CN101106018A - 用于电容器具有共烧制电极的薄膜电介质及其制造方法 - Google Patents

用于电容器具有共烧制电极的薄膜电介质及其制造方法 Download PDF

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Publication number
CN101106018A
CN101106018A CNA2007101494225A CN200710149422A CN101106018A CN 101106018 A CN101106018 A CN 101106018A CN A2007101494225 A CNA2007101494225 A CN A2007101494225A CN 200710149422 A CN200710149422 A CN 200710149422A CN 101106018 A CN101106018 A CN 101106018A
Authority
CN
China
Prior art keywords
dielectric
capacitor
electrode
top electrode
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101494225A
Other languages
English (en)
Chinese (zh)
Inventor
W·J·博兰
P·丹尼尔斯
D·W·费斯
J·F·伊勒菲尔德
J·-P·马里亚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
North Carolina State University
EIDP Inc
Original Assignee
North Carolina State University
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North Carolina State University, EI Du Pont de Nemours and Co filed Critical North Carolina State University
Publication of CN101106018A publication Critical patent/CN101106018A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
CNA2007101494225A 2006-07-14 2007-07-13 用于电容器具有共烧制电极的薄膜电介质及其制造方法 Pending CN101106018A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/486,837 2006-07-14
US11/486,837 US20080010798A1 (en) 2006-07-14 2006-07-14 Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof

Publications (1)

Publication Number Publication Date
CN101106018A true CN101106018A (zh) 2008-01-16

Family

ID=38441748

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101494225A Pending CN101106018A (zh) 2006-07-14 2007-07-13 用于电容器具有共烧制电极的薄膜电介质及其制造方法

Country Status (6)

Country Link
US (1) US20080010798A1 (fr)
EP (1) EP1879202A3 (fr)
JP (1) JP2008109082A (fr)
KR (2) KR100938073B1 (fr)
CN (1) CN101106018A (fr)
TW (1) TW200811891A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103988304A (zh) * 2011-12-12 2014-08-13 国际商业机器公司 用于形成具有etsoi晶体管的芯片上高质量电容器的方法和结构
CN106486287A (zh) * 2015-09-02 2017-03-08 北京纳米能源与系统研究所 可降解电容器及其制造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5051166B2 (ja) * 2009-03-27 2012-10-17 Ｔｄｋ株式会社 薄膜デバイス
JP5407775B2 (ja) * 2009-03-31 2014-02-05 Ｔｄｋ株式会社 薄膜コンデンサの製造方法及び薄膜コンデンサ
JP5434714B2 (ja) * 2009-04-15 2014-03-05 Ｔｄｋ株式会社 薄膜コンデンサ及び電子回路基板
JP5158061B2 (ja) * 2009-11-30 2013-03-06 Ｔｄｋ株式会社 薄膜コンデンサ
US8690615B2 (en) 2011-11-02 2014-04-08 Tyco Electronics Corporation Capacitor
JP2013258224A (ja) * 2012-06-12 2013-12-26 Taiyo Yuden Co Ltd 可変容量コンデンサ素子
DE102016106284A1 (de) * 2016-04-06 2017-10-12 Epcos Ag Modul
US10957807B2 (en) * 2017-04-19 2021-03-23 The Board Of Trustees Of The University Of Alabama PLZT thin film capacitors apparatus with enhanced photocurrent and power conversion efficiency and method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5973351A (en) * 1997-01-22 1999-10-26 International Business Machines Corporation Semiconductor device with high dielectric constant insulator material
JP3215345B2 (ja) * 1997-03-19 2001-10-02 富士通株式会社 半導体装置の製造方法
JP3882779B2 (ja) * 2002-05-27 2007-02-21 日本電気株式会社 薄膜キャパシタ、薄膜キャパシタを含む複合受動部品、それらの製造方法およびそれらを内蔵した配線基板
US6818469B2 (en) * 2002-05-27 2004-11-16 Nec Corporation Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
US20040231885A1 (en) * 2003-03-07 2004-11-25 Borland William J. Printed wiring boards having capacitors and methods of making thereof
US7029971B2 (en) * 2003-07-17 2006-04-18 E. I. Du Pont De Nemours And Company Thin film dielectrics for capacitors and methods of making thereof
US7256980B2 (en) * 2003-12-30 2007-08-14 Du Pont Thin film capacitors on ceramic
JP4071204B2 (ja) * 2004-02-27 2008-04-02 Ｔｄｋ株式会社 多層セラミック基板の製造方法
EP1578179A3 (fr) * 2004-03-16 2006-05-03 E.I. du Pont de Nemours and Company Film épais diélectrique et composition conductrice
US7011726B1 (en) * 2004-09-27 2006-03-14 Intel Corporation Method of fabricating thin dielectric film and thin film capacitor including the dielectric film
US7818855B2 (en) * 2006-11-10 2010-10-26 E. I. Du Pont De Nemours And Company Method of making thin-film capacitors on metal foil using thick top electrodes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103988304A (zh) * 2011-12-12 2014-08-13 国际商业机器公司 用于形成具有etsoi晶体管的芯片上高质量电容器的方法和结构
CN103988304B (zh) * 2011-12-12 2017-09-08 国际商业机器公司 用于形成具有etsoi晶体管的芯片上高质量电容器的方法和结构
CN106486287A (zh) * 2015-09-02 2017-03-08 北京纳米能源与系统研究所 可降解电容器及其制造方法

Also Published As

Publication number Publication date
KR20090123844A (ko) 2009-12-02
KR100938073B1 (ko) 2010-01-21
JP2008109082A (ja) 2008-05-08
EP1879202A2 (fr) 2008-01-16
KR20080007140A (ko) 2008-01-17
US20080010798A1 (en) 2008-01-17
EP1879202A3 (fr) 2008-02-27
TW200811891A (en) 2008-03-01

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
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