CN1010275B - 在涂敷焊料时夹持电气或电子元件的装置 - Google Patents
在涂敷焊料时夹持电气或电子元件的装置Info
- Publication number
- CN1010275B CN1010275B CN87105718A CN87105718A CN1010275B CN 1010275 B CN1010275 B CN 1010275B CN 87105718 A CN87105718 A CN 87105718A CN 87105718 A CN87105718 A CN 87105718A CN 1010275 B CN1010275 B CN 1010275B
- Authority
- CN
- China
- Prior art keywords
- support member
- leg
- upper support
- carrier
- lower support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 2
- 239000000463 material Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB868616938A GB8616938D0 (en) | 1986-07-11 | 1986-07-11 | Holding electrical/electronic components |
| GB8616938 | 1986-07-11 | ||
| GB8616939 | 1986-07-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN87105718A CN87105718A (zh) | 1988-04-27 |
| CN1010275B true CN1010275B (zh) | 1990-10-31 |
Family
ID=10600900
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN87105718A Expired CN1010275B (zh) | 1986-07-11 | 1987-07-10 | 在涂敷焊料时夹持电气或电子元件的装置 |
| CN87106046A Expired CN1010392B (zh) | 1986-07-11 | 1987-07-10 | 钎焊装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN87106046A Expired CN1010392B (zh) | 1986-07-11 | 1987-07-10 | 钎焊装置 |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US4796158A (enExample) |
| EP (1) | EP0252770B1 (enExample) |
| KR (1) | KR910009773B1 (enExample) |
| CN (2) | CN1010275B (enExample) |
| AT (1) | ATE54226T1 (enExample) |
| CA (1) | CA1282154C (enExample) |
| DE (1) | DE3763471D1 (enExample) |
| ES (1) | ES2016627B3 (enExample) |
| GB (1) | GB8616938D0 (enExample) |
| GR (1) | GR3000594T3 (enExample) |
| IN (1) | IN169943B (enExample) |
| MY (1) | MY101265A (enExample) |
| PH (1) | PH24825A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283598A (ja) * | 1992-03-31 | 1993-10-29 | Rohm Co Ltd | テーピング済電子部品及び電子部品のテーピング方法 |
| US5237829A (en) * | 1992-07-29 | 1993-08-24 | Japan Servo Co., Ltd. | Ice-making machine having thermal relay |
| JP3056499U (ja) * | 1998-08-06 | 1999-02-16 | 船井電機株式会社 | パーツホルダおよびプリント配線板 |
| JP2006202804A (ja) * | 2005-01-18 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 電子部品実装システムおよび電子部品搭載装置ならびに電子部品実装方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2836493C2 (de) * | 1978-08-21 | 1979-11-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Leiterplattenhalterung |
| GB8419420D0 (en) * | 1984-07-30 | 1984-09-05 | Sun Ind Coatings | Holding electronic components during application of solder |
| JPS6136363U (ja) * | 1984-07-31 | 1986-03-06 | 株式会社 タムラ製作所 | 被はんだ付け物整列支持用の治具 |
| DE8603215U1 (de) * | 1986-02-07 | 1986-05-15 | Helba Elektronik-Baugruppen Gmbh & Co Kg | Aufnahmevorrichtung für Lötbäder |
| US4700935A (en) * | 1986-02-07 | 1987-10-20 | Winslow Russell T | Fixture for wave soldering packaged integrated circuits |
-
1986
- 1986-07-11 GB GB868616938A patent/GB8616938D0/en active Pending
-
1987
- 1987-07-09 MY MYPI87000972A patent/MY101265A/en unknown
- 1987-07-10 CN CN87105718A patent/CN1010275B/zh not_active Expired
- 1987-07-10 IN IN583/DEL/87A patent/IN169943B/en unknown
- 1987-07-10 US US07/072,036 patent/US4796158A/en not_active Expired - Fee Related
- 1987-07-10 CA CA000541780A patent/CA1282154C/en not_active Expired - Fee Related
- 1987-07-10 CN CN87106046A patent/CN1010392B/zh not_active Expired
- 1987-07-11 KR KR1019870007486A patent/KR910009773B1/ko not_active Expired
- 1987-07-13 ES ES87306186T patent/ES2016627B3/es not_active Expired - Lifetime
- 1987-07-13 AT AT87306186T patent/ATE54226T1/de not_active IP Right Cessation
- 1987-07-13 EP EP87306186A patent/EP0252770B1/en not_active Expired - Lifetime
- 1987-07-13 DE DE8787306186T patent/DE3763471D1/de not_active Expired - Fee Related
- 1987-07-13 PH PH35527A patent/PH24825A/en unknown
-
1990
- 1990-06-28 GR GR90400410T patent/GR3000594T3/el unknown
Also Published As
| Publication number | Publication date |
|---|---|
| ATE54226T1 (de) | 1990-07-15 |
| CN87105718A (zh) | 1988-04-27 |
| IN169943B (enExample) | 1992-01-18 |
| PH24825A (en) | 1990-10-30 |
| EP0252770A3 (en) | 1988-09-28 |
| US4796158A (en) | 1989-01-03 |
| CN87106046A (zh) | 1988-04-13 |
| GR3000594T3 (en) | 1991-07-31 |
| EP0252770B1 (en) | 1990-06-27 |
| CA1282154C (en) | 1991-03-26 |
| KR880002421A (ko) | 1988-04-30 |
| DE3763471D1 (de) | 1990-08-02 |
| CN1010392B (zh) | 1990-11-14 |
| ES2016627B3 (es) | 1990-11-16 |
| MY101265A (en) | 1991-08-17 |
| KR910009773B1 (ko) | 1991-11-29 |
| EP0252770A2 (en) | 1988-01-13 |
| GB8616938D0 (en) | 1986-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C13 | Decision | ||
| GR02 | Examined patent application | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |