CN101044257A - 一种用于承载可转动的溅射靶材的扁平端块 - Google Patents
一种用于承载可转动的溅射靶材的扁平端块 Download PDFInfo
- Publication number
- CN101044257A CN101044257A CNA2005800356053A CN200580035605A CN101044257A CN 101044257 A CN101044257 A CN 101044257A CN A2005800356053 A CNA2005800356053 A CN A2005800356053A CN 200580035605 A CN200580035605 A CN 200580035605A CN 101044257 A CN101044257 A CN 101044257A
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- CN
- China
- Prior art keywords
- zone
- axis
- drive unit
- restricted
- projection part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Abstract
Description
Claims (24)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04105116.0 | 2004-10-18 | ||
EP04105116 | 2004-10-18 | ||
EP05101905.7 | 2005-03-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101044257A true CN101044257A (zh) | 2007-09-26 |
CN100564580C CN100564580C (zh) | 2009-12-02 |
Family
ID=34929716
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005800356053A Active CN100564580C (zh) | 2004-10-18 | 2005-10-11 | 一种用于承载可转动的溅射靶材的扁平端块 |
CN2005800355879A Expired - Fee Related CN101044586B (zh) | 2004-10-18 | 2005-10-11 | 一种用于可转动靶材溅射设备的端块 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800355879A Expired - Fee Related CN101044586B (zh) | 2004-10-18 | 2005-10-11 | 一种用于可转动靶材溅射设备的端块 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7824528B2 (zh) |
EP (1) | EP1803144B1 (zh) |
JP (1) | JP4836956B2 (zh) |
CN (2) | CN100564580C (zh) |
AT (1) | ATE392007T1 (zh) |
DE (1) | DE602005006008T2 (zh) |
WO (1) | WO2006042808A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102918622A (zh) * | 2010-05-11 | 2013-02-06 | 应用材料公司 | 用于物理气相沉积的腔室 |
CN103119191A (zh) * | 2010-04-01 | 2013-05-22 | 应用材料公司 | 端块和溅射装置 |
CN104937135A (zh) * | 2013-01-28 | 2015-09-23 | 应用材料公司 | 基板载体配置与夹持基板的方法 |
CN115466930A (zh) * | 2022-09-13 | 2022-12-13 | 安徽其芒光电科技有限公司 | 镀膜设备及其靶材承载装置 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9349576B2 (en) * | 2006-03-17 | 2016-05-24 | Angstrom Sciences, Inc. | Magnetron for cylindrical targets |
US20090183983A1 (en) * | 2006-06-19 | 2009-07-23 | Bekaert Advanced Coatings | Insert piece for an end-block of a sputtering installation |
DE102007049735B4 (de) * | 2006-10-17 | 2012-03-29 | Von Ardenne Anlagentechnik Gmbh | Versorgungsendblock für ein Rohrmagnetron |
US8061975B2 (en) * | 2007-08-31 | 2011-11-22 | General Electric Company | Slipring bushing assembly for moveable turbine vane |
US8197196B2 (en) * | 2007-08-31 | 2012-06-12 | General Electric Company | Bushing and clock spring assembly for moveable turbine vane |
US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
US8951394B2 (en) | 2010-01-29 | 2015-02-10 | Angstrom Sciences, Inc. | Cylindrical magnetron having a shunt |
JP5491258B2 (ja) * | 2010-04-02 | 2014-05-14 | 出光興産株式会社 | 酸化物半導体の成膜方法 |
WO2013003458A1 (en) | 2011-06-27 | 2013-01-03 | Soleras Ltd. | Sputtering target |
CN102251223A (zh) * | 2011-06-28 | 2011-11-23 | 黄峰 | 用于旋转靶的配电装置 |
US9809876B2 (en) | 2014-01-13 | 2017-11-07 | Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique (C.R.V.C.) Sarl | Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure |
DE102014115280B4 (de) * | 2014-10-20 | 2023-02-02 | VON ARDENNE Asset GmbH & Co. KG | Magnetronanordnung |
GB201505528D0 (en) | 2015-03-31 | 2015-05-13 | Gencoa Ltd | Rotational device-III |
BE1023876B1 (nl) * | 2016-07-13 | 2017-08-31 | Soleras Advanced Coatings Bvba | Elektrische overdracht in een eindblok |
BE1024754B9 (nl) * | 2016-11-29 | 2018-07-24 | Soleras Advanced Coatings Bvba | Een universeel monteerbaar eindblok |
DE102021129524A1 (de) * | 2021-11-12 | 2023-05-17 | VON ARDENNE Asset GmbH & Co. KG | Magnetsystem und Sputtervorrichtung |
CN114107929A (zh) * | 2021-11-29 | 2022-03-01 | 青岛科技大学 | 一种可预热溅射靶材的旋靶管装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4356073A (en) | 1981-02-12 | 1982-10-26 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US5096562A (en) | 1989-11-08 | 1992-03-17 | The Boc Group, Inc. | Rotating cylindrical magnetron structure for large area coating |
US5200049A (en) * | 1990-08-10 | 1993-04-06 | Viratec Thin Films, Inc. | Cantilever mount for rotating cylindrical magnetrons |
DE4106770C2 (de) | 1991-03-04 | 1996-10-17 | Leybold Ag | Verrichtung zum reaktiven Beschichten eines Substrats |
US5171411A (en) * | 1991-05-21 | 1992-12-15 | The Boc Group, Inc. | Rotating cylindrical magnetron structure with self supporting zinc alloy target |
US5445721A (en) * | 1994-08-25 | 1995-08-29 | The Boc Group, Inc. | Rotatable magnetron including a replacement target structure |
CN1053712C (zh) * | 1997-04-30 | 2000-06-21 | 浙江大学 | 旋转靶柱型磁控溅射靶源 |
US6365010B1 (en) * | 1998-11-06 | 2002-04-02 | Scivac | Sputtering apparatus and process for high rate coatings |
US7399385B2 (en) * | 2001-06-14 | 2008-07-15 | Tru Vue, Inc. | Alternating current rotatable sputter cathode |
US6736948B2 (en) | 2002-01-18 | 2004-05-18 | Von Ardenne Anlagentechnik Gmbh | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation |
US20030173217A1 (en) | 2002-03-14 | 2003-09-18 | Sputtering Components, Inc. | High-power ion sputtering magnetron |
-
2005
- 2005-10-11 US US11/665,563 patent/US7824528B2/en not_active Expired - Fee Related
- 2005-10-11 WO PCT/EP2005/055144 patent/WO2006042808A1/en active IP Right Grant
- 2005-10-11 AT AT05797244T patent/ATE392007T1/de not_active IP Right Cessation
- 2005-10-11 EP EP05797244A patent/EP1803144B1/en not_active Not-in-force
- 2005-10-11 JP JP2007536160A patent/JP4836956B2/ja not_active Expired - Fee Related
- 2005-10-11 CN CNB2005800356053A patent/CN100564580C/zh active Active
- 2005-10-11 CN CN2005800355879A patent/CN101044586B/zh not_active Expired - Fee Related
- 2005-10-11 DE DE602005006008T patent/DE602005006008T2/de active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103119191A (zh) * | 2010-04-01 | 2013-05-22 | 应用材料公司 | 端块和溅射装置 |
CN102918622A (zh) * | 2010-05-11 | 2013-02-06 | 应用材料公司 | 用于物理气相沉积的腔室 |
CN104937135A (zh) * | 2013-01-28 | 2015-09-23 | 应用材料公司 | 基板载体配置与夹持基板的方法 |
CN115466930A (zh) * | 2022-09-13 | 2022-12-13 | 安徽其芒光电科技有限公司 | 镀膜设备及其靶材承载装置 |
Also Published As
Publication number | Publication date |
---|---|
DE602005006008T2 (de) | 2009-06-18 |
CN100564580C (zh) | 2009-12-02 |
US20080087541A1 (en) | 2008-04-17 |
CN101044586A (zh) | 2007-09-26 |
CN101044586B (zh) | 2010-06-16 |
DE602005006008D1 (de) | 2008-05-21 |
ATE392007T1 (de) | 2008-04-15 |
JP2008517151A (ja) | 2008-05-22 |
EP1803144B1 (en) | 2008-04-09 |
US7824528B2 (en) | 2010-11-02 |
JP4836956B2 (ja) | 2011-12-14 |
EP1803144A1 (en) | 2007-07-04 |
WO2006042808A1 (en) | 2006-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Becca Pieter (Jiangyin) coating industry Co., Ltd. Assignor: Bekaert Advanced Coatings Contract record no.: 2010990000989 Denomination of invention: An end-block for a rotatable target sputtering apparatus Granted publication date: 20091202 License type: Common License Open date: 20070926 Record date: 20101217 |
|
C56 | Change in the name or address of the patentee |
Owner name: SOLERAS ADVANCED COATINGS NV Free format text: FORMER NAME: BEKAERT ADVANCED COATINGS |
|
CP01 | Change in the name or title of a patent holder |
Address after: Belgium Denzel Patentee after: Bekaert Advanced Coatings Address before: Belgium Denzel Patentee before: Bekaert Advanced Coatings |