according to test result, comprising:
Test sample plate is tested according to the test data file, record test result and is saved to test record
In file；The test record file includes at least one of network number, test point serial number, testing needle number and resistance value；
The sample resistance value of every group of test point is calculated according to the data recorded in the test record file.
Optionally, the quantity of the test sample plate is at least three in one of the embodiments, each test sample
Plate is corresponding to generate a test record file；
The sample resistance value that every group of test point is calculated according to the data recorded in the test record file, packet
It includes:
Data processing is merged at least three test record files, extracts every group of test point in different test record texts
Resistance value in part；
Calculate sample resistance value of the average value as the test point of the resistance value.
Optionally, described in one of the embodiments, that deviation setting is carried out according to the sample resistance value, it is every to determine
The resistance value of group test point determines range, comprising:
First deviation threshold is arranged to the sample resistance value lower than preset resistive value, to the sample resistance value for being higher than preset resistive value
Second deviation threshold is set；
Based on first deviation threshold and the second deviation threshold, the upper limit value of the sample resistance value of each test point is calculated
And lower limit value.
Optionally, described in one of the embodiments, that the sample resistance value and resistance value are determined that range is added to electricity
In the plate data file of road, flying probe is carried out to circuit board under test according to the circuit board data file, comprising:
Determine that resistance information is buried in range setting according to the sample resistance value and resistance value, by the resistance information of burying according to circuit board
The format standard of data file is added in circuit board data file；
It reads with the circuit board data file for burying resistance information, according to preset order to every group of test point of circuit board under test
Carry out flying probe.
Optionally, in one of the embodiments, the method also includes:
When the resistance value for measuring test point, which is in resistance value, to be determined except range, judge whether testing needle is located on pad；
If it is not, it is mobile according to preset path then to control the testing needle, until determining that the testing needle is located on pad.
A kind of test device of flying probe tester, comprising:
Test sample module, for carrying out flying probe to test sample plate based on flying probe tester, according to test result
Obtain the sample resistance value of every group of test point in the test sample plate；
Deviation setting module, for carrying out deviation setting according to the sample resistance value, with the resistance of every group of test point of determination
Value determines range；
Flying probe module, for the sample resistance value and resistance value to be determined that range is added to circuit board data file
In, flying probe is carried out to circuit board under test according to the circuit board data file；
Result-generation module generates test result report for selecting defect present in the circuit board under test.
A kind of terminal, including memory and processor store computer program, the computer journey in the memory
When sequence is executed by the processor, so that the step of processor executes the above method.
A kind of computer readable storage medium, is stored thereon with computer program, and the computer program is held by processor
The step of above method is realized when row.
Implement the embodiment of the present invention, will have the following beneficial effects:
The test method and device of above-mentioned flying probe tester carry out flying needle survey to test sample plate by flying probe tester
Examination, the sample resistance value of every group of test point in the test sample plate is obtained according to test result, according to the sample resistance value
Deviation setting is carried out, range is determined with the resistance value of every group of test point of determination, the sample resistance value and resistance value are determined that range adds
It adds in circuit board data file, flying probe is carried out to circuit board under test according to the circuit board data file, selects institute
Defect present in circuit board under test is stated, test result report is generated.It, can be with precise measurement circuit board testing by the above method
The specific resistance value of point, improves the measuring accuracy to circuit board, and can accurately test out the defect of low resistance route.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Wherein:
Fig. 1 is the application environment schematic diagram of the test method of flying probe tester in one embodiment；
Fig. 2 is the flow chart of the test method of flying probe tester in one embodiment；
Fig. 3 is the flow chart of the test method of flying probe tester in another embodiment；
Fig. 4 is the flow chart of the test method of flying probe tester in another embodiment；
Fig. 5 is the flow chart of the test method of flying probe tester in another embodiment；
Fig. 6 is the structural block diagram of the test device of flying probe tester in one embodiment；
Fig. 7 is the test record file schematic diagram in one embodiment；
Fig. 8 is the circuit board data file schematic diagram that band buries resistance information in one embodiment；
Fig. 9 is the csv file schematic diagram in one embodiment.
Specific embodiment
It is with reference to the accompanying drawings and embodiments, right in order to which the objects, technical solutions and advantages of the application are more clearly understood
The application is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the application, and
It is not used in restriction the application.
Unless otherwise defined, all technical and scientific terms used herein and the technical field for belonging to the application
The normally understood meaning of technical staff is identical.The term used in the description of the present application is intended merely to description tool herein
The purpose of the embodiment of body, it is not intended that limitation the application.It is appreciated that term " first " used in this application, " second "
Etc. can be used to describe various elements herein, but these elements should not be limited by these terms.These terms are only used to by first
A element and another element are distinguished.For example, in the case where not departing from scope of the present application, first element can be claimed
For second element, and similarly, second element can be known as first element.First element and second element both first device
Part, but it is not same component.
Fig. 1 is the application environment schematic diagram of the test method of flying probe tester in one embodiment, and flying probe tester includes
Multiple groups testing needle, every group of testing needle one group of test point of corresponding test, i.e. corresponding two testing needles of a test point.Flying probe tester
A testing needle when carrying out flying probe in every group of testing needle applies electric current by current source, another testing needle passes through electricity
Pressure meter forms voltage determination circuit, and two groups of testing needles form two groups of circuits.Optionally, the probe of flying probe tester can be selected
Low-resistance testing needle specifically includes blade type low-resistance testing needle, needle-like low-resistance testing needle etc., can accurately be measured by low-resistance testing needle
The resistance value of low-resistance route.
Optionally, the test method of the flying probe tester can be also used for the open circuit/short circuit of measurement circuit, can specifically pass through
It connects the two lines of linking probe are short out, realizes and the open circuit/short circuit of route is tested.The survey of the flying probe tester of the embodiment of the present application
Method for testing can be accurate to Ω grades of m for the open test of low-resistance route, greatly improve the measuring accuracy to circuit board.
Fig. 2 is the flow chart of the test method of flying probe tester in one embodiment.Flying probe tester in the present embodiment
Test method, be described for running on application environment as shown in Figure 1, the test method of the flying probe tester can
To promote the measuring accuracy to circuit board, the defect of low resistance route can be accurately tested out.As shown in Fig. 2, the flying probe
The test method of machine includes the following steps 202~step 208:
Step 202: flying probe being carried out to test sample plate based on flying probe tester, the sample is obtained according to test result
The sample resistance value of every group of test point in this test board.
Wherein, test sample plate refers to having already passed through the determining normal circuit plate of test, that is to say do not have defective electricity
Road plate, test sample plate and circuit board under test belong to same class circuit board, more specifically, test sample plate and circuit board under test category
In with a batch of circuit board.It is understood that test sample plate and circuit board under test are all PCB.Sample resistance value can be with
The normal resistance values of every group of test point are interpreted as, that is to say when circuit board under test is in normal condition, the resistance in route or hole
Value.
By carrying out flying probe to test sample plate, the sample of every group of test point in the available test sample plate
Resistance value can provide reference standard for subsequent circuit board under test, promote the measuring accuracy to circuit board.
Step 204: deviation setting being carried out according to the sample resistance value, model is determined with the resistance value of every group of test point of determination
It encloses.
Specifically, the machine error and the measurement error in test process that consider circuit board making process, by sample
This resistance value carries out deviation setting, determines range with the resistance value of every group of test point of determination.It optionally, can be according to different samples
Resistance value carries out deviation setting, and when sample resistance value is higher, deviation setting is smaller, the deviation setting when sample resistance value is lower
It is bigger.
Step 206: the sample resistance value and resistance value being determined that range is added in circuit board data file, according to described
Circuit board data file carries out flying probe to circuit board under test.
Circuit board data file (IPC file) refers to a kind of prepared specific format of American Printed Circuit Society, uses
In the data file of description bottom circuit board bare board testing data format by reading circuit plate data file can be flying needle
The test process of test machine provides data information.
Specifically, can determine that resistance information is buried in range setting according to sample resistance value and resistance value, by it is described bury resistance information by
It is added in circuit board data file, is read with the circuit board data for burying resistance information according to the format standard of circuit board data file
File carries out flying probe according to every group test point of the preset order to circuit board under test.
Step 208: selecting defect present in the circuit board under test, generate test result report.
The defect of circuit board under test includes that hole is inclined, hole is thin, hole is broken, pin hole notch etc., winged by carrying out to circuit board under test
Needle tests the quality that can detecte hole on circuit board under test, if the resistance value measured does not determine to be determined in range in resistance value
For bad hole, belong to the state of existing defects.Any lack can be belonged to by the way that current PC B is further done slicing experiment and determined
It falls into.
Further, test result report is generated according to all test results, such as all test results can be protected
There are in csv (Comma-Separated Values, comma separated value) file.
The test method of above-mentioned flying probe tester carries out flying probe to test sample plate by flying probe tester, according to
Test result obtains the sample resistance value of every group of test point in the test sample plate, carries out deviation according to the sample resistance value
Setting determines range with the resistance value of every group of test point of determination, and the sample resistance value and resistance value are determined that range is added to circuit
In plate data file, flying probe is carried out to circuit board under test according to the circuit board data file, selects the electricity to be measured
Defect present in the plate of road generates test result report.It, can be with the specific of precise measurement circuit board test point by the above method
Resistance value improves the measuring accuracy to circuit board, and can accurately test out the defect of low resistance route, can measure common
Test can not measure crack, micro- short, extreme cases such as hole is thin, hole is broken of route.
In one embodiment, before step 202, further includes: reading circuit plate data file extracts the circuit board
Data information in data file, and test data file is established according to the data information.
Specifically, circuit board data file is by CAM (Computer Aided Manufacturing, area of computer aided system
Make) software passes through the gerber file generated for reading in PCB, and is read by flying probe tester software, passes through document analysis, extract electricity
All data informations in the plate data file of road, the data information include but are not limited to through-hole information, pad information, adjacent networks
Information, soldermask layer information, line information, tooling hole information, reference bore information and typesetting command information etc..Further, according to
The data information establishes test data file, and test data file is used to provide data ginseng for the flying probe of test sample plate
It examines.
As shown in figure 3, in one embodiment, it is described that flying probe is carried out to test sample plate based on flying probe tester,
The sample resistance value of every group of test point is obtained in the test sample plate according to test result namely step 202 includes:
Step 302: test sample plate being tested according to the test data file, test result is recorded and saves extremely
In test record file.
Specifically, carry out flying probe to test sample plate according to test data file, the quantity of test sample plate can be with
It to be multiple, and is the circuit board of identical item number, guarantee sample data by the way that the quantity of multiple test sample plates is arranged can
By property.The test result of every test sample plate is recorded, and is saved into test record file.As shown in fig.7, being
Test record file schematic diagram in one embodiment, the data recorded in test record file may include network number, test
Point serial number, testing needle number and resistance value etc., test record file refer to flying probe tester after carrying out flying probe, generation
For recording test result file.
Step 304: the sample resistance of every group of test point is calculated according to the data recorded in the test record file
Value.
Specifically, the quantity of test sample plate is at least three, each test sample plate is corresponding to generate a test record
File.Data processing is merged at least three test record files, extracts every group of test point in different test record files
In resistance value, calculate sample resistance value of the average value as the test point of the resistance value.
Consider the measurement error during flying probe, the resistance value in multiple test record files is averaged
Value, it is ensured that the sample resistance value error of every group of test point is smaller, more tends to true value.
In one embodiment, described that deviation setting is carried out according to the sample resistance value, with every group of test point of determination
Resistance value determines range namely step 204 includes: that the first deviation threshold is arranged to the sample resistance value lower than preset resistive value, to height
In the sample resistance value of preset resistive value, the second deviation threshold is set；Based on first deviation threshold and the second deviation threshold, meter
Calculate the upper limit value and lower limit value of the sample resistance value of each test point.
For example, carry out deviation setting according to the sample resistance value of every group of test point, when sample resistance value be 5m Ω with
5% deviation was set when upper, 10% deviation is set when sample resistance value is 5m Ω or less, then calculates the sample of every group of test point
The upper limit value and lower limit value of this resistance value determine the resistance value of test point combination according to the upper limit value of sample resistance value and lower limit value
Determine range, wherein set of test spots is combined into the combination between two points.
The test method of flying probe tester provided in this embodiment can test out Ω grades of m of low-resistance, and can be accurate
Specific resistance value is measured, so that crack, micro- short, extreme cases such as hole is thin, hole is broken of route can not be measured by measuring common test.
As shown in figure 4, in one embodiment, the sample resistance value and resistance value are determined that range is added to circuit board number
According in file, flying probe is carried out to circuit board under test according to the circuit board data file namely step 206 includes following step
Rapid 402~step 404:
Step 402: determine that resistance information is buried in range setting according to the sample resistance value and resistance value, by it is described bury resistance information by
It is added in circuit board data file according to the format standard of circuit board data file.
Wherein, a series of resistance information representation test datas of circuit board under test are buried, flying probe tester buries resistance by reading
The test data of available circuit board under test after information, to realize the accurate test to circuit board under test.Specifically, by multiple
Data after test record File merging treatment are added in original circuit board data file, i.e., by these data to bury
The form of resistance information is added to circuit board data file.
For example, 3 test record Files and circuit board data are read by micro- resistance data processing software simultaneously
Then file carries out data processing, will bury resistance information and be added to initial circuit according to the format standard of circuit board data file
In plate data file, resistance information progress flying probe is buried so that flying probe tester is directly read.As shown in fig.8, being a reality
The circuit board data file schematic diagram that band in example buries resistance information is applied, the data format for burying resistance information can be to start three characters
For " 370 ", " 070 " start, be followed by network number, the coordinate of two measuring points, sample resistance value, resistance upper limit value, lower resistance limit value with
And resistance number etc..
Step 404: reading with the circuit board data file for burying resistance information, according to preset order to the every of circuit board under test
Group test point carries out flying probe.
Further, flying probe is carried out to circuit board under test, reads with the circuit board data file for burying resistance information, leads to
Resistance information is buried in extraction after crossing document analysis, is tested according to the test point combination of pre-sorting.
The test method of flying probe tester provided in this embodiment, can be with the specific resistance of precise measurement circuit board test point
Value, improves the measuring accuracy to circuit board, and can accurately test out the defect of low resistance route.
As shown in figure 5, in one embodiment, the test method of the flying probe tester further comprising the steps of 502~step
Rapid 504:
Step 502: when the resistance value for measuring test point, which is in resistance value, to be determined except range, judging whether testing needle is located at
On pad；If it is not, thening follow the steps 504.
During the test, determine except range if the resistance value for measuring test point combination is in resistance value, namely have exceeded
When the range of upper limit value and lower limit resistance value, need to carry out self-test to testing needle at this time, check each testing needle syringe needle whether
It pricks on pad, the displacement error due to testing needle is avoided to cause measurement error.
Step 504: it is mobile according to preset path to control the testing needle, until determining that the testing needle is located on pad.
If it is detected that there are testing needles not to prick on pad, testing needle is controlled according to preset path automatic shift, directly
It is located on pad to the determining testing needle.For example, testing needle is centered on current location, with the distance of every step 5um, to upper left side
To under pricking 4, initial position is returned to, under pricking 4 to upper right, returns initial position, direction is pricked under 4 to left down, has been returned
Beginning position, to the right under pricking 4, meeting self-test is primary after bundle is lower every time, until self-test success.
Optionally, syringe needle, i.e. a syringe needle are tested using four lines when carrying out flying probe due to flying probe tester
Upper there are two blades, by, either with or without electric current, having electric current to indicate that syringe needle bundle is welding between electrical measurement self-test, namely two blades of detection
On disk, indicate that syringe needle is not pricked on pad without electric current.
Optionally, in other embodiments, if repetition measurement discovery testing needle is still without pricking in pad after syringe needle automatic shift
On, then CCD (Charge-coupled Device, charge coupled cell) positioning is carried out to the test point, then repetition measurement.
There is a CCD in the top of each testing needle of flying probe tester, and the distance between the center CCD and testing needle are
Correction precisely, when testing needle displacement repetition measurement cannot be self-detected by when, the center of CCD is directed at pad by moving CCD manually
Center, can converse testing needle to pad accurate coordinate, with ensure testing needle syringe needle prick on pad.If testing syringe needle
Self-test is normal, but the actual resistance measured still has exceeded bound Standard resistance range, then illustrates the route or hole existing defects,
And all test results are stored in csv file, the defect in hole includes cavity in hole, copper is thin, hole is broken, pin hole etc..
As shown in fig.9, for the csv file schematic diagram in one embodiment, csv file record resistance title, test
Point serial number, upper limit value, lower limit value, actual value and test result etc..If the actual resistance tested out is in upper limit value and lower limit value range
Interior, then test result is to pass through, if the actual resistance tested out is not within the scope of upper limit value and lower limit value, it is determined that it is bad hole, it can
To do slicing experiment to current PCB with the specific defect type of determination.
The test method of above-mentioned flying probe tester carries out flying probe to test sample plate by flying probe tester, according to
Test result obtains the sample resistance value of every group of test point in the test sample plate, carries out deviation according to the sample resistance value
Setting determines range with the resistance value of every group of test point of determination, and the sample resistance value and resistance value are determined that range is added to circuit
In plate data file, flying probe is carried out to circuit board under test according to the circuit board data file, selects the electricity to be measured
Defect present in the plate of road generates test result report.It, can be with the specific of precise measurement circuit board test point by the above method
Resistance value improves the measuring accuracy to circuit board, and can accurately test out the defect of low resistance route.
It should be understood that although each step in above-mentioned Fig. 2-5 is successively shown according to the instruction of arrow, these
Step is not that the inevitable sequence according to arrow instruction successively executes.Unless expressly stating otherwise herein, these steps are held
There is no stringent sequences to limit for row, these steps can execute in other order.Moreover, at least part in Fig. 2-5
Step may include that perhaps these sub-steps of multiple stages or stage are executed in synchronization to multiple sub-steps
It completes, but can execute at different times, the execution sequence in these sub-steps or stage, which is also not necessarily, successively to be carried out,
But it can be executed in turn or alternately at least part of the sub-step or stage of other steps or other steps.
As shown in fig. 6, in one embodiment, providing a kind of test device of flying probe tester, which includes sample
This test module 610, deviation setting module 620, flying probe module 630 and result-generation module 640.
Test sample module 610 is tied for carrying out flying probe to test sample plate based on flying probe tester according to test
Fruit obtains the sample resistance value of every group of test point in the test sample plate.
Deviation setting module 620, for carrying out deviation setting according to the sample resistance value, with every group of test point of determination
Resistance value determines range.
Flying probe module 630, for the sample resistance value and resistance value to be determined that range is added to circuit board data text
In part, flying probe is carried out to circuit board under test according to the circuit board data file.
Result-generation module 640 generates test result report for selecting defect present in the circuit board under test
It accuses.
The test device of above-mentioned flying probe tester can be improved pair with the specific resistance value of precise measurement circuit board test point
The measuring accuracy of circuit board, and can accurately test out the defect of low resistance route.
The specific of test device about flying probe tester limits the test that may refer to above for flying probe tester
The restriction of method, details are not described herein.Modules in the test device of above-mentioned flying probe tester can be fully or partially through
Software, hardware and combinations thereof are realized.Above-mentioned each module can be embedded in the form of hardware or independently of the place in computer equipment
It manages in device, can also be stored in a software form in the memory in computer equipment, in order to which processor calls execution or more
The corresponding operation of modules.
The realization of modules in the test device of the flying probe tester provided in the embodiment of the present application can be computer
The form of program.The computer program can be run in terminal or server.The program module that the computer program is constituted can deposit
Storage is on the memory of terminal or server.When the computer program is executed by processor, realizes and retouched in the embodiment of the present application
The step of test method for the flying probe tester stated.
The embodiment of the present application also provides a kind of terminal, which includes memory and processor, is stored in memory
Computer program, when which is executed by processor, so that the processor is executed as retouched in the various embodiments described above
The test method for the flying probe tester stated.
The embodiment of the present application also provides a kind of computer readable storage mediums.One or more is executable comprising computer
The non-volatile computer readable storage medium storing program for executing of instruction, when the computer executable instructions are executed by one or more processors
When, so that the processor executes the test method of the flying probe tester as described in the various embodiments described above.
The embodiment of the present application also provides a kind of computer program products.A kind of computer program product comprising instruction,
When run on a computer, so that computer executes the test side of flying probe tester described in the various embodiments described above
Method.
In the above-described embodiments, can it is all or part of by software, hardware, firmware or any combination thereof come real
It is existing.When being realized using software program, can entirely or partly realize in the form of a computer program product.The computer
Program product includes one or more computer instructions.When loading on computers and executing the computer program instructions, entirely
Portion is partly generated according to process or function described in the embodiment of the present invention.The computer can be general purpose computer, specially
With computer, computer network or other programmable devices.The computer instruction can store in computer-readable storage
In medium, or from a computer readable storage medium to another computer readable storage medium transmit.The computer
Readable storage medium storing program for executing can be any usable medium or include one or more usable medium collection that computer can access
At the data storage devices such as server, data center.The usable medium can be magnetic medium, (for example, floppy disk, hard disk,
Tape), optical medium (for example, DVD) or semiconductor medium (such as solid state hard disk Solid State Disk (SSD)) etc..
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, therefore equivalent changes made in accordance with the claims of the present invention, is still within the scope of the present invention.
Claims (10)
1. a kind of test method of flying probe tester characterized by comprising
Flying probe is carried out to test sample plate based on flying probe tester, is obtained according to test result every in the test sample plate
The sample resistance value of group test point；
Deviation setting is carried out according to the sample resistance value, range is determined with the resistance value of every group of test point of determination；
The sample resistance value and resistance value are determined that range is added in circuit board data file, according to the circuit board data text
Part carries out flying probe to circuit board under test；
Defect present in the circuit board under test is selected, test result report is generated.
2. the method according to claim 1, wherein being carried out based on flying probe tester to test sample plate described
Flying probe obtains in the test sample plate before the sample resistance value of every group of test point according to test result, further includes:
Reading circuit plate data file extracts the data information in the circuit board data file, and according to the data information
Establish test data file；The data information includes through-hole information, pad information, neighbouring network information, soldermask layer information, line
At least one of road information, tooling hole information, reference bore information and typesetting command information.
3. according to the method described in claim 2, it is characterized in that, it is described based on flying probe tester test sample plate is carried out it is winged
Needle test, the sample resistance value of every group of test point in the test sample plate is obtained according to test result, comprising:
Test sample plate is tested according to the test data file, record test result and is saved to test record file
In；The test record file includes at least one of network number, test point serial number, testing needle number and resistance value；
The sample resistance value of every group of test point is calculated according to the data recorded in the test record file.
4. according to the method described in claim 3, it is characterized in that, the quantity of the test sample plate is at least three, each
Test sample plate is corresponding to generate a test record file；
The sample resistance value that every group of test point is calculated according to the data recorded in the test record file, comprising:
Data processing is merged at least three test record files, extracts every group of test point in different test record files
Resistance value；
Calculate sample resistance value of the average value as the test point of the resistance value.
5. the method according to claim 1, wherein it is described according to the sample resistance value carry out deviation setting,
Range is determined with the resistance value of every group of test point of determination, comprising:
First deviation threshold is arranged to the sample resistance value lower than preset resistive value, the sample resistance value for being higher than preset resistive value is arranged
Second deviation threshold；
Based on first deviation threshold and the second deviation threshold, the upper limit value of the sample resistance value of each test point is calculated under
Limit value.
6. the method according to claim 1, wherein described determine that range adds for the sample resistance value and resistance value
It adds in circuit board data file, flying probe is carried out to circuit board under test according to the circuit board data file, comprising:
Determine that resistance information is buried in range setting according to the sample resistance value and resistance value, by the resistance information of burying according to circuit board data
The format standard of file is added in circuit board data file；
It reads with the circuit board data file for burying resistance information, is carried out according to every group test point of the preset order to circuit board under test
Flying probe.
7. according to the method described in claim 6, it is characterized in that, the method also includes:
When the resistance value for measuring test point, which is in resistance value, to be determined except range, judge whether testing needle is located on pad；
If it is not, it is mobile according to preset path then to control the testing needle, until determining that the testing needle is located on pad.
8. a kind of test device of flying probe tester characterized by comprising
Test sample module is obtained for carrying out flying probe to test sample plate based on flying probe tester according to test result
The sample resistance value of every group of test point in the test sample plate；
Deviation setting module is sentenced for carrying out deviation setting according to the sample resistance value with the resistance value of every group of test point of determination
Determine range；
Flying probe module, for the sample resistance value and resistance value to be determined that range is added in circuit board data file, root
Flying probe is carried out to circuit board under test according to the circuit board data file；
Result-generation module generates test result report for selecting defect present in the circuit board under test.
9. a kind of terminal, which is characterized in that including memory and processor, computer program, institute are stored in the memory
When stating computer program and being executed by the processor, so that the processor is executed as described in any one of claims 1 to 7
The step of method.
10. a kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the computer program
The step of method as described in any one of claims 1 to 7 is realized when being executed by processor.
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| CN201910101772.7A CN109696616A (en) | 2019-01-30 | 2019-01-30 | The test method and device of flying probe tester |
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| CN201910101772.7A CN109696616A (en) | 2019-01-30 | 2019-01-30 | The test method and device of flying probe tester |
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| CN113567828A (en) * | 2021-06-15 | 2021-10-29 | 中国电子科技集团公司第十三研究所 | Nondestructive failure detection method for multilayer low-temperature co-fired ceramic substrate |
| CN114236197A (en) * | 2021-12-21 | 2022-03-25 | 深圳市阳晶电子科技有限公司 | Mobile probe type testing machine and testing method thereof |
| CN115902405A (en) * | 2022-07-20 | 2023-04-04 | 欣强电子（清远）有限公司 | Impedance testing method, device and system applied to PCB |
| CN116755002A (en) * | 2023-08-14 | 2023-09-15 | 上海季丰电子股份有限公司 | Connector welding state testing method and device and electronic equipment |
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