CN101038882A - 布线部件、带树脂的金属部件及树脂密封半导体装置、以及它们的制造方法 - Google Patents
布线部件、带树脂的金属部件及树脂密封半导体装置、以及它们的制造方法 Download PDFInfo
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- CN101038882A CN101038882A CNA2007100854219A CN200710085421A CN101038882A CN 101038882 A CN101038882 A CN 101038882A CN A2007100854219 A CNA2007100854219 A CN A2007100854219A CN 200710085421 A CN200710085421 A CN 200710085421A CN 101038882 A CN101038882 A CN 101038882A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (29)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006058457 | 2006-03-03 | ||
JP2006058457 | 2006-03-03 | ||
JP2006208763 | 2006-07-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101038882A true CN101038882A (zh) | 2007-09-19 |
CN100585819C CN100585819C (zh) | 2010-01-27 |
Family
ID=38889670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710085421A Active CN100585819C (zh) | 2006-03-03 | 2007-03-05 | 布线部件、金属部件、半导体装置、以及它们的制造方法 |
Country Status (1)
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CN (1) | CN100585819C (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101740711A (zh) * | 2009-12-16 | 2010-06-16 | 东莞市宏磊达电子塑胶有限公司 | 大功率led支架 |
CN102150263A (zh) * | 2008-11-06 | 2011-08-10 | 松下电器产业株式会社 | 引线、布线部件、封装部件、带有树脂的金属部件和树脂封装半导体装置以及它们的制造方法 |
CN102449797A (zh) * | 2009-05-29 | 2012-05-09 | 欧司朗光电半导体有限公司 | 电子元件以及制造电子元件的方法 |
TWI488345B (zh) * | 2010-12-03 | 2015-06-11 | Hon Hai Prec Ind Co Ltd | 發光二極管導線架 |
CN106030770A (zh) * | 2014-02-27 | 2016-10-12 | 株式会社电装 | 树脂成型体及其制造方法 |
CN111630401A (zh) * | 2018-01-26 | 2020-09-04 | 三菱电机株式会社 | 半导体装置以及电力变换装置 |
CN112864047A (zh) * | 2019-11-12 | 2021-05-28 | 美光科技公司 | 具有封装级划区屏蔽的半导体装置及相关联的系统和方法 |
CN113207232A (zh) * | 2021-04-30 | 2021-08-03 | 东莞市五株电子科技有限公司 | 一种三维pcb的制作方法及pcb |
CN115346928A (zh) * | 2022-08-22 | 2022-11-15 | 四川华尔科技有限公司 | 一种电路封装装置及封装工艺 |
-
2007
- 2007-03-05 CN CN200710085421A patent/CN100585819C/zh active Active
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102150263A (zh) * | 2008-11-06 | 2011-08-10 | 松下电器产业株式会社 | 引线、布线部件、封装部件、带有树脂的金属部件和树脂封装半导体装置以及它们的制造方法 |
US8723298B2 (en) | 2008-11-06 | 2014-05-13 | Panasonic Corporation | Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing the same |
US9203042B2 (en) | 2009-05-29 | 2015-12-01 | Osram Opto Semiconductors Gmbh | Electronic component and method for producing an electronic component |
CN102449797A (zh) * | 2009-05-29 | 2012-05-09 | 欧司朗光电半导体有限公司 | 电子元件以及制造电子元件的方法 |
CN102449797B (zh) * | 2009-05-29 | 2014-08-06 | 欧司朗光电半导体有限公司 | 电子元件以及制造电子元件的方法 |
CN101740711B (zh) * | 2009-12-16 | 2013-01-23 | 广东宏磊达光电科技有限公司 | 大功率led支架 |
CN101740711A (zh) * | 2009-12-16 | 2010-06-16 | 东莞市宏磊达电子塑胶有限公司 | 大功率led支架 |
TWI488345B (zh) * | 2010-12-03 | 2015-06-11 | Hon Hai Prec Ind Co Ltd | 發光二極管導線架 |
CN106030770A (zh) * | 2014-02-27 | 2016-10-12 | 株式会社电装 | 树脂成型体及其制造方法 |
CN106030770B (zh) * | 2014-02-27 | 2019-06-18 | 株式会社电装 | 树脂成型体及其制造方法 |
CN111630401A (zh) * | 2018-01-26 | 2020-09-04 | 三菱电机株式会社 | 半导体装置以及电力变换装置 |
CN111630401B (zh) * | 2018-01-26 | 2022-09-16 | 三菱电机株式会社 | 半导体装置以及电力变换装置 |
CN112864047A (zh) * | 2019-11-12 | 2021-05-28 | 美光科技公司 | 具有封装级划区屏蔽的半导体装置及相关联的系统和方法 |
CN113207232A (zh) * | 2021-04-30 | 2021-08-03 | 东莞市五株电子科技有限公司 | 一种三维pcb的制作方法及pcb |
CN115346928A (zh) * | 2022-08-22 | 2022-11-15 | 四川华尔科技有限公司 | 一种电路封装装置及封装工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN100585819C (zh) | 2010-01-27 |
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Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20070919 Assignee: Matsushita semiconductor component (Suzhou) Co.,Ltd. Assignor: Panasonic semiconductor discrete device Co.,Ltd. Contract record no.: 2013990000219 Denomination of invention: Wiring member, metal part and semiconductor device, and manufacturing method Granted publication date: 20100127 License type: Common License Record date: 20130510 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Osaka, Japan Patentee after: Panasonic Holding Co.,Ltd. Address before: Osaka, Japan Patentee before: Matsushita Electric Industrial Co.,Ltd. |