CN101023535B - 发光装置与使用该发光装置的背照光及液晶显示装置 - Google Patents
发光装置与使用该发光装置的背照光及液晶显示装置 Download PDFInfo
- Publication number
- CN101023535B CN101023535B CN2005800314135A CN200580031413A CN101023535B CN 101023535 B CN101023535 B CN 101023535B CN 2005800314135 A CN2005800314135 A CN 2005800314135A CN 200580031413 A CN200580031413 A CN 200580031413A CN 101023535 B CN101023535 B CN 101023535B
- Authority
- CN
- China
- Prior art keywords
- light
- fluorophor
- emitting
- emitting device
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7734—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7737—Phosphates
- C09K11/7738—Phosphates with alkaline earth metals
- C09K11/7739—Phosphates with alkaline earth metals with halogens
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
- C09K11/7784—Chalcogenides
- C09K11/7787—Oxides
- C09K11/7789—Oxysulfides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004274857 | 2004-09-22 | ||
JP274857/2004 | 2004-09-22 | ||
PCT/JP2005/016556 WO2006033239A1 (ja) | 2004-09-22 | 2005-09-08 | 発光装置とそれを用いたバックライトおよび液晶表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101023535A CN101023535A (zh) | 2007-08-22 |
CN101023535B true CN101023535B (zh) | 2010-06-02 |
Family
ID=36090002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800314135A Active CN101023535B (zh) | 2004-09-22 | 2005-09-08 | 发光装置与使用该发光装置的背照光及液晶显示装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8154190B2 (zh) |
EP (1) | EP1796181B1 (zh) |
JP (2) | JP5086641B2 (zh) |
KR (1) | KR100880757B1 (zh) |
CN (1) | CN101023535B (zh) |
TW (1) | TWI289229B (zh) |
WO (1) | WO2006033239A1 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8395725B2 (en) * | 2006-01-19 | 2013-03-12 | Kabushiki Kaisha Toshiba | Light emitting module, backlight using the same, and liquid crystal display device |
EA200870494A1 (ru) | 2006-05-02 | 2009-06-30 | Супербалбс, Инк. | Пластмассовая светодиодная лампа |
AU2007248756A1 (en) | 2006-05-02 | 2007-11-15 | Carol Lenk | Method of light dispersion and preferential scattering of certain wavelengths of light for light-emitting diodes and bulbs constructed therefrom |
JP2007335495A (ja) * | 2006-06-13 | 2007-12-27 | Fujikura Ltd | 発光体とその製造方法 |
TWI418054B (zh) * | 2006-08-08 | 2013-12-01 | Lg Electronics Inc | 發光裝置封裝與製造此封裝之方法 |
JP2008091458A (ja) * | 2006-09-29 | 2008-04-17 | Rohm Co Ltd | 照明素子の評価方法 |
JP5367218B2 (ja) | 2006-11-24 | 2013-12-11 | シャープ株式会社 | 蛍光体の製造方法および発光装置の製造方法 |
EP2175006B1 (en) | 2007-07-09 | 2013-07-24 | Sharp Kabushiki Kaisha | Group of phosphor particles, and light-emitting device using the same |
JP5405467B2 (ja) * | 2007-08-31 | 2014-02-05 | エルジー イノテック カンパニー リミテッド | 発光デバイスパッケージ |
JP2011501464A (ja) * | 2007-10-24 | 2011-01-06 | テオス・インコーポレイテッド | Led光源用拡散器 |
WO2009093427A1 (ja) * | 2008-01-21 | 2009-07-30 | Nichia Corporation | 発光装置 |
WO2009110285A1 (ja) | 2008-03-03 | 2009-09-11 | シャープ株式会社 | 発光装置 |
WO2010021676A1 (en) | 2008-08-18 | 2010-02-25 | Superbulbs, Inc. | Anti-reflective coatings for light bulbs |
JP5217800B2 (ja) | 2008-09-03 | 2013-06-19 | 日亜化学工業株式会社 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
JP5416946B2 (ja) * | 2008-11-05 | 2014-02-12 | 株式会社東芝 | 蛍光体溶液 |
US20100157492A1 (en) * | 2008-12-23 | 2010-06-24 | General Electric Company | Electronic device and associated method |
WO2011083671A1 (ja) | 2010-01-08 | 2011-07-14 | シャープ株式会社 | 蛍光体、発光装置およびそれを用いた液晶表示装置 |
JP5580100B2 (ja) * | 2010-04-09 | 2014-08-27 | 株式会社朝日Fr研究所 | 半導体発光装置の製造方法または半導体発光ダイオードの製造方法 |
TW201227092A (en) | 2010-12-31 | 2012-07-01 | Ind Tech Res Inst | Mixing light module |
WO2013061943A1 (ja) * | 2011-10-24 | 2013-05-02 | 株式会社東芝 | 白色光源およびそれを用いた白色光源システム |
JP6275399B2 (ja) | 2012-06-18 | 2018-02-07 | エルジー イノテック カンパニー リミテッド | 照明装置 |
JP5843016B2 (ja) * | 2012-07-27 | 2016-01-13 | コニカミノルタ株式会社 | Led装置及びその製造方法 |
WO2014054290A1 (ja) * | 2012-10-04 | 2014-04-10 | 株式会社 東芝 | 白色発光装置、照明装置、および歯科用照明装置 |
CN103791288A (zh) * | 2014-01-14 | 2014-05-14 | 北京牡丹视源电子有限责任公司 | 一种激光灯条、由激光灯条构成的背光模组及显示器 |
US10306729B2 (en) * | 2016-04-19 | 2019-05-28 | Apple Inc. | Display with ambient-adaptive backlight color |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6352736A (ja) * | 1986-08-20 | 1988-03-05 | Hitachi Chem Co Ltd | シエルモ−ルド用樹脂粘結剤 |
JPH0962205A (ja) * | 1995-08-23 | 1997-03-07 | Toshiba Corp | Ledマトリクス表示器 |
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
US6319425B1 (en) * | 1997-07-07 | 2001-11-20 | Asahi Rubber Inc. | Transparent coating member for light-emitting diodes and a fluorescent color light source |
JP2000031530A (ja) | 1998-07-14 | 2000-01-28 | Toshiba Electronic Engineering Corp | 半導体発光装置およびその製造方法 |
JP3949290B2 (ja) * | 1998-08-31 | 2007-07-25 | 株式会社東芝 | 表示装置 |
US6621211B1 (en) | 2000-05-15 | 2003-09-16 | General Electric Company | White light emitting phosphor blends for LED devices |
JP4101468B2 (ja) | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
JP3749243B2 (ja) * | 2001-09-03 | 2006-02-22 | 松下電器産業株式会社 | 半導体発光デバイス,発光装置及び半導体発光デバイスの製造方法 |
JP2003160785A (ja) * | 2001-11-27 | 2003-06-06 | Toshiba Corp | 赤色発光蛍光体とそれを用いた発光装置 |
JP2003197979A (ja) * | 2001-12-28 | 2003-07-11 | Okaya Electric Ind Co Ltd | 発光素子 |
JP4113017B2 (ja) * | 2002-03-27 | 2008-07-02 | シチズンホールディングス株式会社 | 光源装置および表示装置 |
JP2003318447A (ja) | 2002-04-24 | 2003-11-07 | Toshiba Lighting & Technology Corp | 発光ダイオードおよびled照明装置 |
JP3910517B2 (ja) * | 2002-10-07 | 2007-04-25 | シャープ株式会社 | Ledデバイス |
JP4306224B2 (ja) * | 2002-10-31 | 2009-07-29 | パナソニック電工株式会社 | 発光装置の製造方法 |
JP4207537B2 (ja) * | 2002-11-08 | 2009-01-14 | 日亜化学工業株式会社 | 蛍光体および発光装置 |
JP2004221163A (ja) * | 2003-01-10 | 2004-08-05 | Nichia Chem Ind Ltd | 発光装置およびその形成方法、並びにその発光装置を用いた面状発光装置 |
US20050211991A1 (en) * | 2004-03-26 | 2005-09-29 | Kyocera Corporation | Light-emitting apparatus and illuminating apparatus |
JP4880887B2 (ja) * | 2004-09-02 | 2012-02-22 | 株式会社東芝 | 半導体発光装置 |
-
2005
- 2005-09-08 CN CN2005800314135A patent/CN101023535B/zh active Active
- 2005-09-08 WO PCT/JP2005/016556 patent/WO2006033239A1/ja active Application Filing
- 2005-09-08 KR KR1020077009039A patent/KR100880757B1/ko active IP Right Grant
- 2005-09-08 JP JP2006536340A patent/JP5086641B2/ja active Active
- 2005-09-08 EP EP05778574.3A patent/EP1796181B1/en active Active
- 2005-09-08 US US11/575,630 patent/US8154190B2/en active Active
- 2005-09-09 TW TW094131159A patent/TWI289229B/zh active
-
2012
- 2012-06-06 JP JP2012128785A patent/JP2012209565A/ja active Pending
Non-Patent Citations (1)
Title |
---|
JP平9-62205A 1997.03.07 |
Also Published As
Publication number | Publication date |
---|---|
US20070215892A1 (en) | 2007-09-20 |
CN101023535A (zh) | 2007-08-22 |
US8154190B2 (en) | 2012-04-10 |
JP5086641B2 (ja) | 2012-11-28 |
EP1796181A1 (en) | 2007-06-13 |
WO2006033239A1 (ja) | 2006-03-30 |
KR100880757B1 (ko) | 2009-02-02 |
TWI289229B (en) | 2007-11-01 |
EP1796181B1 (en) | 2020-02-19 |
JPWO2006033239A1 (ja) | 2008-05-15 |
JP2012209565A (ja) | 2012-10-25 |
TW200619780A (en) | 2006-06-16 |
KR20070054733A (ko) | 2007-05-29 |
EP1796181A4 (en) | 2010-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101023535B (zh) | 发光装置与使用该发光装置的背照光及液晶显示装置 | |
US7961762B2 (en) | White light-emitting lamp and illuminating device using the same | |
CN101137737B (zh) | 白色发光灯及使用它的背光源、显示装置及照明装置 | |
KR101156898B1 (ko) | 조명용 백색 발광 램프와 그것을 사용한 조명 기구 | |
JP5398141B2 (ja) | 白色発光型ledランプおよびそれを用いたバックライト並びに液晶表示装置 | |
CN102812568B (zh) | 白光发射灯和包括该白光发射灯的白色led照明装置 | |
JP2015159325A (ja) | 半導体発光装置、この半導体発光装置からなるバックライトおよび表示装置 | |
JP2008166825A (ja) | 白色発光装置及びこれを用いたlcdバックライト用光源モジュール | |
JP4965840B2 (ja) | 白色発光型ledランプの製造方法およびそれを用いたバックライトの製造方法並びに液晶表示装置の製造方法 | |
JP5063938B2 (ja) | 橙色発光蛍光体 | |
TWI463690B (zh) | A semiconductor light emitting device, and a semiconductor light emitting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210714 Address after: Kanagawa Prefecture, Japan Patentee after: TOSHIBA MATERIALS Co.,Ltd. Address before: Tokyo, Japan Patentee before: Toshiba Corp. Patentee before: TOSHIBA MATERIALS Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220119 Address after: Gyeonggi Do, South Korea Patentee after: Seoul Semiconductor Co.,Ltd. Address before: Kanagawa Patentee before: TOSHIBA MATERIALS Co.,Ltd. |
|
TR01 | Transfer of patent right |