TWI346840B - Preventing device and method for sensitive-liquid in slit-nozzle - Google Patents

Preventing device and method for sensitive-liquid in slit-nozzle

Info

Publication number
TWI346840B
TWI346840B TW096115059A TW96115059A TWI346840B TW I346840 B TWI346840 B TW I346840B TW 096115059 A TW096115059 A TW 096115059A TW 96115059 A TW96115059 A TW 96115059A TW I346840 B TWI346840 B TW I346840B
Authority
TW
Taiwan
Prior art keywords
slit
nozzle
sensitive
liquid
preventing device
Prior art date
Application number
TW096115059A
Other languages
English (en)
Other versions
TW200742943A (en
Inventor
Seong Kwon
Ju Hyang Kim
Woon Yong Park
Original Assignee
K C Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K C Tech Co Ltd filed Critical K C Tech Co Ltd
Publication of TW200742943A publication Critical patent/TW200742943A/zh
Application granted granted Critical
Publication of TWI346840B publication Critical patent/TWI346840B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/557—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids the cleaning fluid being a mixture of gas and liquid
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096115059A 2006-05-02 2007-04-27 Preventing device and method for sensitive-liquid in slit-nozzle TWI346840B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060039454A KR100691481B1 (ko) 2006-05-02 2006-05-02 감광액 슬릿 노즐의 감광액 경화 방지장치 및 방법

Publications (2)

Publication Number Publication Date
TW200742943A TW200742943A (en) 2007-11-16
TWI346840B true TWI346840B (en) 2011-08-11

Family

ID=38102815

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096115059A TWI346840B (en) 2006-05-02 2007-04-27 Preventing device and method for sensitive-liquid in slit-nozzle

Country Status (3)

Country Link
KR (1) KR100691481B1 (zh)
CN (1) CN101067725B (zh)
TW (1) TWI346840B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5226046B2 (ja) * 2010-08-18 2013-07-03 東京エレクトロン株式会社 塗布装置及びノズルのメンテナンス方法
KR101895409B1 (ko) 2011-09-06 2018-09-06 세메스 주식회사 기판 처리 설비
CN113492080B (zh) * 2020-04-01 2022-11-18 阳程科技股份有限公司 可减缓溶剂回流至涂布头内的涂布机及浸泡方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10312944A (ja) 1997-05-13 1998-11-24 Sony Corp レジストノズルの受け体
JP2001203151A (ja) 2000-01-21 2001-07-27 Sony Corp 半導体製造装置
JP3631180B2 (ja) 2001-09-04 2005-03-23 キヤノン株式会社 フォトレジスト塗布方法及びヘッド洗浄機構並びに塗布装置
KR20050112884A (ko) * 2004-05-28 2005-12-01 삼성전자주식회사 반도체 포토 공정용 코팅 장치

Also Published As

Publication number Publication date
TW200742943A (en) 2007-11-16
CN101067725B (zh) 2010-08-18
KR100691481B1 (ko) 2007-03-12
CN101067725A (zh) 2007-11-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees