CN101044074B - 容量减小的运载器和使用方法 - Google Patents

容量减小的运载器和使用方法 Download PDF

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Publication number
CN101044074B
CN101044074B CN200580035790.6A CN200580035790A CN101044074B CN 101044074 B CN101044074 B CN 101044074B CN 200580035790 A CN200580035790 A CN 200580035790A CN 101044074 B CN101044074 B CN 101044074B
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CN
China
Prior art keywords
substrate
carrier
housing
workpiece
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN200580035790.6A
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English (en)
Chinese (zh)
Other versions
CN101044074A (zh
Inventor
G·乌利塞斯
M·L·布法诺
W·福斯奈特
C·霍夫梅斯特
G·M·弗里德曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borucos Automation Usa Co ltd
Borukos Automation Holding Co ltd
Original Assignee
Brooks Automation Inc
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Publication of CN101044074A publication Critical patent/CN101044074A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H10P72/3604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
CN200580035790.6A 2004-08-19 2005-08-19 容量减小的运载器和使用方法 Expired - Lifetime CN101044074B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US60336104P 2004-08-19 2004-08-19
US60/603,361 2004-08-19
US11/207,231 2005-08-19
PCT/US2005/029757 WO2006023838A2 (en) 2004-08-19 2005-08-19 Reduced capacity carrier and method of use
US11/207,231 US8888433B2 (en) 2004-08-19 2005-08-19 Reduced capacity carrier and method of use

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201310692043.6A Division CN103771034B (zh) 2004-08-19 2005-08-19 容量减小的运载器和使用方法

Publications (2)

Publication Number Publication Date
CN101044074A CN101044074A (zh) 2007-09-26
CN101044074B true CN101044074B (zh) 2014-04-02

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN200580035790.6A Expired - Lifetime CN101044074B (zh) 2004-08-19 2005-08-19 容量减小的运载器和使用方法
CN201310692043.6A Expired - Lifetime CN103771034B (zh) 2004-08-19 2005-08-19 容量减小的运载器和使用方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201310692043.6A Expired - Lifetime CN103771034B (zh) 2004-08-19 2005-08-19 容量减小的运载器和使用方法

Country Status (6)

Country Link
US (2) US8888433B2 (cg-RX-API-DMAC10.html)
EP (1) EP1786710A4 (cg-RX-API-DMAC10.html)
JP (2) JP5386082B2 (cg-RX-API-DMAC10.html)
KR (1) KR101233101B1 (cg-RX-API-DMAC10.html)
CN (2) CN101044074B (cg-RX-API-DMAC10.html)
WO (1) WO2006023838A2 (cg-RX-API-DMAC10.html)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101044074B (zh) 2004-08-19 2014-04-02 布鲁克斯自动化公司 容量减小的运载器和使用方法
US8272827B2 (en) * 2005-11-07 2012-09-25 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
US20080107507A1 (en) * 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
JP2009515368A (ja) * 2005-11-07 2009-04-09 ブルックス オートメーション インコーポレイテッド 小容積キャリヤ搬送体、積載ポート、バッファーシステム
US8267634B2 (en) * 2005-11-07 2012-09-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US20070140822A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Methods and apparatus for opening and closing substrate carriers
JP5461760B2 (ja) * 2006-07-26 2014-04-02 株式会社カネカ 半導体製造装置及び半導体製造方法
KR20090053915A (ko) * 2006-08-18 2009-05-28 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
JP2008060513A (ja) * 2006-09-04 2008-03-13 Tokyo Electron Ltd 処理装置及び処理方法
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
KR20100020968A (ko) * 2007-05-17 2010-02-23 브룩스 오토메이션 인코퍼레이티드 측면 개방형 기판 캐리어 및 로드 포트
DE102007025339A1 (de) * 2007-05-31 2008-12-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter
DE102007035839B4 (de) * 2007-07-31 2017-06-22 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Verfahren und System zum lokalen Aufbewahren von Substratbehältern in einem Deckentransportsystem zum Verbessern der Aufnahme/Abgabe-Kapazitäten von Prozessanlagen
DE202010017181U1 (de) * 2010-08-04 2011-04-28 Centrotherm Thermal Solutions Gmbh + Co. Kg Vorrichtung zum Schließen und Öffnen einer Be-/Entladeöffnung einer Prozesskammer
JP2013143425A (ja) * 2012-01-10 2013-07-22 Tokyo Electron Ltd 基板処理システム及び基板位置矯正方法
JP6180954B2 (ja) * 2014-02-05 2017-08-16 浜松ホトニクス株式会社 分光器、及び分光器の製造方法
JP2017520015A (ja) * 2014-05-07 2017-07-20 マッパー・リソグラフィー・アイピー・ビー．ブイ． ターゲット処理マシン用囲い
JP2016178133A (ja) * 2015-03-19 2016-10-06 シンフォニアテクノロジー株式会社 ドア開閉装置、搬送装置、ソータ装置、収納容器のドッキング方法
JP6554872B2 (ja) * 2015-03-31 2019-08-07 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
US11569138B2 (en) * 2015-06-16 2023-01-31 Kla Corporation System and method for monitoring parameters of a semiconductor factory automation system
TWI727562B (zh) * 2015-08-04 2021-05-11 日商昕芙旎雅股份有限公司 裝載埠
TW202621431A (zh) 2015-08-04 2026-05-16 日商昕芙旎雅股份有限公司 門開閉系統及具備門開閉系統之載入埠
JP6544128B2 (ja) * 2015-08-07 2019-07-17 シンフォニアテクノロジー株式会社 収納容器の蓋体及び収納容器
DE102015219564A1 (de) * 2015-10-09 2017-04-13 Robert Bosch Gmbh Werkzeuganalyseeinrichtung und verfahren zur analyse einer bearbeitung eines werkstücks mit einem werkzeug
US10153282B1 (en) 2017-08-11 2018-12-11 Lam Research Corporation Ultra-high vacuum transport and storage
JP6969936B2 (ja) * 2017-08-29 2021-11-24 株式会社ディスコ ウエーハ収容カセット
JP7009194B2 (ja) * 2017-12-12 2022-01-25 株式会社ディスコ ウエーハ生成装置および搬送トレー
JP7164396B2 (ja) * 2018-10-29 2022-11-01 株式会社ディスコ ウエーハ生成装置
US11348817B2 (en) * 2018-11-29 2022-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer transport system and method for transporting wafers
KR102015485B1 (ko) * 2019-02-18 2019-08-28 주식회사 윈텍 오엘이디 제조 챔버 장비용 오토 리드 장치
JP6721852B2 (ja) * 2019-07-16 2020-07-15 シンフォニアテクノロジー株式会社 ロードポート
KR102278078B1 (ko) * 2019-10-17 2021-07-19 세메스 주식회사 기판 반송 장치 및 기판 처리 장치
JP7564475B2 (ja) * 2022-02-08 2024-10-09 シンフォニアテクノロジー株式会社 ロードポート及びロードポートの駆動方法
JP7820191B2 (ja) * 2022-03-03 2026-02-25 株式会社ディスコ 搬送治具
US20250321573A1 (en) * 2024-04-16 2025-10-16 Nanya Technology Corporation Automatic handling system and method of operating the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
CN1242753A (zh) * 1997-10-17 2000-01-26 奥林巴斯光学工业株式会社 晶片搬运装置
US6203268B1 (en) * 1996-04-24 2001-03-20 Tokyo Electron Limited Positioning apparatus for substrates to be processed
US6244812B1 (en) * 1998-07-10 2001-06-12 H-Square Corporation Low profile automated pod door removal system
US20020106267A1 (en) * 1999-10-19 2002-08-08 Toshiaki Fujii Container and loader for substrate
US6530736B2 (en) * 2001-07-13 2003-03-11 Asyst Technologies, Inc. SMIF load port interface including smart port door

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097421A (en) 1984-12-24 1992-03-17 Asyst Technologies, Inc. Intelligent waxer carrier
JPS61228647A (ja) 1985-04-02 1986-10-11 Mitsubishi Electric Corp ウエハ並べ換え装置
US4724874A (en) 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
US4995430A (en) 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
DE4024973C2 (de) * 1990-08-07 1994-11-03 Ibm Anordnung zum Lagern, Transportieren und Einschleusen von Substraten
US5169272A (en) 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
US5256204A (en) * 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
US5469963A (en) 1992-04-08 1995-11-28 Asyst Technologies, Inc. Sealable transportable container having improved liner
JPH09232407A (ja) * 1996-02-21 1997-09-05 Hitachi Ltd ワーク搬送装置およびそれを用いた半導体製造装置
FR2747111B1 (fr) * 1996-04-03 1998-04-30 Commissariat Energie Atomique Systeme d'accouplement pour un transfert confine d'un objet plat d'une boite de confinement vers une unite de traitement de l'objet
JPH10270526A (ja) 1997-03-24 1998-10-09 Canon Inc 基板収納容器および基板搬送装置
US6390754B2 (en) * 1997-05-21 2002-05-21 Tokyo Electron Limited Wafer processing apparatus, method of operating the same and wafer detecting system
JP3772011B2 (ja) * 1997-12-24 2006-05-10 大日本スクリーン製造株式会社 基板処理装置
US5988233A (en) 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
FR2779421B1 (fr) * 1998-06-08 2000-08-18 Incam Solutions Dispositif adaptateur pour des boites de confinement d'au moins un objet plat sous atmosphere ultrapropre
US6271917B1 (en) 1998-06-26 2001-08-07 Thomas W. Hagler Method and apparatus for spectrum analysis and encoder
JP4305988B2 (ja) 1999-01-27 2009-07-29 シンフォニアテクノロジー株式会社 ウエーハキャリア
JP2000286319A (ja) * 1999-03-31 2000-10-13 Canon Inc 基板搬送方法および半導体製造装置
TW461686U (en) 1999-04-06 2001-10-21 Benq Corp Housing decoration cap set
US6612797B1 (en) * 1999-05-18 2003-09-02 Asyst Technologies, Inc. Cassette buffering within a minienvironment
DE19922936B4 (de) 1999-05-19 2004-04-29 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
JP3939062B2 (ja) 2000-01-25 2007-06-27 松下電器産業株式会社 基板検出装置
US6633050B1 (en) * 2000-08-15 2003-10-14 Asml Holding Nv. Virtual gauging system for use in lithographic processing
US6901971B2 (en) * 2001-01-10 2005-06-07 Entegris, Inc. Transportable container including an internal environment monitor
JP3697478B2 (ja) * 2001-08-20 2005-09-21 ソニー株式会社 基板の移送方法及びロードポート装置並びに基板移送システム
US6745901B2 (en) * 2001-10-12 2004-06-08 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cassette equipped with piezoelectric sensors
US20030077153A1 (en) * 2001-10-19 2003-04-24 Applied Materials, Inc. Identification code reader integrated with substrate carrier robot
KR100469360B1 (ko) 2002-02-22 2005-02-02 엘지.필립스 엘시디 주식회사 액정표시소자의 제조 장비용 진공 합착 장치 및 구동 방법
JP4168642B2 (ja) 2002-02-28 2008-10-22 東京エレクトロン株式会社 被処理体収納容器体及び処理システム
JP2003264216A (ja) * 2002-03-08 2003-09-19 Murata Mach Ltd 搬送システム
US6691416B2 (en) * 2002-06-26 2004-02-17 Hsiu-Man Yu Chen Cutter for vehicle safety belts or the like
US6719142B1 (en) * 2002-07-16 2004-04-13 Ion Systems, Inc. Apparatus and method for measuring static charge on wafers, disks, substrates, masks, and flat panel displays
US6826451B2 (en) 2002-07-29 2004-11-30 Asml Holding N.V. Lithography tool having a vacuum reticle library coupled to a vacuum chamber
US7328836B2 (en) * 2004-02-03 2008-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Smart tag holder and cover housing
CN101044074B (zh) 2004-08-19 2014-04-02 布鲁克斯自动化公司 容量减小的运载器和使用方法
ATE527690T1 (de) * 2004-08-23 2011-10-15 Murata Machinery Ltd Werkzeuglade- und pufferungssystem auf liftbasis
JP2011186366A (ja) 2010-03-11 2011-09-22 Noriko Takamine 香るチラシの作成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
US6203268B1 (en) * 1996-04-24 2001-03-20 Tokyo Electron Limited Positioning apparatus for substrates to be processed
CN1242753A (zh) * 1997-10-17 2000-01-26 奥林巴斯光学工业株式会社 晶片搬运装置
US6244812B1 (en) * 1998-07-10 2001-06-12 H-Square Corporation Low profile automated pod door removal system
US20020106267A1 (en) * 1999-10-19 2002-08-08 Toshiaki Fujii Container and loader for substrate
US6530736B2 (en) * 2001-07-13 2003-03-11 Asyst Technologies, Inc. SMIF load port interface including smart port door

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP昭和61-228647A 1986.10.11

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US9881825B2 (en) 2018-01-30
JP2012015550A (ja) 2012-01-19
CN101044074A (zh) 2007-09-26
EP1786710A2 (en) 2007-05-23
CN103771034B (zh) 2016-06-29
WO2006023838A3 (en) 2006-08-17
KR101233101B1 (ko) 2013-02-14
JP5386082B2 (ja) 2014-01-15
WO2006023838A2 (en) 2006-03-02
EP1786710A4 (en) 2011-10-12
CN103771034A (zh) 2014-05-07
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US20150155192A1 (en) 2015-06-04
US8888433B2 (en) 2014-11-18

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