CN101067725B - 感光液狭缝喷嘴的感光液硬化防止装置及方法 - Google Patents

感光液狭缝喷嘴的感光液硬化防止装置及方法 Download PDF

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Publication number
CN101067725B
CN101067725B CN2007101022065A CN200710102206A CN101067725B CN 101067725 B CN101067725 B CN 101067725B CN 2007101022065 A CN2007101022065 A CN 2007101022065A CN 200710102206 A CN200710102206 A CN 200710102206A CN 101067725 B CN101067725 B CN 101067725B
Authority
CN
China
Prior art keywords
liquid
sclerosis
slit
nozzle
sensitization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007101022065A
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English (en)
Chinese (zh)
Other versions
CN101067725A (zh
Inventor
权晟
金株香
朴云用
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kc Ltd By Share Ltd
KCTech Co Ltd
Original Assignee
KC Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KC Tech Co Ltd filed Critical KC Tech Co Ltd
Publication of CN101067725A publication Critical patent/CN101067725A/zh
Application granted granted Critical
Publication of CN101067725B publication Critical patent/CN101067725B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/557—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids the cleaning fluid being a mixture of gas and liquid
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2007101022065A 2006-05-02 2007-04-27 感光液狭缝喷嘴的感光液硬化防止装置及方法 Expired - Fee Related CN101067725B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020060039454 2006-05-02
KR10-2006-0039454 2006-05-02
KR1020060039454A KR100691481B1 (ko) 2006-05-02 2006-05-02 감광액 슬릿 노즐의 감광액 경화 방지장치 및 방법

Publications (2)

Publication Number Publication Date
CN101067725A CN101067725A (zh) 2007-11-07
CN101067725B true CN101067725B (zh) 2010-08-18

Family

ID=38102815

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007101022065A Expired - Fee Related CN101067725B (zh) 2006-05-02 2007-04-27 感光液狭缝喷嘴的感光液硬化防止装置及方法

Country Status (3)

Country Link
KR (1) KR100691481B1 (ko)
CN (1) CN101067725B (ko)
TW (1) TWI346840B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5226046B2 (ja) * 2010-08-18 2013-07-03 東京エレクトロン株式会社 塗布装置及びノズルのメンテナンス方法
KR101895409B1 (ko) 2011-09-06 2018-09-06 세메스 주식회사 기판 처리 설비
CN113492080B (zh) * 2020-04-01 2022-11-18 阳程科技股份有限公司 可减缓溶剂回流至涂布头内的涂布机及浸泡方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10312944A (ja) 1997-05-13 1998-11-24 Sony Corp レジストノズルの受け体
JP2001203151A (ja) 2000-01-21 2001-07-27 Sony Corp 半導体製造装置
JP3631180B2 (ja) 2001-09-04 2005-03-23 キヤノン株式会社 フォトレジスト塗布方法及びヘッド洗浄機構並びに塗布装置
KR20050112884A (ko) * 2004-05-28 2005-12-01 삼성전자주식회사 반도체 포토 공정용 코팅 장치

Also Published As

Publication number Publication date
TW200742943A (en) 2007-11-16
TWI346840B (en) 2011-08-11
CN101067725A (zh) 2007-11-07
KR100691481B1 (ko) 2007-03-12

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SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address

Address after: Korea city Daoan

Patentee after: KC Limited by Share Ltd.

Address before: 268-1 cities in South Korea

Patentee before: K.C. Tech Co.,Ltd.

CP03 Change of name, title or address
TR01 Transfer of patent right

Effective date of registration: 20180824

Address after: Korea city Daoan

Patentee after: K.C.TECH Co.,Ltd.

Address before: Korea city Daoan

Patentee before: KC Limited by Share Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100818

CF01 Termination of patent right due to non-payment of annual fee