CN101067725B - 感光液狭缝喷嘴的感光液硬化防止装置及方法 - Google Patents
感光液狭缝喷嘴的感光液硬化防止装置及方法 Download PDFInfo
- Publication number
- CN101067725B CN101067725B CN2007101022065A CN200710102206A CN101067725B CN 101067725 B CN101067725 B CN 101067725B CN 2007101022065 A CN2007101022065 A CN 2007101022065A CN 200710102206 A CN200710102206 A CN 200710102206A CN 101067725 B CN101067725 B CN 101067725B
- Authority
- CN
- China
- Prior art keywords
- liquid
- sclerosis
- slit
- nozzle
- sensitization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 99
- 238000000034 method Methods 0.000 title claims abstract description 21
- 208000034189 Sclerosis Diseases 0.000 claims abstract description 61
- 206010070834 Sensitisation Diseases 0.000 claims description 58
- 230000008313 sensitization Effects 0.000 claims description 58
- 238000000576 coating method Methods 0.000 claims description 28
- 239000011248 coating agent Substances 0.000 claims description 26
- 239000007888 film coating Substances 0.000 abstract 4
- 238000009501 film coating Methods 0.000 abstract 4
- 239000000758 substrate Substances 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
- B05B15/557—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids the cleaning fluid being a mixture of gas and liquid
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Atmospheric Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0039454 | 2006-05-02 | ||
KR1020060039454 | 2006-05-02 | ||
KR1020060039454A KR100691481B1 (ko) | 2006-05-02 | 2006-05-02 | 감광액 슬릿 노즐의 감광액 경화 방지장치 및 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101067725A CN101067725A (zh) | 2007-11-07 |
CN101067725B true CN101067725B (zh) | 2010-08-18 |
Family
ID=38102815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101022065A Expired - Fee Related CN101067725B (zh) | 2006-05-02 | 2007-04-27 | 感光液狭缝喷嘴的感光液硬化防止装置及方法 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100691481B1 (ko) |
CN (1) | CN101067725B (ko) |
TW (1) | TWI346840B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5226046B2 (ja) * | 2010-08-18 | 2013-07-03 | 東京エレクトロン株式会社 | 塗布装置及びノズルのメンテナンス方法 |
KR101895409B1 (ko) | 2011-09-06 | 2018-09-06 | 세메스 주식회사 | 기판 처리 설비 |
CN113492080B (zh) * | 2020-04-01 | 2022-11-18 | 阳程科技股份有限公司 | 可减缓溶剂回流至涂布头内的涂布机及浸泡方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10312944A (ja) | 1997-05-13 | 1998-11-24 | Sony Corp | レジストノズルの受け体 |
JP2001203151A (ja) | 2000-01-21 | 2001-07-27 | Sony Corp | 半導体製造装置 |
JP3631180B2 (ja) | 2001-09-04 | 2005-03-23 | キヤノン株式会社 | フォトレジスト塗布方法及びヘッド洗浄機構並びに塗布装置 |
KR20050112884A (ko) * | 2004-05-28 | 2005-12-01 | 삼성전자주식회사 | 반도체 포토 공정용 코팅 장치 |
-
2006
- 2006-05-02 KR KR1020060039454A patent/KR100691481B1/ko active IP Right Grant
-
2007
- 2007-04-27 CN CN2007101022065A patent/CN101067725B/zh not_active Expired - Fee Related
- 2007-04-27 TW TW096115059A patent/TWI346840B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200742943A (en) | 2007-11-16 |
KR100691481B1 (ko) | 2007-03-12 |
CN101067725A (zh) | 2007-11-07 |
TWI346840B (en) | 2011-08-11 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: Korea city Daoan Patentee after: KC Limited by Share Ltd. Address before: 268-1 cities in South Korea Patentee before: K.C. Tech Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180824 Address after: Korea city Daoan Patentee after: K.C.TECH Co.,Ltd. Address before: Korea city Daoan Patentee before: KC Limited by Share Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100818 |
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CF01 | Termination of patent right due to non-payment of annual fee |