CN210808126U - Pressure detection device for suction nozzle of chip mounter - Google Patents
Pressure detection device for suction nozzle of chip mounter Download PDFInfo
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- CN210808126U CN210808126U CN201921454005.6U CN201921454005U CN210808126U CN 210808126 U CN210808126 U CN 210808126U CN 201921454005 U CN201921454005 U CN 201921454005U CN 210808126 U CN210808126 U CN 210808126U
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- pressure
- suction nozzle
- chip mounter
- detection device
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Abstract
A pressure detection device for a suction nozzle of a chip mounter comprises a shell, a bearing plate, a pressure sensing module and a signal transmission module. Through detection device will detection device passes through two earlier detection device fixes through the fin on the SMT track, then uses respectively chip mounter's a plurality of the suction nozzle is in proper order paste dress components and parts on the loading board, each the suction nozzle is in paste dress components and parts's in-process action on the loading board the pressure of loading board all by pressure sensing module sensing to the realization detects the dress pressure of whole suction nozzle of whole chip mounter high-efficiently. In addition, the input end of the signal transmission module is electrically connected with the pressure sensing module, and the output end of the signal transmission module is used for being accessed by external equipment, so that the data sensed by the pressure sensing module can be transmitted to the external equipment, and the subsequent data processing and analysis can be conveniently carried out in the external equipment so as to comprehensively evaluate the setting parameters and the running state of the chip mounter.
Description
Technical Field
The utility model relates to a Surface Mounting Technology (SMT) technical field, concretely relates to chip mounter suction nozzle pressure measurement.
Background
The PCBA largely employs the advanced technology of surface mounting in manufacturing. At present, the problem of chip component breakage in the manufacturing process of PCBA often troubles the production of the PCBA. Since the breakage of the chip component is difficult to detect without relying on special methods and tools, the damage to the product quality is very great. The chip component is usually broken due to an excessive pressure applied to the component by a suction nozzle of the chip mounter, so that in the generation process, the pressure generated by the suction nozzle of the chip mounter needs to be monitored. Currently, the measure for solving this problem is to measure a single suction nozzle of the chip mounter by a sensor, so that a lot of time is consumed to complete the measurement of all the suction nozzles of the whole chip mounter, and therefore, the measurement efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that, to the above-mentioned problem that exists among the prior art, provide a chip mounter suction nozzle pressure measurement, it can detect to the subsides dress pressure of whole chip mounter's whole suction nozzle high-efficiently to setting parameter and running state for assessing the chip mounter comprehensively provide basic data high-efficiently.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a chip mounter suction nozzle pressure detection device, the chip mounter the suction nozzle is used for pasting the components and parts to the PCBA board of SMT track centre gripping, detection device includes: the shell is provided with an upper panel, the middle part of the upper panel is provided with a through hole, and two opposite sides of the upper panel are respectively provided with a fin for clamping the SMT track; the bearing plate is positioned in the through hole, and the upper surface of the bearing plate is provided with a plurality of mounting areas for the suction nozzles to mount the components; the pressure sensing module is arranged on the lower side of the bearing plate and used for sensing the pressure born by the bearing plate; and the signal transmission module is arranged in the shell, the input end of the signal transmission module is electrically connected with the pressure sensing module, and the output end of the signal transmission module is used for being accessed by external equipment.
Through adopting chip mounter suction nozzle pressure detection device among the above-mentioned technical scheme, will detection device passes through two the fin is fixed on the SMT track, then use respectively a plurality of chip mounter the suction nozzle is in proper order paste dress components and parts on the loading board, each the suction nozzle is in paste dress components and parts's in-process on the loading board and act on the pressure of loading board all by pressure sensing module sensing to the realization detects the subsides dress pressure of whole suction nozzle of whole chip mounter high-efficiently. In addition, the input end of the signal transmission module is electrically connected with the pressure sensing module, and the output end of the signal transmission module is used for being accessed by external equipment, so that the data sensed by the pressure sensing module can be transmitted to the external equipment, and the subsequent data processing and analysis can be conveniently carried out in the external equipment so as to comprehensively evaluate the setting parameters and the running state of the chip mounter.
As the utility model provides a chip mounter suction nozzle pressure detection device's preferred scheme, the pressure sensing module including set up in the inside support arm of shell with be fixed in pressure sensor on the support arm, pressure sensor contact in the downside of loading board is used for receiving produce corresponding pressure analog signal during the holding down force of loading board.
As the utility model provides a chip mounter suction nozzle pressure detection device's preferred scheme, signal transmission module include signal processing circuit and with the collection card that signal processing circuit electricity is connected, pressure sensor pressurized produces pressure analog signal passes through signal processing circuit transmits extremely the collection card, the collection card be used for with pressure analog signal converts pressure digital signal into.
As the utility model provides a chip mounter suction nozzle pressure measurement device's preferred scheme, signal transmission module still include with the data interface that the collection card was connected, data interface is used for supplying external equipment connects.
As the utility model provides a chip mounter suction nozzle pressure measurement device's preferred scheme, pressure sensor's pressure measurement scope is 0 ~ 5N. The pressure sensor has industrial-grade precision control, high effect speed and wide response frequency range, and can accurately measure the pressure generated by the impact of the suction nozzle on the bearing plate.
As the utility model provides a chip mounter suction nozzle pressure measurement device's preferred scheme, each of loading board the subsides dress region all has viscidity. Therefore, the suction nozzle can be stably attached to the bearing plate to simulate the process of attaching the components to the PCBA plate by the suction nozzle more truly.
As the utility model provides a chip mounter suction nozzle pressure measurement device's preferred scheme, the upper surface paste of loading board has the double faced adhesive tape. By the design, each sticking area can be guaranteed to have viscosity only by sticking the double faced adhesive tape, the implementation is convenient, and the operation difficulty is low.
As the utility model provides a chip mounter suction nozzle pressure measurement device's preferred scheme, the carrier plate size is: length 80mm x width 80 mm. The design can ensure that the bearing plate can mount 600 components at one time.
As the utility model provides a chip mounter suction nozzle pressure measurement device's preferred scheme, the thickness of fin is 2 mm. The thickness of the existing PCBA plate is usually 2mm, and the wide applicability of the detection device can be ensured by designing the thickness of the wing piece to be 2 mm.
Implement the utility model provides a chip mounter suction nozzle pressure measurement can reach following beneficial effect: the detection device includes: the shell is provided with an upper panel, the middle part of the upper panel is provided with a through hole, and two opposite sides of the upper panel are respectively provided with a fin for clamping the SMT track; the bearing plate is positioned in the through hole, and the upper surface of the bearing plate is provided with a plurality of mounting areas for the suction nozzles to mount the components; the pressure sensing module is arranged on the lower side of the bearing plate and used for sensing the pressure born by the bearing plate; and the signal transmission module is arranged in the shell, the input end of the signal transmission module is electrically connected with the pressure sensing module, and the output end of the signal transmission module is used for being accessed by external equipment. Through adopting chip mounter suction nozzle pressure detection device among the above-mentioned technical scheme, will detection device passes through two the fin is fixed on the SMT track, then use respectively a plurality of chip mounter the suction nozzle is in proper order paste dress components and parts on the loading board, each the suction nozzle is in paste dress components and parts's in-process on the loading board and act on the pressure of loading board all by pressure sensing module sensing to the realization detects the subsides dress pressure of whole suction nozzle of whole chip mounter high-efficiently. In addition, the input end of the signal transmission module is electrically connected with the pressure sensing module, and the output end of the signal transmission module is used for being accessed by external equipment, so that the data sensed by the pressure sensing module can be transmitted to the external equipment, and the subsequent data processing and analysis can be conveniently carried out in the external equipment so as to comprehensively evaluate the setting parameters and the running state of the chip mounter.
Drawings
Fig. 1 is a schematic top view of a detection device according to a preferred embodiment of the present invention;
fig. 2 is a left side view schematically illustrating a detection device according to a preferred embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of a detection device according to a preferred embodiment of the present invention.
Detailed description of the embodiments reference is made to the accompanying drawings in which:
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Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to fig. 3, the present invention provides a preferred implementation of a pressure detecting device for a suction nozzle of a chip mounter.
In the current manufacturing process of Printed Circuit Boards (PCBAs), SMT tracks are generally used to transport PCBAs. The utility model provides a chip mounter the suction nozzle is used for pasting the components and parts to the PCBA board of SMT track centre gripping.
The detection device includes: the housing 1 is provided with an upper panel 11, the middle part of the upper panel 11 is provided with a through hole, and two opposite sides of the upper panel 11 are respectively provided with a fin 12 for clamping the SMT track; the bearing plate 2 is positioned in the through hole, and the upper surface of the bearing plate is provided with a plurality of mounting areas for the suction nozzles to mount the components; the pressure sensing module is arranged on the lower side of the bearing plate and used for sensing the pressure born by the bearing plate; and the signal transmission module is arranged in the shell 1, the input end of the signal transmission module is electrically connected with the pressure sensing module, and the output end of the signal transmission module is used for being accessed by external equipment. Through adopting chip mounter suction nozzle pressure detection device among the above-mentioned technical scheme, will detection device passes through two fin 12 is fixed on the SMT track, then use respectively a plurality of chip mounter the suction nozzle is in proper order dress components and parts on the loading board, each the suction nozzle is in the in-process that pastes dress components and parts on the loading board acts on the pressure of loading board all by pressure sensing module sensing to the realization detects the dress pressure of whole suction nozzle of whole chip mounter high-efficiently. In addition, the input end of the signal transmission module is electrically connected with the pressure sensing module, and the output end of the signal transmission module is used for being accessed by external equipment, so that the data sensed by the pressure sensing module can be transmitted to the external equipment, and the subsequent data processing and analysis can be conveniently carried out in the external equipment so as to comprehensively evaluate the setting parameters and the running state of the chip mounter.
Specifically, the housing 1 is made of a metal material. The overall dimensions of the housing 1 are: length 208mm x width 152mm, so that the detection device can be placed on the SMT track without interference. The through hole has a square outline and is located in the middle of the upper panel 11. The bearing plate is a square thin plate
Specifically, the pressure sensing module includes a supporting arm 31 disposed inside the housing 1 and a pressure sensor (not shown) fixed on the supporting arm 31, wherein the pressure sensor (not shown) contacts with the lower side of the carrier plate 2 for generating a corresponding pressure analog signal when the pressure sensor is pressed by the carrier plate. The support arm 31 is installed at the bottom inside the housing 1, the upper side of the support arm 31 supports the carrier plate, and the pressure sensor (not shown) is disposed between the support wall and the carrier plate.
Specifically, the signal transmission module includes a signal processing circuit 41 and an acquisition card 42 electrically connected to the signal processing circuit 41, the pressure analog signal generated by the pressure sensor (not shown) under pressure is transmitted to the acquisition card 42 through the signal processing circuit 41, and the acquisition card 42 is configured to convert the pressure analog signal into a pressure digital signal.
Specifically, the signal transmission module further includes a data interface 43 connected to the acquisition card 42, and the data interface 43 is used for connecting the external device. Preferably, the data interface 43 adopts a USB-B interface.
Further, the pressure measuring range of the pressure sensor (not shown) is 0-5N. The pressure sensor (not shown) has industrial-grade precision control, high effect speed and wide response frequency range, and can accurately measure the pressure generated by the impact of the suction nozzle on the bearing plate.
Further, each of the mounting areas of the carrier plate has an adhesive property. Therefore, the suction nozzle can be stably attached to the bearing plate to simulate the process of attaching the components to the PCBA plate by the suction nozzle more truly. Preferably, a double-sided adhesive tape is adhered to the upper surface of the bearing plate. By the design, each sticking area can be guaranteed to have viscosity only by sticking the double faced adhesive tape, the implementation is convenient, and the operation difficulty is low.
Further, the size of the bearing plate 2 is: length 80mm x width 80 mm. The design can ensure that the bearing plate can mount 600 components at one time.
Further, the thickness of the fin 12 is 2 mm. The thickness of existing PCBA plates is typically 2mm, and designing the thickness of the fins 12 to be 2mm ensures wide applicability of the test device.
Implement the utility model provides a chip mounter suction nozzle pressure measurement can reach following beneficial effect at least:
1. through adopting detection device will detection device passes through two earlier detection device fixes fin 12 is in on the SMT track, then uses respectively chip mounter's a plurality of the suction nozzle is in proper order dress components and parts on the loading board, each the suction nozzle is in the in-process that pastes dress components and parts on the loading board acts on the pressure of loading board all is by pressure sensing module sensing to the realization detects the dress pressure of whole suction nozzle of whole chip mounter high-efficiently.
2. The signal transmission module with the input end electrically connected with the pressure sensing module and the output end used for being accessed by external equipment can transmit the data sensed by the pressure sensing module to the external equipment, so that the external equipment can perform subsequent data processing and analysis to comprehensively evaluate the setting parameters and the running state of the chip mounter
3. Each of the mounting areas of the carrier plate has an adhesive property. Therefore, the suction nozzle can be stably attached to the bearing plate to simulate the process of attaching the components to the PCBA plate by the suction nozzle more truly.
While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (9)
1. The utility model provides a chip mounter suction nozzle pressure measurement, chip mounter's suction nozzle is used for pasting the components and parts to the PCBA board of SMT track centre gripping, its characterized in that, detection device includes:
the shell is provided with an upper panel, the middle part of the upper panel is provided with a through hole, and two opposite sides of the upper panel are respectively provided with a fin for clamping the SMT track;
the bearing plate is positioned in the through hole, and the upper surface of the bearing plate is provided with a plurality of mounting areas for the suction nozzles to mount the components;
the pressure sensing module is arranged on the lower side of the bearing plate and used for sensing the pressure born by the bearing plate;
and the signal transmission module is arranged in the shell, the input end of the signal transmission module is electrically connected with the pressure sensing module, and the output end of the signal transmission module is used for being accessed by external equipment.
2. The suction nozzle pressure detecting device of a chip mounter according to claim 1, wherein the pressure sensing module includes a supporting arm disposed inside the housing and a pressure sensor fixed on the supporting arm, the pressure sensor is in contact with the lower side of the carrier plate for generating a corresponding pressure analog signal when being pressed by the lower pressure of the carrier plate.
3. The suction nozzle pressure detecting device of a chip mounter according to claim 2, wherein the signal transmission module includes a signal processing circuit and an acquisition card electrically connected to the signal processing circuit, the pressure analog signal generated by the pressure sensor being pressed is transmitted to the acquisition card through the signal processing circuit, and the acquisition card is configured to convert the pressure analog signal into a pressure digital signal.
4. The suction nozzle pressure detecting device of a chip mounter according to claim 3, wherein said signal transmission module further comprises a data interface connected to said acquisition card, said data interface being for connection to said external device.
5. The suction nozzle pressure detection device of the chip mounter according to claim 2, wherein a pressure measurement range of said pressure sensor is 0-5N.
6. The pressure detecting device for the suction nozzle of the chip mounter according to claim 1, wherein each of the mounting areas of the carrier plate has an adhesive property.
7. The suction nozzle pressure detecting device of a chip mounter according to claim 6, wherein a double-sided tape is adhered to an upper surface of said carrier plate.
8. The suction nozzle pressure detecting device of chip mounter according to claim 1, wherein said carrier plate has a size of: length 80mm x width 80 mm.
9. The suction nozzle pressure detecting device of a chip mounter according to claim 1, wherein the thickness of said fins is 2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921454005.6U CN210808126U (en) | 2019-09-03 | 2019-09-03 | Pressure detection device for suction nozzle of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921454005.6U CN210808126U (en) | 2019-09-03 | 2019-09-03 | Pressure detection device for suction nozzle of chip mounter |
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| Publication Number | Publication Date |
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| CN210808126U true CN210808126U (en) | 2020-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921454005.6U Active CN210808126U (en) | 2019-09-03 | 2019-09-03 | Pressure detection device for suction nozzle of chip mounter |
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| CN (1) | CN210808126U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113553383A (en) * | 2021-08-07 | 2021-10-26 | 九江嘉远科技有限公司 | Suction nozzle detection method, system, equipment and storage medium |
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2019
- 2019-09-03 CN CN201921454005.6U patent/CN210808126U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113553383A (en) * | 2021-08-07 | 2021-10-26 | 九江嘉远科技有限公司 | Suction nozzle detection method, system, equipment and storage medium |
| CN113553383B (en) * | 2021-08-07 | 2022-02-22 | 九江嘉远科技有限公司 | Suction nozzle detection method, system, equipment and storage medium |
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