CN101005921B - Polishing apparatus and polishing method - Google Patents

Abstract

The polishing apparatus capable of accurately chamfering the end face parts of a large-sized substrate is installed on a table unit in which the substrate is placed. The substrate is fixedly held on the table unit (60) under a specified reference condition. A first polishing unit (40a) comprises a polishing grinding wheel polishing the end faces of the substrate held on the table unit (60) and a substrate side edge part support means supporting the side edge part lower surface of the substrate near the end faces of the substrate polished by the polishing grinding wheel. The first polishing unit (40a) is moved by a first polishing unit moving means (85A) along the end faces of the substrate together with the substrate side edge part support means under the condition that the polishing grinding wheel polishes the end faces of the substrate.

Description

Lapping device and Ginding process

Technical field

The present invention is about a kind of lapping device and Ginding process that is used for grinding the end face of substrate outer lateral side.

Background technology

Brittle bases such as semiconductor crystal wafer, glass substrate, quartz base plate, ceramic substrate need carry out the processing of chamfering of substrate end-face usually.Again, the adhesive substrates with fitting and form between the monolithic substrate also need carry out the processing of chamfering of each substrate end-face.This adhesive substrates particularly is usually used in using panel for the LCD of a kind of flat-panel screens (FPD) (LCD).Again, adhesive substrates also is used in and is plasma display panel panel (PDP), the organic EL panel of LCD (LCD) with the FPD beyond the panel, or is used in permeation type liquid crystal projector substrate that liquid crystal projector includes, reflective liquid crystal projector substrate etc.Moreover adhesive substrates also is used in Field Emission Display (FED).The adhesive substrates of this kind purposes, large-scale substrate as the LCD that its size is used from mobile phone is used, used to display to TV with substrate small-sized as the panel has size miscellaneous.Adhesive substrates is divided into both sizings from large-scale mother substrate, to make each FPD.In the manufacturing of FPD, the yield that the segmentation procedure of adhesive substrates and face are got step is reflected on the manufacturing cost of FPD.

Among the present invention,, be that example describes with the glass substrate and the glass adhering substrate of monolithic as an example of above-mentioned various substrates.Figure 23 and Figure 24 are respectively mother liquor crystal panel from large tracts of land and are divided into LCD (LCD) that indivedual units form vertical view and the side view with panel D.This LCD (LCD) intersperses among distance piece with panel D any one of 2 sheet glass substrate G1 and G2, two substrates is fitted each other, between two substrates, form clearance portion, inject liquid crystal L in this clearance portion, then, liquid crystal L is sealed and forms with clearance portion sealing material V.Be formed with the electric crystal 20 that is used for driving individual pixel in the glass substrate G2 of downside.The electrode terminal 21 of each electric crystal 20 input terminal, as the outside connect with and be formed at the side edge part Q of downside glass substrate G2.The side edge part Q of glass substrate G2 reveals and does well, and is not covered by upside glass substrate G1.Electrode terminal 21 is as the input terminal of each electric crystal 20, to be connected in external circuit.

Again, for fear of electric crystal 20 because of resulting from the static insulation breakdown of substrate surface in the manufacturing step, with each electrode terminal 21 to be formed at the short-circuiting electrode 22 mutual short circuits on the side edge part Q.Be provided with the glass substrate G2 of short-circuiting electrode 22, in the terminal stage of LCD (LCD) with panel D processing procedure, cut off (cutting apart) along the cut (ruling or line of cut) 23 that is formed between each electrode terminal 21 and the short-circuiting electrode 22, cut side edge part Q in the width W of glass substrate G2.Therefore, remove the short circuit that 22 pairs of each electrode terminals 21 of short-circuiting electrode cause each other.Figure 25 shows the schematic isometric of the procedure of processing of glass substrate G2 side edge part Q.According to Figure 25 this processing method is described.

Shown in Figure 25 (A), be formed with the short-circuiting electrode 22 of the mutual short circuit of each terminal that is used for making most electrode terminals 21 with the side edge part Q of the glass substrate G2 on one side of panel D in LCD (LCD).In the terminal stage of LCD (LCD), shown in Figure 25 (B), between each electrode terminal 21 and short circuit portion 22, form cut 23 along short-circuiting electrode 22 with panel D processing procedure.Again, cut off along cut 23, by this, shown in Figure 25 (C), the short-circuiting electrode 22 of the side edge part Q of glass substrate G2 is severed.Secondly, shown in Figure 25 (D), end face 24 to glass substrate G2 grinds, the end face 24 that will be formed with the glass substrate G2 of electrode terminal 21 is ground, and to chamfering (slightly chamfering) processing in the edge 25 that the surface of the glass substrate G2 that is formed with electrode terminal 21 is contacted with end face 24.

To each edge 26 on the vertical direction of glass substrate G2 end face 24 both sides, also chamfer processing by grinding again.Shown in Figure 25 (D), the reasons are as follows of each edge of grinding glass substrate G2 end face 24.

That is, when making LCD with FPD such as panels, female adhesive substrates that baseplate-laminating is formed is rule and is cut off, be divided into panel substrate, in each panel substrate that is partitioned into, cut both sides (the base board end surface edge part that the is partitioned into) residual stress that can when using marking knife to rule, form.This residual stress will become in line and cut off and carry out the reason that the back produces fragment etc., and it is bad to form goods after goodsization.Therefore,, chamfer processing in modes such as grindings, remove the residual part that residual stress is arranged by this in the line and the base board end surface of cutting off after carrying out for the substrate that is partitioned into.At the processing procedure use wet lapping device of common LCD (LCD), prevent that amount of grinding from causing the harmful effect of heat more with panel again.

Above-mentioned attrition process is only ground the example of an end face to LCD (LCD) with panel, yet in LCD (LCD) the usefulness actual processing procedure of panel, must grind 2 end faces or 3 end faces sometimes.In addition, look purposes and need grind 4 all end faces sometimes.

Disclose in the patent documentation 1 (Japanese kokai publication hei 8-197402 communique) to have and be used for grinding the lapping device of LCD with the panel end face.In this lapping device, be provided with and be used for the glass substrate that is placed in the both allocations on the absorption microscope carrier unit is ground respectively 4 grinders of each end face; Make each grinder edge of butt end face to be ground respectively, move along each edge simultaneously, by this each edge is ground simultaneously and chamfer processing.This lapping device possesses: be used for further attracting LCD after the fixed in position with the absorption microscope carrier unit of panel (workpiece), be used for making absorption microscope carrier unit toward along the directions X of horizontal direction and the Y direction moves and on X-Y (horizontal direction) plane along the microscope carrier cell moving mechanism of X-Y plane anglec of rotation θ and be used for taking and be placed in the CCD camera that adsorbs the appended alignment mark of workpiece on the microscope carrier unit.Moreover this lapping device possesses position registration mechanism, uses the position degrees of offset from the image data identification workpiece of CCD camera, and moves absorption microscope carrier unit in the mode that compensates this position offset with microscope carrier cell moving mechanism.Moreover this lapping device possesses: be used for making grinder feed mechanism that 4 each grinders move toward all directions of X, Y, Z, be used for making the grinder corresponding with the edge of the workpiece of processing object to move and grinder travel mechanism of grinding and the control part that is used for controlling this grinder travel mechanism simultaneously along each edge.

According to this lapping device, when 4 edges of grinding work-piece, fixation workpiece grinds Yi Bian each edge, 4 grinder one edges is moved.Therefore, can significantly shorten and grind the required time, grind at every turn, needn't carry out workpiece movement and rotation, so can under the situation that does not cause the position to be offset, grind with high accuracy because of workpiece movement etc.Because of can on 1 microscope carrier unit, carrying out the attrition process of all end faces,, do not need broad space, and can realize miniaturization so the device that is used for rotating the microscope carrier unit must be set again.

Again, the C that C is chamfered and R is chamfered, base board end surface forms the edge on the vertical direction each other at edge on the horizontal direction on base board end surface and surface is chamfered and R is chamfered and the marginal portion of substrate end-face attrition process in addition, all be called in the following description and chamfer processing.

Figure 26 is used for substrate end-face done chamfers the explanation side view of wanting portion formation of another known lapping device of processing.This lapping device 30 possesses grinding unit 31 and is used for adsorbing the microscope carrier 32 of the substrate 33 that keeps chamfering processing object.Microscope carrier 32 keeps rectangular substrate in the mode of vacuum suction, can rotate angle θ arbitrarily around vertical axis by not shown rotating mechanism.The rotating basis of not shown rotating mechanism is fixed in the bottom of microscope carrier 32.

Grinding unit 31 possesses: Spindle Motor 34, have rotatable grinding stone aggregate 35 grinding head 36, be used for taking a pair of camera 37 such as CCD camera of a pair of alignment mark of being located at substrate 33 and be used for grinding head travel mechanism 38 that grinding head 36 is moved up and down.Again, this lapping device 30 is one side to establish vertical direction be Z-direction, what establish microscope carrier 32 relative grinding units 31 places is Y direction, the direction of establishing respectively with Z-direction and Y direction quadrature is an X-direction.Grinding head travel mechanism 38 makes grinding head 36 move toward Z-direction, positions, and makes grinding stone aggregate 35 to be rotated be positioned at the abrasion site of relative substrate edges 33a.Again, the grinding unit 31 with grinding head travel mechanism 38 independently moves respectively toward X-direction and Y direction by not shown grinding unit travel mechanism.Again, grinding unit 31 makes the set grinding stone 35i of rotatable grinding stone aggregate 35 be connected to substrate 33 by not shown control part, and moves with the state of the rotation edge 33a along substrate 33.

Grinding stone aggregate 35 have be separately an approximate discoid majority grinding stone 35i (i=1,2..n); Each grinding stone 35i is held in coaxial state by back shaft and stacks multistage.Each grinding stone 35i be chamfer processing usefulness grinding stone; The reason of being arranged to multistage with laminated state is the time that adds man-hour chamfering in order to shorten, and for example must change required time because of the abrasive wear of the abradant surface of each grinding stone 35i.Grinding stone aggregate 35, abradant surface wearing and tearing at grinding stone 35i, can't be chamfered in the edge of the end face 33a of substrate 33 when being processed into set shape, the back shaft of grinding stone 35i promptly by grinding head travel mechanism 38 with both determining deviations by the migration Z-direction, chamfer processing with the new grinding stone face of unworn grinding stone 35i.If making the hop count of grinding stone 35i is n, then along with the wearing and tearing of grinding stone 35i are carried out, the 1st section ... the i section ... the abradant surface lifting in regular turn of the grinding stone member 35i of n section is to grind the end face 33a of substrate 33.

A pair of camera 37, each mark of a pair of alignment mark of substrate is located in shooting.The control part of lapping device 30 (not shown) makes the memory body of being located at control part remember the position information of a pair of alignment mark.At the loading surface of microscope carrier 32, be that (Z0), then (X0 Y0) is provided with into a point-symmetric majority attraction groove for the center with the center in microscope carrier 32 for X0, Y0 if make the coordinate of its center (benchmark) position S; The attraction groove that makes this microscope carrier 32 is by attraction mechanisms such as vavuum pump or suction pumps and be negative pressure state, and the substrate 33 of processing object of will chamfering is by this fixed in the mode of vacuum suction.

Moreover, disclose in the patent documentation 2 (Japanese kokai publication hei 10-58293 communique) to have and be used for the lapping device of grinding glass substrate end face, wherein, this lapping device has the function of cleaning the suspension that is contained in the grounds travel that produces when grinding.In this lapping device, the microscope carrier unit can rotate under level; Relative with the edge of the workpiece both sides of being fixed in this microscope carrier unit to mode be provided with 2 grinders.Again, be connected at the grinding stone of each grinder under the state at edge of workpiece both sides and make the microscope carrier cell moving, by this, grind each edge of substrate with grinding stone.Finish when grinding, though microscope carrier unit half-twist, a pair of edge of residue that does not grind of grinding work-piece.By this, the attrition process at all edges of workpiece is finished.

Again, disclose in the patent documentation 3 (TOHKEMY 2003-275955 communique) have a kind of with the large-area mother liquor crystal panel unit of cutting into LCD with panel after, the units polish LCD is with the lapping device at the edge of panel.This lapping device is characterised in that: possess can with the unit LCD with the multiple big or small corresponding liquid crystal display panel grinding table of panel.This lapping device has can be according to big or small most the grinding table parts mutually moving of unit LCD with panel.

Patent documentation 1: Japanese kokai publication hei 8-197402 communique

Patent documentation 2: Japanese kokai publication hei 10-58293 communique

Patent documentation 3: TOHKEMY 2003-275955 communique

Summary of the invention

Recently, also require the big panel of display area for FPD, therefore, the size of mother substrate panel also maximizes.The mother liquor crystal panel have use the 6th generation, the 7th generation panel trend.The size of substrate of the mother liquor crystal panel in the 6th generation for example is 1500mm * 1850mm; The size of substrate of the mother liquor crystal panel in the 7th generation for example is 1870mm * 2200mm.Be divided into the substrate that most LCDs are used panel at substrate with big or small like this mother liquor crystal panel, and the LCD that is partitioned into edge and the end face with the substrate of panel carried out under the situation of attrition process, the used microscope carrier unit of lapping device that requires to be disclosed in patent documentation 1 and 2 is large-scale microscope carrier.The top flatness of mounting substrate of being used for of guaranteeing large-scale microscope carrier unit has identical precision with the flatness of the microscope carrier unit of common size and is not easy, if mounting substrate and attract fixing base on fail to guarantee the microscope carrier of necessary flatness, promptly can be in base board end surface generation undulation etc.So, have at substrate under the state of undulation etc., possibly can't grind base board end surface with high accuracy.

Again, as shown in figure 27, if make microscope carrier 32 for small-sized, make large substrate 35 absorption be fixed in small-sized microscope carrier 32, the circumference of substrate 33 is just toward the below deflection.Add man-hour at chamfering of substrate 33, usually, as shown in figure 26, the edge 33a that wishes substrate 33 is fixed into substrate 33 is the about 5～15mm of loading surface of outstanding microscope carrier 32 outward.Yet if substrate 33 maximizes and slimming, as shown in figure 27, the part that the type if microscope carrier 32 diminishes, substrate 33 exceed microscope carrier 32 becomes big, and it is big that the deflection of this part also becomes.In the case, the edge 33a of relative substrate 33 to locate grinding stone aggregate 35 the to be rotated difficulty that becomes.Especially, if because of undulation takes place in the end face 33a of substrate 33, and make edge 33a non-certain with respect to the position of Z-direction, and then be not easy grinding stone 35i is positioned at the edge of substrate 33 and grinds continuously with high-precision fixed, can't carry out the good problem of processing of chamfering of precision and take place and have.

Again, though also can consider: cooperate the change of the size of substrate 33 to change to the microscope carrier 32 that varies in size, so that the about 5～15mm of loading surface of the side-prominent outward microscope carrier 32 of edge 33a of substrate 33; But in the case, required replacing time such as the replacing of microscope carrier 32 is elongated, and production efficiency reduces.

The lapping device of patent documentation 3 utilizes movably most microscope carriers, and all size of applicable substrate.Yet, under the situation that substrate is supported with most microscope carriers, the part of each microscope carrier supporting substrate of most microscope carriers, so can't supporting substrate comprehensive.Therefore, substrate deflection between each microscope carrier, and possibly can't be with all edges of non-deflecting mode supporting substrate.As a result, the lapping device of patent documentation 3 have can't carry out the good substrate of precision chamfer processing problem.

The present invention develops in view of above-mentioned known problem points, its purpose is: the substrate that a kind of applicable multiple size is provided, by for the large-size substrate periphery of the means of abrasion of supporting substrate end face unchangeably, but and precision is chamfered grinding unit, lapping device and the Ginding process of substrate end-face of processing goodly.

Lapping device of the present invention is characterized in that possessing: the microscope carrier unit is used for mounting substrate, with fixing this substrate that keeps of set normal condition; The 1st grinding unit possesses the grinding stone that is used for grinding this base board end surface that this microscope carrier unit kept and is used for supporting substrate side edge part supporting mechanism below near the base board end surface of being ground by this grinding stone this substrate lateral margin portion; And the 1st grinding unit travel mechanism, grind at this grinding stone under the state of this end face of this substrate, the 1st grinding unit is moved with this substrate side edge part supporting mechanism this end face along this substrate.

Again, the present invention utilizes aforementioned lapping device to carry out the grinding of substrate end-face, it is characterized in that, comprises: keep step, in this this substrate of microscope carrier unit load, fix this substrate of maintenance by this microscope carrier unit with this normal condition; Support step, the side edge part of this substrate that this microscope carrier unit is kept, supported with this substrate side edge part supporting mechanism of the 1st grinding unit; And mobile step, under this grinding stone of the 1st grinding unit grinds by the state of this side edge part end face of this substrate side edge part supporting mechanism support, the 1st grinding unit is moved along this end face in grinding by the 1st grinding unit travel mechanism.

According to the present invention, support near the substrate side edge part the substrate end-face of processing to be ground because of the substrate side edge part supporting mechanism of the 1st grinding unit, so the working position to be ground of substrate end-face can be properly positioned to certain height; And because of substrate side edge part supporting mechanism moves with grinding stone, so, can under influencing, the undulation that is not subjected to substrate, deflection etc. carry out grinding operation for the attrition process of base board end surface.

Again, be used for the mechanism that kept above the side edge part of substrate because of further being provided with in the 1st grinding unit, so can prevent by grinding stone the grinding part that moves in regular turn when attrition process floats, therefore, grinding part can be determined with high-precision fixed, so, also can be under the influence of the displacement that is not subjected to the substrate thickness direction with good accuracy, carry out attrition process unchangeably.

Because of substrate side edge part supporting mechanism by low friction member come supporting substrate below, so substrate side edge part supporting mechanism is can supporting substrate side edge part limit, limit mobile swimmingly.

Because of substrate side edge part maintaining body by low friction member come supporting substrate below, so Yi Bian substrate side edge part maintaining body can be mobile swimmingly from sandwich with the substrate side edge part on one side with substrate side edge part supporting mechanism.

At low friction member is under the situation of free bearing, because of free bearing possessed big ball on one side with near the substrate side edge part of a grinding part of contact condition supporting substrate end face on one side swimmingly rotation move, so and the frictional resistance between below the substrate is little, again, because of unrestricted on the direction that below being connected to substrate, moves, so can prevent really that substrate is impaired.

Because of the microscope carrier unit possesses the center microscope carrier that is used for attracting keeping the central portion below the substrate, so, can prevent that still the rotation of substrate and position skew from taking place even if when attrition process, produce moment of torsion at substrate.

Because of having, the microscope carrier unit is disposed at this center microscope carrier most substrate supplemental support mechanisms on every side, to support the following sidepiece of the aforesaid base plate that remains in the center microscope carrier respectively, so even if substrate size is big, substrate supplemental support mechanism is supporting substrate between center microscope carrier and grinding unit still, and can prevent substrate generation deflection.

Because of the aforesaid base plate supplemental support mechanism of microscope carrier unit has the supplemental support platform that is used for supporting below the aforesaid base plate, this supplemental support platform by low friction member support aforesaid base plate below, so can below substrate, support in not hurtful mode.

Because of the following of aforesaid base plate of the aforesaid base plate supplemental support mechanism of aforementioned microscope carrier unit supported by free bearing, so under the situation of the center of substrate maintenance usefulness microscope carrier rotation, substrate is supported in the mode that does not cause position skew, can be not impaired below the substrate.

Because of the part setting below the aforesaid base plate of being used for being connected in aforesaid base plate supplemental support mechanism is used for vacuum attraction mechanism that attraction below the substrate is kept, so substrate can be kept firmly.As a result, big even if substrate size becomes, when the attrition process of end face portion, the moment of torsion of substrate becomes big relatively, and substrate rotation or position skew still can not take place.

Because of aforesaid base plate supplemental support mechanism possess be used for making aforementioned supplemental support platform slide near and leave the slide mechanism of aforementioned center microscope carrier, so can cooperate the position of the big minor change substrate supplemental support mechanism of substrate, therefore substrate can be supported with stable state.Again, because of corresponding to multiple size of substrate, so do not need to be used for changing the replacing preparation work of microscope carrier etc.

Further possesses the microscope carrier rotating mechanism that is used for making the microscope carrier rotation of aforementioned center because of aforementioned microscope carrier unit, even if rotate in the horizontal direction so load the substrate relative datum position that remains in the microscope carrier unit, still can be by making the rotation of microscope carrier unit, compensate the posture of substrate, make that the attrition process production line of substrate is parallel with the moving direction of grinding stone.

Because of being installed on the 1st grinding unit that has along the horizontal beam that end face was configured to of the aforesaid base plate that remains in aforementioned microscope carrier unit, aforementioned the 1st grinding unit and aforementioned the 1st grinding unit travel mechanism keep body, this grinding unit keeps body to move on the vertical direction of aforementioned levels beam, so needn't make the rotation of microscope carrier unit at grinding unit, just can grind 3 end faces of the substrate that is loaded into the microscope carrier unit.At least rotate 1 °, 90 ° or 180 ° because of making the microscope carrier unit, so can carry out 4 grindings of substrate again.Moreover, when grinding unit arrives the end of the end face just grinding, because of the suitable moving direction of setting grinding unit, thus can carry out the chamfering of corner part of substrate, moreover, the chamfering of corner part of substrate chamfered or R is chamfered for C.

Aforementioned lapping device further possesses the 2nd grinding unit and the 2nd grinding unit travel mechanism; The grinding stone and being used for that the 2nd grinding unit possesses the end face that is positioned at opposition side of the end face that is ground by aforementioned the 1st grinding unit that is used for grinding the aforesaid base plate that remains in aforementioned microscope carrier unit supports near the following substrate side edge part supporting mechanism of this substrate side edge part the base board end surface of being ground by this grinding stone; The 2nd grinding unit travel mechanism is used for making aforementioned the 2nd grinding unit, aforesaid base plate side edge part supporting mechanism grinding at aforementioned grinding stone that the aforementioned end face along aforesaid base plate moves under the state of end face of aforesaid base plate; Aforementioned the 2nd grinding unit and aforementioned the 2nd grinding unit travel mechanism are installed on to have with aforementioned the 1st grinding unit and keep the 2nd grinding unit of the 2nd horizontal beam of the aforementioned levels Liangping row of body to keep body; The 2nd grinding unit maintenance body can be parallel mobile on the vertical direction of aforementioned the 2nd horizontal beam; Therefore, can use the 1st and the 2nd grinding unit to come substrate is carried out attrition process.Again, when the 1st and the 2nd grinding unit arrives the end of the ongoing base board end surface of attrition process, suitably set the moving direction of each grinding unit, so also can carry out chamfering of substrate corner part simultaneously, chamfering of substrate corner part chamfered or R is chamfered for C again.

Aforementioned microscope carrier rotating mechanism makes aforementioned center microscope carrier be rotated into the set angle that the feasible aforementioned relatively normal condition of substrate that is loaded into aforementioned center microscope carrier is only rotated 30 °～60 ° scope; Aforementioned the 1st grinding unit and the 2nd grinding unit grind simultaneously respectively the substrate remain on the microscope carrier of postrotational center relatively to each end face, therefore, can under each grinding unit does not influence, not carry out carrying out grinding operation with good efficiencies.

Lapping device of the present invention is characterized in that possessing: the microscope carrier unit, be used for mounting substrate, and this substrate is maintained fixed with normal condition; 4 grinding units, possess the grinding stone of each end face that is used for grinding respectively the aforesaid base plate that remains in this microscope carrier unit respectively and be used for supporting respectively near aforementioned each end face of the aforesaid base plate that is ground by aforementioned each grinding stone, the following substrate side edge part supporting mechanism of aforesaid base plate side edge part; 4 cell moving mechanisms are used for making aforementioned each grinding unit to move with aforementioned each substrate side edge part supporting mechanism aforementioned each end face along aforesaid base plate under each grinding stone of aforementioned grinding stone is grinding the state of aforementioned each end face of aforesaid base plate respectively respectively; And 4 grinding unit feed mechanisms, be used for making aforementioned each grinding unit respectively near and leave on the direction of aforementioned each end face of aforesaid base plate and move; Therefore, can be by 4 grinding units, with 4 substrate end-faces, simultaneously and be not subjected to carry out attrition process unchangeably with good accuracy under the influence of displacement of substrate thickness direction.

Be respectively equipped with in aforementioned each grinding unit and be used for taking respectively the image of the alignment mark of being located at aforesaid base plate, and take the camera of the grinding part that aforementioned each grinding stone produces; This lapping device further possesses: image processor is used for image, data from resulting aforementioned alignment mark of aforementioned each camera and aforementioned grinding part are carried out computing; And control part, position information according to the aforementioned alignment mark after aforementioned image processor computing, come computing to be loaded into the gradient of the horizontal direction of counting from normal condition of the aforesaid base plate of aforementioned center cell, and the amount of grinding of aforementioned each end face of computing is controlled aforementioned each grinding unit feed mechanism respectively; By this, ask for the gradient of the substrate that is loaded into the microscope carrier unit,, chamfer processing and can do with high accuracy so grinding stone is moved along substrate end-face by computing.

Aforementioned each grinding unit has the air-blast device that is used for to aforementioned each camera spray air respectively between aforementioned each camera and aforementioned each grinding stone, so can take the image of grinding part with high accuracy.

According to Ginding process of the present invention, it comprises: keep step, in aforementioned microscope carrier unit load aforesaid base plate, by aforementioned microscope carrier unit aforesaid base plate is maintained fixed with aforementioned normal condition; Support step, with remain in the side edge part of the aforesaid base plate of aforementioned microscope carrier unit, aforementioned the 1st grinding unit supports by aforesaid base plate side edge part supporting mechanism; And mobile step, under the state that the end face of the side edge part that is supported by aforesaid base plate side edge part supporting mechanism grinds, aforementioned the 1st grinding unit is moved at the aforementioned grinding stone of aforementioned the 1st grinding unit along the end face that is grinding by aforementioned the 1st grinding unit travel mechanism; So, because of when the attrition process, grinding part can not float, and the grinding part limit can be positioned both allocation limit attrition process in regular turn with high accuracy, so processing that can precision is stabilized well under the influence of the displacement that is not subjected to the substrate thickness direction.

Has the attraction mechanism that is used for attracting the aforesaid base plate central portion because of aforementioned center microscope carrier; In aforementioned maintenance step,,, can prevent that still the rotation of substrate and position skew from taking place so, produce moment of torsion in substrate even if when attrition process by the aforementioned central portion that attracts mechanism to attract aforesaid base plate of aforementioned center microscope carrier.

The aforementioned microscope carrier unit of aforementioned lapping device has most substrate supplemental support mechanisms that are disposed at around this center microscope carrier, to support the following sidepiece of the aforesaid base plate that remains in aforementioned center microscope carrier respectively; In aforementioned maintenance step, the sidepiece below the aforesaid base plate that aforementioned center microscope carrier is maintained fixed is supported by at least 1 aforesaid base plate supplemental support mechanism.Therefore, big even if substrate size becomes, the substrate auxiliary support member is supporting substrate between center microscope carrier and grinding unit still, and can prevent substrate generation deflection.

The aforesaid base plate supplemental support mechanism of aforementioned lapping device have be used for making aforementioned supplemental support platform to slide and near and leave the slide mechanism of aforementioned center microscope carrier; In aforementioned maintenance step, the aforesaid base plate auxiliary support member is slided, and removes to be supported on the sidepiece of the aforesaid base plate that aforementioned center microscope carrier is maintained fixed.Therefore, can be at stable state supporting substrate.Do not need for example to change the such replacing preparation work of microscope carrier in order to be suitable for multiple size of substrate again.

The aforementioned microscope carrier unit of aforementioned lapping device further possesses the microscope carrier rotating mechanism that is used for making the microscope carrier rotation of aforementioned center; In aforementioned maintenance step, the rotation of the moving direction of aforementioned the 1st grinding unit that the aforementioned end face of aforesaid base plate is produced along aforementioned the 1st grinding unit travel mechanism by aforementioned rotating mechanism.Therefore, tilt toward horizontal direction from normal condition, still can compensate the posture of substrate, make that the machining production line of substrate is parallel with the moving direction of grinding stone by making center microscope carrier rotation even if remain in the substrate of center microscope carrier.

Aforementioned the 1st grinding unit of aforementioned lapping device and aforementioned the 1st grinding unit travel mechanism are installed on has the 1st grinding unit maintenance body that disposes the horizontal beam that forms along the end face of the aforesaid base plate that remains in aforementioned microscope carrier unit; The 1st grinding unit maintenance body can be parallel mobile on the vertical direction of aforementioned levels beam; In aforementioned mobile step, aforementioned the 1st grinding unit, moves by the 1st grinding unit keeps body when the aforementioned end face of aforesaid base plate moves by aforementioned the 1st grinding unit travel mechanism.Therefore, grinding stone is moved along substrate end-face.

Among the present invention, it is characterized in that: comprise: keep step,, this substrate is maintained fixed with normal condition by aforementioned microscope carrier unit in aforementioned microscope carrier unit load substrate; Support step, aforementioned the 1st grinding unit, the side edge part that remains in the aforesaid base plate of aforementioned microscope carrier unit are supported by aforesaid base plate side edge part supporting mechanism; And mobile step, under the state that the end surface grinding of the side edge part that is supported by aforesaid base plate side edge part supporting mechanism, aforementioned the 1st grinding unit is moved at the aforementioned grinding stone of aforementioned the 1st grinding unit along the end face that is grinding by aforementioned the 1st grinding unit travel mechanism; This Ginding process further comprises: after aforementioned maintenance step and before aforementioned mobile step, take the step of the set alignment mark of the aforesaid base plate that remains in aforementioned microscope carrier unit by aforementioned camera; Then, the image data of aforementioned alignment mark is handled by aforementioned image processor, and generated the step of the position information of aforementioned alignment mark; And then,, come the step of gradient of horizontal direction of the aforementioned relatively normal condition of computing aforesaid base plate according to the position information of the aforementioned alignment mark after handling at aforementioned image processor; In aforementioned mobile step, control aforementioned the 1st grinding unit according to the gradient after the aforementioned computing and keep moving of body, make aforementioned the 1st grinding unit move along the aforementioned end face of aforesaid base plate.By this, ask for the gradient of horizontal direction of the relative datum state of the substrate that is loaded into center microscope carrier or microscope carrier unit by computing, so grinding stone is moved along substrate end-face.

Again, among the present invention, it comprises: in aforementioned microscope carrier unit load aforesaid base plate, and the maintenance step that aforesaid base plate is maintained fixed with aforementioned normal condition by aforementioned microscope carrier unit; Then, make the step of set angle of the aforementioned relatively reference position of aforementioned microscope carrier unit rotation aforesaid base plate by aforementioned microscope carrier rotating mechanism; The support step that the relative side edge part that remains in the aforesaid base plate of aforementioned microscope carrier unit is supported by the aforesaid base plate side edge part supporting mechanism of each unit of aforementioned the 1st grinding unit and aforementioned the 2nd grinding unit; And grinding at the aforementioned grinding stone of each unit of aforementioned the 1st grinding unit and aforementioned the 2nd grinding unit under the state of end face of the side edge part that is supported by aforementioned each substrate side edge part supporting mechanism, keep body and keep body, the mobile step that aforementioned the 1st grinding unit and aforementioned the 2nd grinding unit are moved respectively along aforementioned each end face that is grinding by aforementioned the 1st grinding unit travel mechanism and the 1st grinding unit by aforementioned the 2nd grinding unit travel mechanism and the 2nd grinding unit.Therefore, the influence of aforementioned each grinding unit can be avoided really, and the stand-by time till attrition process finishes can be foreshortened to.Moreover, when grinding unit arrives end at the end face that carries out attrition process, suitably set the moving direction of grinding unit, thus also can carry out the chamfering of corner part of substrate simultaneously, and the chamfering of corner part of substrate chamfered or R is chamfered for C.

Angle because of 30 °～60 ° scope on the aforementioned set angle horizontal direction that is aforementioned relatively normal condition, so in advance with the set angle initialization of microscope carrier under the situation of the angle of 30 °, 45 °, 60 ° so easy execution computings, the moving direction of grinding stone that can the high-speed computation grinding unit, so, can foreshorten to the stand-by time till attrition process finishes.

Again, among the present invention, it comprises: keep step, in aforementioned microscope carrier unit load aforesaid base plate, by aforementioned microscope carrier unit aforesaid base plate is maintained fixed with aforementioned normal condition; Support step, the side edge part that remains in the aforesaid base plate of aforementioned microscope carrier unit is supported respectively by the aforesaid base plate side edge part supporting mechanism of aforementioned 4 grinding units; And mobile step, under the aforementioned grinding stone of aforementioned each grinding unit is grinding by the state of each end face of the side edge part of aforementioned each substrate side edge part supporting mechanism support, aforementioned each grinding unit is moved along the aforementioned end face that is grinding by aforementioned each grinding unit travel mechanism.Therefore, by 4 grinding units with 4 edge of substrate faces with simultaneously and the grinding part of aforesaid base plate end face portion be positioned both mode attrition process of allocation in regular turn with high accuracy, so can be under the influence of the displacement of the thickness direction that is not subjected to substrate, the processing of stabilizing with good accuracy.

In aforementioned mobile step, according to the image data of the aforementioned grinding part that obtains from aforementioned each camera, come the amount of grinding of aforementioned each end face of computing respectively, control aforementioned each grinding unit mechanism respectively.Therefore, can often carry out the processing of chamfering of certain amount.

Description of drawings

Fig. 1 shows the stereogram that the summary of the lapping device of the invention process form constitutes.

Fig. 2 shows the side view of wanting portion to constitute of the grinding unit that this lapping device is used.

Fig. 3 shows the front view of wanting portion to constitute of this grinding unit.

Fig. 4 is the cutaway view of the used grinding stone of this grinding unit.

Fig. 5 (A) reaches the partial sectional view that (B) shows the structure of the free bearing that this grinding unit is used respectively.

Fig. 6 shows the vertical view of the structure of the microscope carrier unit that the lapping device of example 1 is used.

Fig. 7 shows the side view of structure of the sliding stand of this microscope carrier unit.

Fig. 8 illustrates the side view of the holding state of grinding unit of the present invention.

Fig. 9 illustrates the side view of the machining state of the 1st grinding unit of the present invention.

Figure 10 illustrates another routine side view of the A-stage of the 1st grinding unit of the present invention.

Figure 11 illustrates another routine side view of the holding state of the 1st grinding unit of the present invention.

Figure 12 illustrates another routine side view of the machining state of the 1st grinding unit of the present invention.

Figure 13 shows the side view of wanting portion to constitute of the 2nd grinding unit of the edge of substrate face that lapping device of the present invention is used.

Figure 14 shows the front view of wanting portion to constitute of the 2nd grinding unit of the present invention.

Figure 15 illustrates the side view of the holding state of the 2nd grinding unit of the present invention.

Figure 16 illustrates the side view of the machining state of the 2nd grinding unit of the present invention.

Figure 17 (1)～(9) illustrate the figure of the 1st abrasive action of lapping device of the edge of substrate face of example 1.

Figure 18 (1)～(7) illustrate the figure of the 2nd abrasive action of lapping device of the edge of substrate face of example 1.

Figure 19 (1)～(7) illustrate the figure of the 3rd abrasive action of lapping device of the edge of substrate face of example 1.

Figure 20 shows the stereogram of outward appearance of lapping device of the edge of substrate face of example 2 of the present invention.

Figure 21 (1)～(6) illustrate the figure of abrasive action of lapping device of the edge of substrate face of example 2.

Figure 22 shows the diagrammatic top view that the lapping device of the base board end surface portion of example 3 of the present invention is constructed.

Figure 23 shows the vertical view of the end structure of LCD.

Figure 24 shows the side view of the end structure of LCD.

Figure 25 (A)～(D) is used for illustrating the stereogram of LCD of the processing of LCD.

Figure 26 illustrates the side view of wanting portion to constitute of the lapping device of known edge of substrate face.

The action specification figure of this lapping device of Figure 27.

[main element symbol description]

30,80A, 80B, 90: lapping device 32: microscope carrier

31,40a, 40aA, 40aa, 40b, 91: grinding unit 33: substrate

33a: end face 34,46: Spindle Motor

35,45: grinding stone aggregate 36,41: grinding head

37,49,49A, 49B: camera 38,44: grinding head travel mechanism

42,42A, 42B: substrate side edge part supporting mechanism 42b, 42b, 52a: peristome

A: end face 34,46: Spindle Motor

43a:LM slide block 43b:LM slide rail

45i: grinding stone 45ia: tapered portion

45ib: par 47: servo motor

48: ball screw unit 48a: screw shaft

48b: nut portion 50,50A, 50B, 65: free bearing

50a: big ball 50b: little ball

50c: bearing body 50d: lid

50e: flange part 50f: bolt

51: vertical base plate 52: horizonal base plate

53: cylinder pressure 54: piston rod

57: lifter plate 60: the microscope carrier unit

61: center microscope carrier 61a, 61b: attract groove

62a: the 1st supplemental support platform 63a: the 2nd supplemental support platform

63b: the 2nd lifting cylinder 63c: bearing

63d: the 2nd guide rod 63g: slide and use motor

63h: the 2nd sliding seat 63i: guide rail

63j: guide rail 63l: tooth bar

63m: the 2nd pinion 64: fixed station

81A, 81B: grinding unit keeps body travel mechanism 82: base

83A, 83B: grinding unit keeps body 85A, 85B: grinding unit travel mechanism

92: move guiding 96: air-blast device

The specific embodiment

Example 1

Fig. 1 shows the schematic isometric that the summary of the lapping device of the invention process form 1 constitutes.80A is provided with base 82 in this lapping device, be located on the base 82 microscope carrier unit 60 in order to the substrate that keeps end face processing to be ground, being used for will be by the grinding unit 40a of the base board end surface milled processed of these microscope carrier unit 60 maintenances, be used for keeping the grinding unit of grinding unit 40a to keep body 83A, be used for guiding grinding unit to keep the pair of L M guiding element 84 of body 83A, be used for making grinding unit to keep body 83A to keep the body 81A of travel mechanism along the grinding unit that each LM guiding element 84 moves, be used for making and remain in the 85A of grinding unit travel mechanism that grinding unit keeps the grinding unit 40a of body 83A to move, be installed on the camera 49A of grinding unit 40a, control part 88, and image processor 89.

Base 82 is the oblong-shaped of level above.Again, in the following description, the short side direction of establishing above the base 82 is that X-direction, long side direction are that Y direction, vertical direction are Z-direction.In the upper central portion of base 82, be provided with the microscope carrier unit 60 that the substrate (not shown) that is used for loading processing object remains in this substrate level by this.This microscope carrier unit 60 can make the substrate that is kept rotate to angle arbitrarily with level.In as the base 82 of the X-direction both sides of microscope carrier unit 60 on each sidepiece of Y direction, be respectively equipped with the LM guiding element 84 that extends along Y direction.

In each guiding element of pair of L M guiding element 84, there is the grinding unit of a type shape to keep each foot of the both sides of body 83A, be arranged to each self energy and move along each LM guiding element 84.The door type that grinding unit keeps the upper end of each foot of body 83A to be combined into by horizontal beam each other; Move along LM guiding element 84, horizontal beam is by this by on the microscope carrier unit 60.

In base 82, be provided with and be used for making each foot that grinding unit keeps body 83A to keep the body 81A of travel mechanism on Y direction along the grinding unit that each guiding element of pair of L M guiding element 84 moves back and forth.In the horizontal beam of grinding unit maintenance body 83A, having the grinding unit 40a that is used for grinding the base board end surface that remains on the microscope carrier unit 60 to be held in can move on X-direction.Grinding unit 40a keeps the horizontal beam of body 83A to move back and forth on X-direction by the 85A of grinding unit travel mechanism along grinding unit.

In grinding unit 40a, be provided with the camera 49A that is used for taking the appended a pair of alignment mark of the substrate that remains on the microscope carrier unit 60.Camera 49A is made of CCD camera etc., can take the alignment mark of being located at substrate, and takes the grinding part of substrate.Do image processing by the image data that camera 49A obtains by image processor 89.The data of being done after the image processing by image processor 89 outputs to control part 88.Control part 88 carries out the control of all actions of lapping device 80, according to coming computing to be loaded in the level of base plate face of microscope carrier unit 60 gradient of X-axis and Y direction relatively from the image processing data of image processor 89, and deposits in memory body.

The grinding unit 40a that can move on X-direction by the 85A of grinding unit travel mechanism keeps the body 81A of travel mechanism to move on Y direction because of grinding unit keeps body 83A by grinding unit, so move on Y direction.Grinding unit keeps the body 81A of travel mechanism to have ball screw and servo motor (all not shown); The grinding unit of door type keeps each foot of body 83A to move back and forth on Y direction along each LM guiding element 84 of being located at base 82 by the ball screw that is just changeing because of servo motor and reversing.Again, grinding unit keeps the body 81A of travel mechanism to be not limited to use the formation of ball screw and servo motor, and the formation of linear motor etc. also can be arranged for use.

Be used for making grinding unit 40a (can keep the side of the horizontal beam of body 83A to move), to constitute by ball screw, servo motor, LM guiding element etc. along the 85A of grinding unit travel mechanism that X-direction moves along grinding unit; Grinding unit 40a can move back and forth along X-direction by the ball screw that is just changeing because of servo motor and reversing.Again, the 85A of grinding unit travel mechanism is not limited to use the formation of ball screw, servo motor etc., and the formation of linear motor etc. also can be arranged for use.

Secondly, according to Fig. 2 and Fig. 3, illustrate that the grinding unit that is supported in lapping device 80A keeps the grinding unit 40a of body 83A.Fig. 2 is the side view of the X-direction (the arrow A direction of Fig. 1) of grinding unit 40a, and Fig. 3 is the front view of Y direction (the arrow B direction of Fig. 1).Illustrate relation with the X-Y-Z between centers of Fig. 1 respectively at Fig. 2 and Fig. 3 again.Among Fig. 2 and Fig. 3, grinding unit 40a possesses grinding head 41 moving up and down, can move up and down and be fixed in the substrate side edge part supporting mechanism 42 of set height and position, mobile guiding element (LM guiding element) 43 and being used for makes grinding head 41 in grinding head travel mechanism 44 that Z axle (vertically) direction moves.Again, at Fig. 2 and Fig. 3, the still not shown camera 49A (with reference to Fig. 1) that is located at grinding unit 40a.

Grinding head 41 is installed on vertical base plate 51; This vertical base plate 51 is supported on the horizontal beam that grinding unit keeps body 83A with plumbness, and can slide along X-direction.Grinding head 41 has vertical base plate of being supported on 51 and can go up the Spindle Motor 46 that moves at above-below direction (Z-direction).Spindle Motor 46 is configured to rotating shaft along Z axle (vertically) direction, and rotating shaft extends toward the below; The cylindric grinding stone aggregate 45 that can just change and reverse because of Spindle Motor 46 is installed in its underpart.The forward or reverse of the grinding stone aggregate 45 that is undertaken by Spindle Motor 46 is to select according to processing conditions.

Grinding head 41 is held in by the pair of L M guiding element 43 of being located at vertical base plate 51 to go up in Z-direction (above-below direction) and slides freely, and moves on Z-direction by grinding head travel mechanism 44 and with hi-Fix.Each guiding element of pair of L M guiding element 43 has the LM slide rail 43b that forms along the Z-direction configuration as shown in Figure 3.Pair of L M slide rail 43b is parallel to each other across appropriate intervals on X-direction; In each LM slide rail 43b, be respectively equipped with and be mounted to the M of the pair of L up and down slide block 43a that each self energy is slided on Z-direction.Pair of L M slide block 43a up and down, be installed in respectively Spindle Motor about 46 each sidepiece about.Pair of L M slide rail 43b is central authorities with the X-direction position of the rotating shaft of Spindle Motor 46 and the vertical axis of X-direction position consistency, each side about being disposed at respectively; Spindle Motor 46 remains in each LM slide rail 43b with high rigidity, and advances up and down unchangeably along each LM slide rail 43b.

The grinding head travel mechanism 44 that is used for making grinding head 41 with Spindle Motor 46 and grinding stone aggregate 45 to move up and down has servo motor 47 and 1 ball screw unit 48.Ball screw unit 48, as shown in Figure 3, have along Z-direction be disposed at the central authorities of pair of L M slide rail 43b left and right directions screw shaft 48a, and be screwed together in the 48b of nut portion of screw shaft 48a as shown in Figure 2.The 48b of nut portion is installed on the Spindle Motor 46 of grinding head 41 and becomes one with non-rotary state.The upper end of screw shaft 48a is linked to servo motor 47; Servo motor 47 is just being changeed and reverse, screw shaft 48a changes by this and just and reverses, and the 48b of nut portion promptly reaches slid underneath up along screw shaft 48a.Therefore, Spindle Motor 46 moves along past top of screw shaft 48a and below, and grinding head 41 all moves along Z-direction.Again, stop the rotation of servo motor 47, grinding head 41 is positioned both allocations of Z-direction.

Grinding stone aggregate 45 has same formation with grinding stone aggregate 35 shown in Figure 26.Have in the grinding stone aggregate 45 to be approximate discoid n grinding stone 45i=1 respectively, 2 ..., n stacks into many layers with coaxial state at above-below direction.The cross section of 1 grinding stone 45i is shown in Fig. 4.Grinding stone 45i, its central portion at the outer peripheral face above-below direction have V word shape groove 45ic, and each side up and down of this groove 45ic forms tapered portion 45ia respectively.The central portion bottom surface of the groove 45ic that each tapered portion 45ia up and down is folded is smooth par 45ib.Grinding stone 45i can grind the last lower edge portion of substrate end-face simultaneously by each tapered portion 45ia of V word shape groove 45ic, chamfers processing, again, also can grind simultaneously substrate end-face by the par 45ib of groove 45ic.

The shape of the groove 45ic of this kind grinding stone 45i forms by shaping or finishing.The shape of the groove 45ic of grinding stone 45i is not limited to above-mentioned shape, also can be the U word shape groove 45ic of curved surface for each tapered portion 45ia, again, also can be can carry out adhesive substrates to chamfer the complicated shape of processing.Again, but grinding stone 45i relatively to tapered portion 45ia with respect to the angle of inclination inequality of grinding stone 45i rotating shaft, can also be by the short-circuiting electrode that grinds the electrode terminal of removing substrate.Again, also tiltable of the rotating shaft of grinding stone aggregate 45.

Again, though not shown, between grinding stone aggregate 45 and camera 49A, be provided with air-blast device, the grounds travel that produces when it is used for air substrate being ground is discharged into set direction.By this air-blast device, can prevent that working fluid from drenching at camera 49A.

As shown in Figures 2 and 3, in the bottom of the vertical base plate 51 that grinding head 41 is installed horizonal base plate 52 is installed.Horizonal base plate 52 is supported in the lower surface of vertical base plate 51 in the mode that becomes level below the grinding stone aggregate 45 above sliding into.Horizonal base plate 52 is provided with to have than the external diameter of each grinding stone 45i of the grinding stone aggregate 45 peristome 42b of large diameter more, so that the grinding stone aggregate 45 that descends passes through.Peristome 42b runs through at above-below direction.

In the below of horizonal base plate 52, be provided with when end face waits to chamfer that the substrate of processing is loaded on the microscope carrier unit 60, just the side edge part with this substrate supports to slidably substrate side edge part supporting mechanism 42.When but substrate side edge part supporting mechanism 42 is positioned at the range of work of grinding stone aggregate 45 in order to suppress base board end surface on being loaded into microscope carrier unit 60, substrate comprises near the end face of end face side edge part toward the phenomenon of downside deflection, so the side edge part of this substrate can be kept level, adjust the gradient and the height of the side edge part of substrate.Therefore, utilize the grinding of the substrate end-face that the grinding stone 45i of grinding stone aggregate 45 carries out to adjust in optimum state.

Substrate side edge part supporting mechanism 42 has the supporting board 42a that is disposed at horizonal base plate 52 belows with level.Supporting board 42a can be parallel mobile in Z-direction (vertical direction) with level by near the cylinder 53 the vertical base plate 51 that is disposed at horizonal base plate 52.Cylinder 53 is disposed on the horizonal base plate 52 in the mode that piston rod 54 can extend toward the below; Piston rod 54 runs through the peristome of being located at horizonal base plate 52 and is installed on supporting board 42a.Supporting board 42a moves on Z-direction by cylinder 53, and is positioned the Working position of top and the position of readiness of below.As previously discussed, cylinder 53 is used for making the substrate side edge part supporting mechanism travel mechanism that the supporting board 42a of substrate side edge part supporting mechanism 42 moves on Z-direction.

Again, the piston rod 54 of cylinder 53 as shown in Figure 2, is disposed near the vertical base plate 51 apart from the axle center L1 of the rotating shaft of grinding stone aggregate 45.

In the central portion of supporting board 42a, with relative with the peristome 52a that is located at horizonal base plate 52 to mode be provided with peristome 42b.The peristome 42b of supporting board 42a forms and the identical size of peristome 52a of being located at horizonal base plate 52.

Above around the peristome 52a of supporting board 42a, be provided with the side edge part that is used for substrate and support to a slidable majority free bearing 50.In Fig. 2 and the example shown in Figure 3, with round the mode of supporting board 42a peristome 42a for example 12 free bearings 50 be mounted to square (will form by 4 free bearings 50) on one side.

Free bearing 50 also is called universal rolling wheel, the object as the conveyance object can be supported to and can slide toward any direction (360 °) with spheroid.Fig. 5 shows and to be located at the partial sectional view of structure that the free bearing of means 42 held in Fig. 2 and substrate side edge part literary composition shown in Figure 3.This free bearing 50 is provided with hemispherical recesses in the top of bearing body 50c, has taken in most little ball 50b in this hemispherical recesses, and is held in the big ball 50a that can roll freely by most little ball 50b bottom taking in.The top of big ball 50a is from the outstanding upward state of the recess of bearing body 50c.Bearing body 50c is covered by lid 50d, and the top of big ball 50a is outstanding from the peristome of being located at lid 50d.Big ball 50a is not held in by lid 50d and can breaks away from bearing body 50c.Circumference in lid 50d is provided with flange part 50e, and flange part 50e bolt etc. is fixed in supporting board 42a.

Again, free bearing 50 is not limited to the formation shown in Fig. 5 (A), also can use free bearing 50B shown in Fig. 5 (B); This free bearing 50B is equipped with bolt 50f in bearing body 50c, to replace flange part 50e.In the case, bolt 50f directly is installed on supporting board 42a.

No matter its pattern why, as big ball 50a, for example all uses the ball that is constituted with metal such as steel, stainless steel or resin etc., scribbles the resin of low-friction coefficient and constitutor.

Most free bearings 50 of substrate side edge part supporting mechanism 42, being positioned at the summit of the big ball 50a of each bearing topmost, the state below the contact substrate supports.Therefore, the summit that is positioned at each free bearing 50 big ball 50a topmost is adjusted to substrate loading surface with microscope carrier unit 60 with high, and the side edge part of substrate is just supported with the height identical with the loading surface of microscope carrier unit 60 by most free bearings 50.By this, prevent that the side edge part of substrate is toward the below deflection.

Grinding head 41, as described later, though move along the base board end surface that is loaded on the microscope carrier unit 60 with stationary state, and near substrate side edge part supporting mechanism 42 also side edge part, one side of end face of one side supporting substrate moves with grinding head 41 one, but owing to be provided with free bearing 50 at supporting board 42a, thus the side edge part of substrate supported to and can slide by free bearing 50, therefore, the side edge part of substrate is supported for below it unlikely impaired.

In the substrate side edge part supporting mechanism 42, directly be connected to the member that supports below the substrate, be not limited to free bearing 50 is located at the formation of supporting board 42a, also can be arranged at the formation of supporting board 42a for the supporting member that fluororesin low-friction coefficient materials such as (registration mark " Teflons ") is constituted, or for be coated with the top formation of supporting board 42a with the low-friction coefficient material.Owing to use the material of low-friction coefficient such as fluororesin, so can be under the situation below not damaging substrate base plate supports be become smooth and easy slip.

Free bearing 50 and since the big ball 50a of spheroid be connected to the substrate side edge part below, so the surface of big ball 50a is difficult for adhering to grounds travel, can prevent that grounds travel from making substrate impaired.Free bearing 50 contacts because of big ball 50a does with substrate below, and ball 50a itself is rotatable greatly, so frictional resistance is little, nor can add restriction at the moving direction of substrate, so, can under the side edge part that does not damage substrate, support in the mode that can slide swimmingly.Its result, grinding unit 41 is ground by the state that substrate side edge part supporting mechanism 42 supports with near the side edge part of the substrate the grinding part, so Yi Bian Yi Bian can correctly carry out the location of the short transverse of substrate, carry out the grinding of substrate end-face with good accuracy in the mode of undulation that substrate does not take place, deflection etc.

Secondly, the microscope carrier unit 60 of the substrate that is used for fixing processing object is described.Fig. 6 shows the vertical view of the formation of the microscope carrier unit 60 that the lapping device of this example is used.Microscope carrier unit 60 has with vacuum suction and keeps the square center microscope carrier 61 of substrate center portion and be disposed at 4 substrate supplemental support mechanisms 67 around this center microscope carrier 61.

Center microscope carrier 61, when the central portion of mounting substrate, maintenance is adsorbed to be fixed in the substrate center portion that is about to be loaded.If making the coordinate of the center S of center microscope carrier 61 is that (Z0), then square center microscope carrier 61 is disposed at along the level of X-direction and Y direction for X0, Y0, and is all mobile on the either direction of X-axis, Y-axis, Z axle, can be the center rotation with the Z axle.

Center microscope carrier 61 is linked to the rotation microscope carrier (not shown) of the set rotating mechanism in the below of top fixed head 64 (with reference to Fig. 7) of base 82; Make 61 rotations of center microscope carrier with rotating mechanism.Rotating mechanism can make the center microscope carrier rotate minute angle with level.The servo motor that rotating mechanism is controlled by control part 88 waits and constitutes.

Above center microscope carrier 61, be provided with and form the 1st of the square shape similar for the following central portion with substrate attracts to keep and attract groove 61a, reach center (X0 with center microscope carrier 61 to the square shape of center microscope carrier 61, Y0 Z0) is crosswise the 2nd attraction groove 61b at center.The 2nd attracts groove 61b to be formed by a pair of straight line along X-direction and Y direction separately; The end of each straight line be positioned at center microscope carrier 61 the center (X0, Y0, Z0), with the roughly centre position of each lateral margin that constitutes center microscope carrier 61 peripheries.Again, in constitute the 2nd end that attracts each straight line of groove 61b, with the roughly centre position of each lateral margin of center microscope carrier 61, be formed with the 1st straight-line groove portion that attracts groove 61a of extending respectively along each lateral margin.

The 1st attracts groove 61a and the 2nd to attract the inside of groove 61b to be reduced pressure by not shown vavuum pump; The substrate that is loaded into center microscope carrier 61 just is adsorbed in the 1st under the decompression state and attracts groove 61a and the 2nd to attract the inside of groove 61b, is maintained fixed in center microscope carrier 61 by this.

Be center microscope carrier 61 mounting substrates, process under the situation of this base board end surface, when the grinding stone 45i of the grinding stone aggregate 45 that rotates is contacted with base board end surface, produce moment of torsion at substrate; The 1st of center microscope carrier 61 attracts groove 61a and the 2nd to attract groove 61b that the central portion vacuum attraction of substrate is maintained fixed, so prevent substrate rotation or mobile and depart from both allocations of center microscope carrier 61 really.

Be disposed at center microscope carrier 61 4 substrate supplemental support mechanisms 67 on every side and form identical construction respectively; Each supporting mechanism has tabular the 1st supplemental support platform 62a of bar that forms along each lateral margins configuration of square center microscope carrier 61 respectively, and is disposed at tabular the 2nd supplemental support platform 63a of bar in the 1st supplemental support platform 62a outside along the 1st supplemental support platform 62a.

Fig. 7 be among Fig. 6 relatively the center of center microscope carrier 61 be positioned at-the being seen side view of substrate supplemental support mechanism 67-X-direction of X-direction.As shown in Figure 7, dispose in the below of the 2nd supplemental support platform 63a with relative with the 2nd supplemental support platform 63a to mode be configured to the 2nd sliding seat 63h of level.The 2nd sliding seat 63h supports to the 2nd supplemental support platform 63a can slide in Z-direction (above-below direction), and can along X-direction or Y direction slide and near and leave center microscope carrier 61.

Again, in the below of the 1st supplemental support platform 62a, also dispose with relative with the 1st supplemental support platform 62a to mode be configured to the 1st sliding seat 62h (with reference to Fig. 6) of level.Among Fig. 6, to relative center microscope carrier 61 lay respectively at-X-direction and+each substrate supplemental support mechanism 67 of Y direction, omit the 1st supplemental support platform 62a and the 2nd supplemental support platform 63a that is positioned at upside respectively, show the 1st sliding seat 62h and the 2nd sliding seat 63h that is positioned at downside respectively.

As shown in Figure 7, the 2nd sliding seat 63h set pair of guide rails 63i on the fixed station 64 that is disposed at the 2nd sliding seat 63h below slides.Pair of guide rails 63i along X-direction or Y direction configuration, is equipped with the 2nd guide body 63j that is used for being sticked in each guide rail 63i respectively below tabular the 2nd sliding seat 63h of bar.The 2nd sliding seat 63h slides and parallel moving on the direction of the center of being toward or away from microscope carrier 61 relative to each guide rail 63i respectively by a pair of the 2nd guide body 63j.

The 2nd slip motor 63g that is made of servo motor is installed on the 2nd sliding seat 63h.The 2nd slides extends to the below of the 2nd sliding seat 63h with the rotating shaft of motor 63g, in the bottom of this rotating shaft the 2nd pinion 63m is mounted to and can just changes integratedly with rotating shaft and reverse.Again, be provided with the sensor that is used for detecting rotating speed (anglec of rotation), control the 2nd rotation of sliding usefulness motor 63g by this sensor in the 2nd rotating shaft that slides with motor 63g.

Be provided with tooth bar 631 near the of guide rail 63i on one side in the mode parallel with this guide rail 63i; There is the 2nd above-mentioned pinion 63m meshing in this tooth bar 631.Slide and just to change and the 2nd pinion 63m that reverses rotates on tooth bar 631 because of the 2nd, move along tooth bar 631 with motor 63g.Therefore, be equipped with and be used for making the 2nd sliding seat 63h of the 2nd slip of the 2nd pinion 63m rotation, promptly slide with the 2nd pinion 63m with motor 63g.

Below the 1st sliding seat 62h below being disposed at the 1st supplemental support platform 62a, also be provided with and be used for being sticked in respectively the 1st guide body (not shown) of pair of guide rails 63i, again, as shown in Figure 6, be provided with the 1st in the 1st sliding seat 62h and slide and use motor 62g, and with the bottom of the rotating shaft of motor 62g the 1st pinion 62m that is engaged in tooth bar 631 is installed in the 1st slip.Therefore, the 1st sliding seat 62h also slides with just commentaries on classics and the counter-rotating of motor 62g by the 1st, and along parallel the moving of pair of guide rails 63i and near and leave center microscope carrier 61.

As shown in Figure 7, the upper central portion in this 2nd sliding seat 63h is provided with the 2nd lifting cylinder 63b that is used for making the 2nd supplemental support platform 63a lifting.The 2nd lifting is with among the cylinder 63b, and piston rod disposes with plumbness, to slide on above-below direction; Its upper end is installed on the following central portion of the 2nd supplemental support platform 63a that is disposed at level.

Both sides below the 2nd supplemental support platform 63a are separately installed with each upper end with the 2nd guide rod 63d of plumbness configuration.The bearing 63c that each the 2nd guide rod 63d is located at respectively above the 2nd sliding seat 63h supports to and can slide up and down.

By this kind formation, the 2nd supplemental support platform 63a keeps the mode lifting of level with relative the 2nd sliding seat 63h with cylinder 63b by the 2nd lifting, rise to (the Z axle bed is marked=Z0), located at this job position with high job position above the center microscope carrier 61.Again, drop to position of readiness, in this position of readiness location than this job position low clearance L3.

As shown in Figure 6, in the upper central portion of the 1st sliding seat 62h, also be provided with the 1st lifting cylinder 62b that is used for making the 1st supplemental support platform 62a lifting.The 1st lifting is with among the cylinder 62b, and piston rod disposes with plumbness, and to slide at above-below direction, its upper end is installed on the following central portion of the 1st supplemental support platform 62a that is disposed at level.

Both sides below the 1st supplemental support platform 63a are separately installed with separately the upper end with the 1st guide rod 62d of plumbness configuration.The bearing 63c that each the 1st guide rod 62d is located at respectively above the 1st sliding seat 62h supports to and can slide up and down.

By this kind formation, the 1st supplemental support platform 62a also rises to (the Z axle bed is marked=Z0), located at this job position with high job position above the center microscope carrier 61 in the mode that relative the 1st sliding seat 63h keeps level with cylinder 62b by the 1st lifting.Again, drop to position of readiness, in this position of readiness location than this job position low clearance L3.

As Figure 6 and Figure 7, above the 2nd supplemental support platform 63a, be provided with most free bearings 65.Each free bearing 65 forms the formation same with the free bearing 50 of being located at grinding unit 40a substrate side line portion supporting mechanism 42, for example with zigzag be disposed at tabular the 2nd supplemental support platform 63a of bar above.

Above the 1st supplemental support platform 63a, as shown in Figure 6, also be provided with most free bearings 65.Each free bearing 65 forms the formation same with the free bearing 50 of being located at grinding unit 40a substrate side edge part supporting mechanism 42, for example with zigzag be disposed at tabular the 2nd supplemental support platform 63a of bar above.

The microscope carrier unit 60 of Gou Chenging in this way is loaded into the substrate center portion of end face processing to be ground on the center microscope carrier 61.In addition, according to the size of substrate that is loaded on the center microscope carrier 61, make across a pair of the 1st supplemental support platform 62a of center microscope carrier 61 configuration or the 1st all supplemental support platform 62a be positioned at above the center microscope carrier 61 with high job position, or further make across a pair of the 2nd supplemental support platform 63a of center microscope carrier 61 configuration or the 2nd all supplemental support platform 63a be positioned at center microscope carrier 61 above with high job position, be loaded into the sidepiece of the substrate on the center microscope carrier 61 with support respectively.

When the substrate size that is loaded on the center microscope carrier 61 little, and needn't support sidepiece by the 1st supplemental support platform 62a and the 2nd supplemental support platform 63a the time, the 1st supplemental support platform 62a and the 2nd supplemental support platform 63a are positioned at than the operation position position of readiness of below more.Center microscope carrier 61 can rotate with level, and being disposed at center microscope carrier 61 each substrate supplemental support mechanism 67 on every side also can be along with the rotation of center microscope carrier 61 is rotated together.

At the 1st supplemental support platform 62a and the 2nd supplemental support platform 63a free bearing 65 is set, and make 65 on free bearing be contacted with substrate below, so can support in the mode that does not injure below the substrate.Again, the low friction substrate support member that material constituted can be set also, replace free bearing 65.Again, also can the attraction groove similarly be set, the side supports of substrate be become stationary state, and free bearing 65 etc. is not set with center microscope carrier 61.

Employed process water can not enter and be used for mechanism that the 1st supplemental support platform 62a and the 2nd supplemental support platform 63a are moved when grinding substrate again.

Action with regard to the lapping device that constitutes as above-mentioned is illustrated.Fig. 8 is presented under the state that small size substrate 33 is loaded into center microscope carrier 61 chamfers the key diagram of A-stage of situation of processing to the end face 33a of substrate 33.In the situation of the little substrate 33 of size, only use the center microscope carrier 61 of microscope carrier unit 60 to keep substrate 33.Again, Fig. 8 only shows the necessary minimal unit of the explanation relevant with the grinding operation of lapping device 80.

When mounting substrate 33 on center microscope carrier 61, be located at the 1st above the center microscope carrier 61 and attract groove 61a and the 2nd to attract the inside of groove 61b just to become decompression state, substrate 33 is adsorbed in center microscope carrier 61 is maintained fixed.

Then, grinding unit keeps body 83A to move closer to center microscope carrier 61 by grinding unit keeps the body 81A of travel mechanism on Y direction, substrate side edge part supporting mechanism 82 be positioned at the sidepiece of center microscope carrier 61 sides the substrate 33 that is fixed on center microscope carrier 61 below.In the case, make the end face of substrate 33 be in state near the grinding stone aggregate 45 of grinding unit 41.

During as state for this reason, have the grinding head 41 of grinding stone aggregate 45 and Spindle Motor 46, promptly by grinding head travel mechanism 44 shown in Figure 2, and be located in grind reference position P2 and above the center microscope carrier 61 roughly with high position; This grinding reference position P2 is the following center of grinding stone aggregate 45 employed grinding stone 45i.Again, the substrate side edge part supporting mechanism 42 of grinding unit 40a by the action of cylinder 53, and is positioned at than the position of readiness that grinds the lower both take the altitudes L2 in reference position.Again, grinding stone aggregate 45 is because of usually using in regular turn from the grinding stone 45i of hypomere, so when grinding operation began, making the following center of the grinding stone 45i of hypomere was grinding reference position P2.

In the case, substrate side edge part supporting mechanism 42 is descended, make substrate side edge part supporting mechanism 42 be positioned at the reference position P1 of below of the grinding position of readiness P2 of substrate side edge part supporting mechanism 42.Reference position P1 has Building X mark and identical Building X mark and the Building Y mark of Building Y mark with grinding position of readiness P2, and high together with the top of each free bearing of being located at substrate side edge part supporting mechanism 42.

That is, if make the Building X mark and the Building Y mark that grind reference position P2 and position of readiness P1 be respectively X1, Y1, then the coordinate of the center S of center microscope carrier 61 be (X0, Y0, Z0); The coordinate that grinds reference position P2 be (X1, Y1, Z0); Reference position P1 is coordinate (X1, Y1, position of readiness Z0-L2).Therefore, cylinder 53 descends substrate side edge part supporting mechanism 42, makes the reference position P1 of substrate side edge part supporting mechanism 42 be positioned at than the position of grinding the lower distance L 2 of reference position P2.Therefore, grinding reference position P2 is more high than the reference position P1 of substrate side edge part supporting mechanism 42.

Then, as shown in Figure 9, the substrate side edge part supporting mechanism 42 of grinding unit 40a is climb L2 by the action of cylinder 53, and grinding head 41 descends by the servo motor 47 of grinding head travel mechanism 44, makes the height of reference position P2 of grinding head 41 reduce Δ Z.Therefore, the central portion substrate 33 that is supported on center microscope carrier 61 is supported to side edge part and center microscope carrier 61 with high by free bearing 50; Side edge part to processing to be ground forms level to substrate 33 from the central portion that is kept by center microscope carrier 61 as shown in Figure 9.Again, the side of the end face 33a of substrate 33 and the grinding stone 45i of grinding stone aggregate 45 hypomeres with close state relative to

When being in this state, take 2 alignment marks that write on substrate 33 in the mode of optics by camera 49A.By camera 49A take and the image data of alignment mark handle through image processor 89, with the coordinate values of the central point (being also referred to as center of gravity) of asking for alignment mark.Then, control part 88 from the coordinate values computing substrate 33 of the central point of 2 alignment marks with respect in the horizontal direction the anglec of rotation anglec of rotation of Z axle (on the X-Y plane around) θ in the holding position of center microscope carrier 61 normal substrates 33, control part 88 control microscope carrier unit rotating mechanisms, the anglec of rotation θ that calculates with elimination.Therefore, θ ° of all rotation in microscope carrier unit 60, the rotation of substrate 33 on horizontal plane compensated, and makes that the end face 33a of the substrate 33 that is loaded into microscope carrier unit 60 is consistent along the moving direction of X-direction with grinding stone aggregate 45.Therefore, after chamfer processing, the amount of chamfering of end face that prevents to be loaded into the substrate 33 of microscope carrier unit 60 changes, and carries out the very high attrition process of precision so can be regardless of the size of substrate 33.

Again, except making substrate 33, the rotation by microscope carrier unit 60 rotates in the horizontal direction, outside the posture that compensates substrate 33 is by this done like this, also can come the relative X-direction angulation of end face 33a of computing substrate 33 according to substrate 33 anglec of rotation of obtaining from the coordinate values of 2 alignment marks in the horizontal direction, control part 88 controls the 85A of grinding unit travel mechanism in grinding operation and grinding unit keeps the body 81A of travel mechanism, with along the mode of the end face 33a of postrotational substrate 33 in the horizontal direction, make grinding unit 40 limits move the limit and move toward Y direction toward X-direction.In the case, similarly, change even if the substrate 33 that remains in center microscope carrier 61, also can prevent the amount of chamfering of substrate 33 end face 33a not at normal state, thus can carry out precision high chamfer processing.

Then, grinding condition at the following setting grinding head 41 of the appearance and size of considering the thickness of substrate 33, grinding stone 45i, rotating speed, the amount of feeding etc., under the rotation status of the grinding stone aggregate 45 of grinding head 41, grinding unit keeps body 83A to move on Y direction by grinding unit keeps the body 81A of travel mechanism, makes the grinding stone 45i of hypomere be connected to the end face 33a of substrate 33.Therefore, the end face of substrate 33 enters in the V word shape groove 45ic that is located at grinding stone 45i outer peripheral face, and the upside of the end face 33a of substrate 33 and each edge of downside become and be connected to the groove 45ic state of each tapered portion 45ia up and down respectively.Therefore, processing is chamfered at each edge up and down of the end face 33a of substrate 33 simultaneously.Again, chamfer processing, will be positioned at the end face 33a between each edge up and down and come attrition process by the tabular surface 45ib of the groove 45ic of grinding stone 45i by each edge.

Secondly, grinding unit 40a moves on X-direction by the 85A of grinding unit travel mechanism.Therefore, grinding stone 45i moves along the end face 33a of substrate 33, and by each tapered portion 45ia of grinding stone 45i each edge up and down of the end face 33a of substrate 33 is done and chamfered processing, and with end face 33a attrition process.

In the case, because the 85A of grinding unit travel mechanism, so grinding unit 40a moves along the end face 33a of substrate 33, therefore, substrate side edge part supporting mechanism 42 also moves along the end face 33a of substrate 33, so being used near the free bearing 50 of the substrate side edge part supporting mechanism 42 of the part end face 33a of supporting substrate 33 moves swimmingly with the states that are contacted with below the substrate 33, so grinding stone 45i is wanted near the partly support unchangeably end face 33a of substrate 33 of butt.Therefore, by grinding stone 45i processing is chamfered at each edge up and down of the end face 33a of substrate 33 unchangeably.

For 1 end face 33a of substrate 33 being chamfered processing, consider the rotating speed of appearance and size, each grinding stone 45i of each grinding stone 45i of thickness, grinding stone aggregate 45 of substrate 33 for example and the amount of feeding etc., set best grinding condition.

Figure 10 shows chamfers the key diagram of the A-stage that adds man-hour to large-sized substrate 33.Figure 10 display base plate 33 is loaded into the state before the center microscope carrier 61.Grinding unit keeps the body 81A of travel mechanism to be moved in X-direction, and is longer than the distance of state shown in Figure 8 to the distance of grinding stone aggregate 45 from the center S of the center microscope carrier 61 of microscope carrier unit 60.The size of substrate 33 that remains in center microscope carrier 61 at central portion is big, under the big situation of the downward deflection of its side edge part, by the 1st supplemental support platform 62 of substrate supplemental support mechanism 67 or come the sidepiece of supporting substrate 33 by the 1st supplemental support platform 62 and the 2nd supplemental support platform 63.

Therefore, look substrate 33 sizes of grinding, slide that rotation with motor 62g drives or drive by the 1st by the 1st rotation of sliding with motor 63g of sliding with motor 62g and the 2nd, only, move to and leave both positions of set a distance of center microscope carrier 61 with the 1st supplemental support platform 62 or with the both sides of the 1st supplemental support platform 62 and the 2nd supplemental support platform 63.Make the 1st supplemental support platform 62 and the 2nd supplemental support platform 63 be positioned at substrate side edge part supporting mechanism 42 with grinding unit 41 with high position of readiness again.

Again, because of the 1st supplemental support platform 62 is identical with the action of the 2nd supplemental support platform 63, so in the following description, only be illustrated with regard to the 2nd supplemental support platform 63.

Leave center microscope carrier 61 both during the state of set a distance when the 2nd supplemental support platform 63 becomes, as shown in figure 11, the central portion of substrate 33 loads and is fixed on the center microscope carrier 61.

Secondly, during as state for this reason, lifting is risen with cylinder 63b running, the 2nd supplemental support platform 63, and the top that makes the free bearing 65 of being located at the 2nd supplemental support platform 63 and the loading surface of center microscope carrier 61 are with height.Therefore, substrate 33 is supported by the free bearing 65 of the top of center microscope carrier 61 and the 2nd supplemental support platform 63.

Afterwards, as shown in figure 12, the substrate side edge part supporting mechanism 42 of grinding unit 40a is lifting height L2 by cylinder 53, and grinding head 41 descends by the servo motor 47 of grinding head travel mechanism 44, makes the height of the reference position P2 of grinding head 41 reduce height L2.

During as state for this reason, below, by coming the end face 33a of substrate 33 is carried out milled processed with the same action of aforementioned activities.

Action with regard to the lapping device that constitutes as above-mentioned is illustrated.Fig. 8 is presented under the state that small size substrate 33 is loaded into center microscope carrier 61 chamfers the key diagram of A-stage of situation of processing to the end face 33a of substrate 33.In the situation of the little substrate 33 of size, only use the center microscope carrier 61 of microscope carrier unit 60 to keep substrate 33.Again, Fig. 8 only shows the necessary minimal unit of the explanation relevant with the grinding operation of lapping device 80.

When mounting substrate 33 on center microscope carrier 61, be located at the 1st above the center microscope carrier 61 and attract groove 61a and the 2nd to attract the inside of groove 61b just to become decompression state, substrate 33 is adsorbed in center microscope carrier 61 is maintained fixed.

Then, grinding unit keeps body 83A to move closer to center microscope carrier 61 by grinding unit keeps the body 81A of travel mechanism on Y direction, substrate side edge part supporting mechanism 82 be positioned at the sidepiece of center microscope carrier 61 sides the substrate 33 that is fixed on center microscope carrier 61 below.In the case, make the end face of substrate 33 be in state near the grinding stone aggregate 45 of grinding unit 41.

During as state for this reason, have the grinding head 41 of grinding stone aggregate 45 and Spindle Motor 46, promptly by grinding head travel mechanism 44 shown in Figure 2, and be located in grind reference position P2 and above the center microscope carrier 61 roughly with high position; This grinding reference position P2 is the following center of grinding stone aggregate 45 employed grinding stone 45i.Again, the substrate side edge part supporting mechanism 42 of grinding unit 40a by the action of cylinder 53, and is positioned at than the position of readiness that grinds the lower both take the altitudes L2 in reference position.Again, grinding stone aggregate 45 is because of usually using in regular turn from the grinding stone 45i of hypomere, so when grinding operation began, making the following center of the grinding stone 45i of hypomere was grinding reference position P2.

In the case, substrate side edge part supporting mechanism 42 is descended, make substrate side edge part supporting mechanism 42 be positioned at the reference position P1 of below of the grinding position of readiness P2 of substrate side edge part supporting mechanism 42.Reference position P1 has Building X mark and identical Building X mark and the Building Y mark of Building Y mark with grinding position of readiness P2, and high together with the top of each free bearing of being located at substrate side edge part supporting mechanism 42.

That is, if make the Building X mark and the Building Y mark that grind reference position P2 and position of readiness P1 be respectively X1, Y1, then the coordinate of the center S of center microscope carrier 61 be (X0, Y0, Z0); The coordinate that grinds reference position P2 be (X1, Y1, Z0); Reference position P1 is coordinate (X1, Y1, position of readiness Z0-L2).Therefore, cylinder 53 descends substrate side edge part supporting mechanism 42, makes the reference position P1 of substrate side edge part supporting mechanism 42 be positioned at than the position of grinding the lower distance L 2 of reference position P2.Therefore, grinding reference position P2 is more high than the reference position P1 of substrate side edge part supporting mechanism 42.

Then, as shown in Figure 9, the substrate side edge part supporting mechanism 42 of grinding unit 40a is climb L2 by the action of cylinder 53, and grinding head 41 descends by the servo motor 47 of grinding head travel mechanism 44, makes the height of reference position P2 of grinding head 41 reduce Δ Z.Therefore, the central portion substrate 33 that is supported on center microscope carrier 61 is supported to side edge part and center microscope carrier 61 with high by free bearing 50; Side edge part to processing to be ground forms level to substrate 33 from the central portion that is kept by center microscope carrier 61 as shown in Figure 9.Again, the side of the end face 33a of substrate 33 and the grinding stone 45i of grinding stone aggregate 45 hypomeres with close state relative to

When being in this state, take 2 alignment marks that write on substrate 33 in the mode of optics by camera 49A.By camera 49A take and the image data of alignment mark handle through image processor 89, with the coordinate values of the central point (being also referred to as center of gravity) of asking for alignment mark.Then, control part 88 from the coordinate values computing substrate 33 of the central point of 2 alignment marks with respect in the horizontal direction the anglec of rotation anglec of rotation of Z axle (on the X-Y plane around) θ in the holding position of center microscope carrier 61 normal substrates 33, control part 88 control microscope carrier unit rotating mechanisms, the anglec of rotation θ that calculates with elimination.Therefore, θ ° of all rotation in microscope carrier unit 60, the rotation of substrate 33 on horizontal plane compensated, and makes that the end face 33a of the substrate 33 that is loaded into microscope carrier unit 60 is consistent along the moving direction of X-direction with grinding stone aggregate 45.Therefore, after chamfer processing, the amount of chamfering of end face that prevents to be loaded into the substrate 33 of microscope carrier unit 60 changes, and carries out the very high attrition process of precision so can be regardless of the size of substrate 33.

Again, except making substrate 33, the rotation by microscope carrier unit 60 rotates in the horizontal direction, outside the posture that compensates substrate 33 is by this done like this, also can come the relative X-direction angulation of end face 33a of computing substrate 33 according to substrate 33 anglec of rotation of obtaining from the coordinate values of 2 alignment marks in the horizontal direction, control part 88 controls the 85A of grinding unit travel mechanism in grinding operation and grinding unit keeps the body 81A of travel mechanism, with along the mode of the end face 33a of postrotational substrate 33 in the horizontal direction, make grinding unit 40 limits move the limit and move toward Y direction toward X-direction.In the case, similarly, change even if the substrate 33 that remains in center microscope carrier 61, also can prevent the amount of chamfering of substrate 33 end face 33a not at normal state, thus can carry out precision high chamfer processing.

Then, grinding condition at the following setting grinding head 41 of the appearance and size of considering the thickness of substrate 33, grinding stone 45, rotating speed, the amount of feeding etc., under the rotation status of the grinding stone aggregate 45 of grinding head 41, grinding unit keeps body 83A to move on Y direction by grinding unit keeps the body 81A of travel mechanism, makes the grinding stone 45i of hypomere be connected to the end face 33a of substrate 33.Therefore, the end face of substrate 33 enters in the V word shape groove 45ic that is located at grinding stone 45i outer peripheral face, and the upside of the end face 33a of substrate 33 and each edge of downside become and be connected to the groove 45ic state of each tapered portion 45ia up and down respectively.Therefore, processing is chamfered at each edge up and down of the end face 33a of substrate 33 simultaneously.Again, chamfer processing, will be positioned at the end face 33a between each edge up and down and come attrition process by the tabular surface 45ib of the groove 45ic of grinding stone 45i by each edge.

Secondly, grinding unit 40a moves on X-direction by the 85A of grinding unit travel mechanism.Therefore, grinding stone 45i moves along the end face 33a of substrate 33, and by each tapered portion 45ia of grinding stone 45i each edge up and down of the end face 33a of substrate 33 is done and chamfered processing, and with end face 33a attrition process.

In the case, because the 85A of grinding unit travel mechanism, so grinding unit 40a moves along the end face 33a of substrate 33, therefore, substrate side edge part supporting mechanism 42 also moves along the end face 33a of substrate 33, so being used near the free bearing 50 of the substrate side edge part supporting mechanism 42 of the part end face 33a of supporting substrate 33 moves swimmingly with the states that are contacted with below the substrate 33, so grinding stone 45i is wanted near the partly support unchangeably end face 33a of substrate 33 of butt.Therefore, by grinding stone 45i chamfered unchangeably in each edge up and down of the end face 33a of substrate 33 and add.

For 1 end face 33a of substrate 33 being chamfered processing, consider the rotating speed of appearance and size, each grinding stone 45i of each grinding stone 45i of thickness, grinding stone aggregate 45 of substrate 33 for example and the amount of feeding etc., set best grinding condition.

Figure 10 shows chamfers the key diagram of the A-stage that adds man-hour to large-sized substrate 33.Figure 10 display base plate 33 is loaded into the state before the center microscope carrier 61.Grinding unit keeps the body 81A of travel mechanism to be moved in X-direction, and is longer than the distance of state shown in Figure 8 to the distance of grinding stone aggregate 45 from the center S of the center microscope carrier 61 of microscope carrier unit 60.The size of substrate 33 that remains in center microscope carrier 61 at central portion is big, under the big situation of the downward deflection of its side edge part, by the 1st supplemental support platform 62 of substrate supplemental support mechanism 67 or come the sidepiece of supporting substrate 33 by the 1st supplemental support platform 62 and the 2nd supplemental support platform 63.

Therefore, look substrate 33 sizes of grinding, slide that rotation with motor 62g drives or drive by the 1st by the 1st rotation of sliding with motor 63g of sliding with motor 62g and the 2nd, only, move to and leave both positions of set a distance of center microscope carrier 61 with the 1st supplemental support platform 62 or with the both sides of the 1st supplemental support platform 62 and the 2nd supplemental support platform 63.Make the 1st supplemental support platform 62 and the 2nd supplemental support platform 63 be positioned at substrate side edge part supporting mechanism 42 with grinding unit 41 with high position of readiness again.

Again, because of the 1st supplemental support platform 62 is identical with the action of the 2nd supplemental support platform 63, so in the following description, only be illustrated with regard to the 2nd supplemental support platform 63.

Leave center microscope carrier 61 both during the state of set a distance when the 2nd supplemental support platform 63 becomes, as shown in figure 11, the central portion of substrate 33 loads and is fixed on the center microscope carrier 61.

Secondly, during as state for this reason, lifting is risen with cylinder 63b running, the 2nd supplemental support platform 63, and the top that makes the free bearing 65 of being located at the 2nd supplemental support platform 63 and the loading surface of center microscope carrier 61 are with height.Therefore, substrate 33 is supported by the free bearing 65 of the top of center microscope carrier 61 and the 2nd supplemental support platform 63.

Afterwards, as shown in figure 12, the substrate side edge part supporting mechanism 42 of grinding unit 40a is lifting height L2 by cylinder 53, and grinding head 41 descends by the servo motor 47 of grinding head travel mechanism 44, makes the height of the reference position P2 of grinding head 41 reduce height L2.

During as state for this reason, below, by coming the end face 33a of substrate 33 is carried out milled processed with the same action of aforementioned activities.

So, be positioned at substrate 33 parts of 42 of the substrate side edge part supporting mechanisms of center microscope carrier 61 and grinding head 41, supported by the 1st supplemental support platform 62 of substrate supplemental support mechanism 67 or the 1st supplemental support platform 62 and the 2nd supplemental support platform 63, between the substrate side edge part supporting mechanism 42 of center microscope carrier 61 and grinding head 41, deflection takes place so prevent substrate 33.Its result is even large-area substrate 33 also can support unchangeably by the side edge part of substrate side edge part supporting mechanism 42 with substrate 33, so can chamfer processing to the end face 33a of large-area substrate 33 with high accuracy.

Again, if the size of the substrate 33 of processing to be ground is little, must be between the substrate side edge part supporting mechanism 42 of center microscope carrier 61 and grinding head 41 supporting substrate 33, then make the 1st supplemental support platform 62 and the 2nd supplemental support platform 63 drop to position to be kept away.Therefore, can carry out all size substrate 33 end face 33a chamfer processing, needn't carry out microscope carrier replacing etc. and prepare the operation changed.

Again, microscope carrier unit 60 comprises all under the state that is mounted with substrate 33 of center microscope carrier 61 and substrate supplemental support mechanism 67, rotates by the microscope carrier rotating mechanism.Therefore, when substrate was kept by the center microscope carrier 61 of microscope carrier unit 60 and substrate supplemental support mechanism 67, even then center microscope carrier 61 and 67 rotations of substrate supplemental support mechanism, the position skew of relative microscope carrier unit 60 can not take place in substrate 33 yet.Be used for being contacted with free bearing 65 below the substrate 33 because of being provided with point in the 1st supplemental support platform 62 of substrate supplemental support mechanism 67 and the 2nd supplemental support platform 63, so even substrate 33 slips when the rotation of microscope carrier unit 60, the following of substrate 33 can be not impaired yet.

Again, also can only make 61 rotations of center microscope carrier by the microscope carrier rotating mechanism, at this moment, owing to substrate 33 is fixed on the center microscope carrier 61, so can the occurrence positions skew.Moreover, owing to be provided with at the 1st supplemental support platform 62 of substrate supplemental support mechanism 67 and the 2nd supplemental support platform 63 and be used for being contacted with free bearing 65 below the substrate with point, even so under the situation that microscope carrier 61 rotations in center are only arranged, can not make the following impaired of substrate 33 yet.Under the situation that microscope carrier 61 rotations in center are only arranged, as long as the microscope carrier rotating mechanism makes center microscope carrier rotation, so can significantly simplify the structure of lapping device.

Again, also can be substituted in all the 1st supplemental support platforms 62 and the free bearing 65 of the 2nd supplemental support platform 63 installations, and only free bearing 65 is installed,, the attraction groove similarly is set with center microscope carrier 61 in the 1st supplemental support platform 62 at the 2nd supplemental support platform 63.

Moreover, also can with center microscope carrier 61 the attraction groove be set similarly in substrate 33 loading surfaces of the 1st supplemental support platform 62 and the 2nd supplemental support platform 63.At this moment, except center microscope carrier 61 with the central portion of substrate 33 by vavuum pump or attract attraction mechanism such as motor to come vacuum attraction and keeping, the substrate 33 outer circumferential sides part of leaving substrate 33 centers a little is also by vavuum pump or attract attractions mechanism such as motor to come vacuum attraction and keep, and is by this that substrate 33 maintenances are very firm.At this moment, when the 60 all rotations of microscope carrier unit, though the big substrate 33 of size can produce big moment of torsion, but also substrate 33 is maintained fixed by the 1st supplemental support platform 62 and the 2nd supplemental support platform 63, therefore, substrate 33 can not rotate or move, so can prevent the position skew of substrate 33 really.

Again,, also can be provided with and be used for by the side edge part of substrate side edge part supporting mechanism 42 substrate supported 33, the substrate side edge part maintaining body of being fixed from upside at grinding unit 40a.Figure 13 is provided with the side view of the grinding unit 40a of substrate side edge part maintaining body, the front view of this grinding unit of Figure 14 40a.

As Figure 13 and shown in Figure 14, below the horizonal base plate 52 of grinding unit 40a, be provided with most free bearing 50H and be used as substrate side edge part maintaining body.Each free bearing 50H forms identical with the free bearing 50 of the supporting board 42a that is located at substrate side edge part supporting mechanism 42, with big ball 50b be positioned at downside mode, with each free bearing 50 of being located at substrate side edge part supporting mechanism 42 similarly be disposed at horizonal base plate 52 below, and be disposed at the peristome 52a that is located at horizonal base plate 52 central portions around.

Horizonal base plate 52, different with Fig. 2 and grinding unit 40a shown in Figure 3, be installed on the bottom of the lifter plate 57 that forms with the plumbness configuration along vertical base plate 51.

Lifter plate 57 by not shown flat elevator structure about the energy (Z-direction) move.The flat elevator structure keeps LM guiding element, ball screw, and the servo motor and in lifter plate 57 liftings of body 83A by be arranged at grinding unit along the Z axle.Again, the flat elevator structure is not limited thereto kind of a formation, also can use linear motor, cylinder to wait and constitute.

Horizonal base plate 52 is positioned both take the altitudes by the flat elevator structure.Again, the supporting board 42a of substrate side edge part supporting mechanism 42 is positioned to be lower than both low levels of take the altitude of horizonal base plate 52 by the cylinder 53 of being located at horizonal base plate 52.

Free bearing 50H adds man-hour at chamfering of substrate 33, keeps near the part of substrate 33 end face 33a from upside, moves toward the top with the end face 33a that suppresses substrate 33.Again, free bearing 50H at grinding unit 40a when the end face 33a of substrate 33 moves, contact substrate 33 top and sliding, but because and the frictional force between above the substrate 33 little, so can be mobile on substrate 33 smoothly.

Because the formation of other formations and Fig. 2 and grinding unit 40a shown in Figure 3 is identical, therefore gives same-sign to identical component part, the omission explanation.

More than, the action of the grinding unit 40a that constitutes in this way is described.At first, make horizonal base plate 52 move to the position of readiness of top by the flat elevator structure.Make the supporting board 42a of substrate side edge part supporting mechanism 42 move to the position of readiness of below by the cylinder 53 of being located at horizonal base plate 52 again.Under this state, make grinding unit keep the body 81A of travel mechanism to move and the approaching center microscope carrier 61 that is mounted with substrate 33 central portions in Y direction, as shown in figure 15, make the side edge part of substrate 33 between the supporting board 42a and horizonal base plate 52 of the substrate side edge part supporting mechanism 42 of grinding head 41.

During as state for this reason, horizonal base plate 52 descends, make the top, lower end of being located at each the free bearing 50H below the horizonal base plate 52, the height (Z0) that is positioned at above center microscope carrier 61 up loads the high position (Z0+ Δ Z ') of thickness deltat Z ' of being fixed in the substrate 33 on the center microscope carrier 61.Then, supporting board 42a rises by the cylinder 53 of being located at horizonal base plate 52, makes the top of the upper end of each free bearing 50 of being located at supporting board 42a be positioned at top (Z0) with center microscope carrier 61 with high position (Z0).

In view of the above, as shown in figure 16, be loaded into below the side edge part of substrate 33 of center microscope carrier 61, the free bearing 50 of being located at supporting board 42a supports, and the free bearing 50H that is located at horizonal base plate 52 keeps.Then, by coming the end face 33a of substrate 33 is carried out milled processed with the same action of aforementioned activities.

Again, when the grinding stone 45i by grinding stone aggregate 45 carries out the grinding operation of end face 33a of substrate 33, the central portion of grinding stone 45i above-below direction is abrasion site P3, this abrasion site P3, the height Z0 at the center of center microscope carrier 61 is half high position of thickness (Z0+ Δ Z '/2) of substrate 33 relatively.This Working position is along with shape of grinding stone 45i etc. and change.

So, to near the following of the side edge part of the end face 33a of substrate 33 and above under the state that is kept by free bearing 50 and 50H, carry out attrition process, therefore can suppress the deflection, undulation of substrate 33 side edge parts etc., and can be with the end face 33a of substrate 33 with high accuracy milled processed unchangeably.Each free bearing 50 and 50H are little for substrate 33 sliding frictions, so can not make the following of substrate 33 and top impaired.Again, also can not use the free bearing 50H that is located at horizonal base plate 52, and be to use the mat of the little material of sliding friction, for example fluororesin (registration mark " Teflon ").

If during large-area substrates 33, as previously mentioned, use assisting base plate supporting mechanism 67 again.

Secondly, illustrate according to Figure 17 and use lapping device 80A of the present invention to come 4 end faces of 1 plate base 33 are chamfered the 1st method of processing in regular turn.Figure 17 only shows that grinding unit 40a, camera 49A, grinding unit keep body 83A, substrate 33, with explanation substrate 33 and the position relation of grinding unit 40a or the position relation of substrate 33 and camera 49A.

Again, making substrate 33 is the adhesive substrates that infrabasal plate b and upper substrate c fit and form.Infrabasal plate b is a bit larger tham upper substrate c, and its peripheral part is formed with the circuit protection short-circuiting electrode.Grinding unit 40a moves adding the end face 33a of man-hour along substrate 33.

At first, will be loaded into the center microscope carrier 61 of microscope carrier unit 60 from the substrate (adhesive substrates) 33 that mother substrate is partitioned into.At this moment, be that X-direction, width are that the mode of Y direction is loaded into center microscope carrier 61 with rectangular substrate 33 with the length direction.Again, shown in Figure 17 (1), the relevant substrate 33 that is loaded into center microscope carrier 61, make near grinding unit keep being positioned in the end face of body 83A the X-Y axes of coordinates-corner part on one side of X-direction is A, make relative corner part A be positioned at+corner part of X-direction is B, make be positioned at corner part B+corner part of Y direction is C, make relative corner part C be positioned at-corner part of X-direction is D.

Substrate 33 is waited the center microscope carrier 61 that is positioned microscope carrier unit 60 and remains secured to center microscope carrier 61 with pilot pin, and camera 49A just takes a pair of alignment mark of being located at substrate 33.At this moment, at first, camera 49A takes the position of the alignment mark that is positioned near the one side of corner part B shown in Figure 17 (1), secondly, takes the position of the alignment mark that is positioned near the another side of corner part A shown in Figure 17 (2).Shooting one end that utilizes camera 49A to carry out, control part 88 just come the angle of inclination of the horizontal direction of computing substrate 33 relative normal conditions according to the position information of 2 alignment marks, and remember in the memory body of control part 88.

Owing to the substrate 33 that is partitioned into from mother substrate, its cut-off rule is parallel scarcely fully with the straight line that connects a pair of alignment mark, therefore according to the position information of substrate 33 (according to a pair of alignment mark gained that is stored in the memory body of control part 88), grinding unit 40a when making attrition process moves toward Y direction when moving toward X-direction, can carry out attrition process in the mode that is parallel to the straight line that connects a pair of alignment mark to the end face 33a of substrate 33 by this.

Secondly, the grinding stone aggregate 45 of the grinding unit 40a the corner part point that is positioned at substrate 33 near is rotated, and the grinding stone 45i of grinding stone aggregate 45 is positioned to and can carries out attrition process to corner part A.Again, grinding unit 40a is moved toward corner part B from the corner part A of substrate 33, carry out by this between corner part A and the B end face chamfer processing.At this moment, control part 88 along with moving of the past X-direction of grinding unit 40a, makes grinding unit keep body 83A to move toward Y direction according to the data of remembering in memory body, carries out linear interpolation by this.

Then, shown in Figure 17 (3), when the end surface grinding end of job from the corner part A of substrate 33 to corner part B, grinding unit keeps body 83A all to move with regard to past-Y direction and away from center microscope carrier 61, and grinding unit 40a along grinding unit keep body 83A past-X-direction moves.By this, grinding unit 40a is positioned at the H point as position of readiness.Even if it is the center rotation with center microscope carrier 61 that the H point is set rectangular substrate 33 for, grinding unit 40a does not collide with substrate 33 yet.

Secondly, shown in Figure 17 (4), microscope carrier unit 60 is all moved, so that substrate 33 half-twists, make the corner part D of substrate 33 become state near the position of readiness H of grinding unit 40a.Then, keep body 83A and moving of grinding unit 40a that grinding unit 40a is located by grinding unit, to grind the corner part D of substrate 33, and shown in Figure 17 (5), make grinding unit 40a along grinding unit keep body 83A past+X-direction moves, and by this end face between corner part D and corner part A carried out attrition process from corner part D towards corner part A.

When the grinding operation from the corner part D of substrate 33 to the end face of corner part A finishes, shown in Figure 17 (6), grinding unit keep body 83A all promptly past-Y direction move and away from center microscope carrier 61, and grinding unit 40a along grinding unit keep body 83A past-X-direction moves.By this, make grinding unit 40a be positioned at the H point of position of readiness.

Secondly, microscope carrier unit 60 is all moved, make substrate 33 half-twists, so that the C of substrate 33 point becomes the state near the position of readiness H of grinding unit 40a.Then, keep body 83A and moving of grinding unit 40a that grinding unit 40a is located by grinding unit, to grind the corner part point of substrate 33, and shown in Figure 17 (7), make grinding unit 40a along grinding unit keep body 83A past+X-direction moves, and by this end face between corner part C and corner part D carried out attrition process from corner part C towards corner part D.

When the grinding operation from the corner part C of substrate 33 to corner part D end face finishes, shown in Figure 17 (8), grinding unit keep body 83A all promptly past-Y direction move, with away from center microscope carrier 61, and grinding unit 40a along grinding unit keep body 83A past-X-direction moves.By this, make grinding unit 40a be positioned at the H point of position of readiness.

Secondly, microscope carrier unit 60 is all moved, so that substrate 33 half-twists, make the B point of substrate 33 become state near the position of readiness H of grinding unit 40a.Then, keep body 83A and moving of grinding unit 40a that grinding unit 40a is located by grinding unit, to grind the corner part B of substrate 33, and shown in Figure 17 (9), make grinding unit 40a along grinding unit keep body 83A past+X-direction moves, and by this end face between corner part B and corner part C carried out attrition process from corner part B towards corner part C.So, substrate 33 is changeed 3 times, each 90 °, by this 4 end faces of the substrate 33 that remains in microscope carrier unit 60 are chamfered processing respectively.

Figure 18 uses lapping device 80A of the present invention to come 4 end faces of substrate 33 are chamfered the key diagram of the 2nd method of processing.With situation shown in Figure 17 similarly, at first, shown in Figure 18 (1), take the position of the alignment mark that is positioned near the one side the B, secondly, shown in Figure 18 (2), take the position of the alignment mark that is positioned near the another side the corner part A.Shooting one end that utilizes camera 49A to carry out, control part 88 just come the angle of inclination of the horizontal direction of computing substrate 33 according to the position information of 2 alignment marks, and are stored in the memory body of control part 88.

Afterwards, from using the end point of the shooting that camera 49A carries out, that is corner part A begins to do and chamfers processing, and shown in Figure 18 (3), grinding unit 40a moved towards corner part B.At this moment, control part 88 along with moving of the past X-direction of grinding unit 40a, makes grinding unit keep body 83A to move toward Y direction according to the data that is stored in memory body.

Secondly, do not use microscope carrier unit 60 to make substrate 33 rotations, but shown in Figure 18 (4), grinding unit keep body 83A to move toward Y direction, grinding unit 40a is by this to being positioned at the end face between corner part B and corner part C, corner part B and corner part C done chamfer processing.In the case, control part 88 along with grinding unit keeps moving of the past Y direction of body 83A, makes grinding unit 40a move toward X-direction also according to the data of remembering in memory body.

Secondly, grinding unit keep body 83A all past-Y direction moves and away from center microscope carrier 61, and grinding unit 40a along grinding unit keep body 83A past-X-direction moves, by this, shown in Figure 18 (5), make grinding unit 40a be positioned at the H point of position of readiness.

Secondly, microscope carrier unit 60 is all moved, make substrate 33 half-twists, so that the D of substrate 33 point becomes the state near the position of readiness H of grinding unit 40a.Then, grinding unit 40a is moved toward Y direction, and make grinding unit 40a keep body 83A to move,, and make grinding unit keep body 83A near center microscope carrier 61 with the corner part A of grinding substrate 33 toward X-direction along grinding unit.Again, shown in Figure 18 (6), make grinding unit 40a along grinding unit keep body 83A past-X-direction moves, the end face between corner part A and corner part D is done towards the D point from the A point chamfered processing by this.

Then, needn't make substrate 33 rotations by microscope carrier unit 60, but shown in Figure 18 (7), make grinding unit keep body 83A to move towards Y direction, coming by grinding unit 40a, chamfer processing from corner part B towards corner part C to being positioned at the end face between corner part B and corner part C.At this moment, control part 88 along with grinding unit keeps moving of the past Y direction of body 83A, makes grinding unit 40a move toward X-direction also according to the data that is stored in memory body.

In the case, as long as utilize microscope carrier unit 60 to make the action of substrate 33 half-twists carry out 2 times, promote so chamfer the operating efficiency of processing.

Figure 19 uses lapping device 80A of the present invention to come 4 end faces of substrate 33 are chamfered the key diagram of the 3rd method of processing.With situation shown in Figure 180 similarly, at first, shown in Figure 19 (1), take the position of the alignment mark that is positioned near the one side the corner part B, then, shown in Figure 19 (2), take the position of the alignment mark that is positioned near the another side the corner part A.When the shooting of using camera 49A to carry out finished, control part 88 came the angle of inclination of the horizontal direction of computing substrate 33 promptly according to the position information of 2 alignment marks, and is stored in the memory body of control part 88.

Afterwards, from utilizing the end point of the shooting that camera 49A carries out, that is corner part A begins to chamfer processing, shown in Figure 19 (3), and grinding unit 40a moved towards corner part B.In the case, control part 88 is according to the data of remembering in memory body, along with grinding unit 40a towards the moving of X-direction, make grinding unit keep body 83A to move toward Y direction.

Secondly, needn't make substrate 33 rotations by microscope carrier unit 60, but shown in Figure 19 (4), making grinding unit keep body 83A to move toward Y direction, grinding unit 40a is chamfered processing to the end face between corner part B and corner part C towards corner part B and corner part C by this.At this moment, control part 88 along with grinding unit keeps moving of the past Y direction of body 83A, makes grinding unit 40a move toward X-direction also according to the data that is stored in memory body.

Secondly, grinding unit keeps all court-Y directions of body 83A to move and away from center microscope carrier 61, and grinding unit 40a along grinding unit maintenance body 83A past-X-direction moves, shown in Figure 19 (5), grinding unit 40a is positioned at the H point of position of readiness by this.

The above each step is identical with the 2nd method shown in Figure 180.

Secondly, microscope carrier unit 60 is all moved, make substrate 33 Rotate 180s °, so that the corner part C of substrate 33 becomes the state near the position of readiness H of grinding unit 40a.Then, grinding unit 40a is moved toward Y direction, and make grinding unit 40a keep body 83A to move,, and make grinding unit keep body 83A near center microscope carrier 61 with the corner part C of grinding substrate 33 toward X-direction along grinding unit.Again, shown in Figure 19 (6), make grinding unit 40a along grinding unit keep body 83A past-X-direction moves, and by this end face between corner part C and corner part D chamfered processing from the C of corner portion towards corner part D.

Then, needn't make substrate 33 rotations by microscope carrier unit 60, but shown in Figure 19 (7), make grinding unit keep body 83A to move towards Y direction, come the end face between corner part D and corner part A is chamfered processing from corner part D towards corner part A by grinding unit 40a by this.At this moment, control part 88 along with grinding unit keeps moving of the past Y direction of body 83A, makes grinding unit 40a move toward X-direction also according to the data that is stored in memory body.

This 3rd method owing to only need to implement once to utilize microscope carrier unit 60 to carry out the action of substrate 33 Rotate 180s °, therefore can promote and chamfer the operating efficiency of processing.

According to lapping device of the present invention, grinding unit 40a is disposed at X-direction and can keeps body 83A toward the grinding unit that Y direction moves on the microscope carrier unit 60 can be arranged at toward the mode that X-direction moves athwart, so needn't make microscope carrier unit 60 rotation by grinding unit 40a, can carry out attrition process to 3 end face 33a of the substrate 33 that is loaded into microscope carrier unit 60.As long as make substrate 33 half-twists or 180 ° 1 time, also can do attrition process to substrate 33 remaining 1 end face by microscope carrier unit 60 again.Be to consider back suitable setting such as operating efficiency the opportunity that makes substrate 33 half-twists or 180 °.

Again, the direction of rotation of substrate 33 can be for reaching anti-clockwise either direction clockwise.Again, the corner part at each end face of the end face 33a of substrate 33 makes grinding unit 40a move along this corner part, can chamfer to the edge up and down of this corner part by this.In the case, any that also can carry out that C is chamfered, R is chamfered to corner part chamfered.

Example 2

Figure 20 shows the stereogram that the summary of the lapping device of the invention process form 2 constitutes.The lapping device 80B of example 2, in the grinding unit of the lapping device 80A of example 1 keep body 83A (below, making this grinding unit keep body 83A is that the 1st grinding unit keeps body 83A) add the 2nd grinding unit again and keep body 83B, other constitute then identical with the formation of the lapping device 80A of example 1.The 2nd grinding unit keeps body 83B, form with the 1st grinding unit and keep the same formation of body 83A, be provided with the 2nd grinding unit 40b, camera 49B etc., and can move along the pair of L M guiding element 84 above being located at base 82 by the 2nd 81B of guide body travel mechanism.Again, the 81B of guide body travel mechanism is located at LM guiding element 84, and this LM guiding element 84 is different to be provided with and is used for driving the LM guiding element 84 that the 1st grinding unit keeps the 81A of guide body travel mechanism of body 83A.

The 2nd 81B of guide body travel mechanism, be used for making the 85B of grinding unit travel mechanism that the 2nd grinding unit 40b moves toward X-direction etc., controlled 88 control.Other constitute, and then the lapping device 80A with example 1 is identical.

The lapping device 80B of the example 2 of Gou Chenging in this way is because of possessing grinding unit 40a and the 2nd grinding unit 40b, so even be fixed at substrate 33 under the state of microscope carrier unit 60, still can do simultaneously 2 end faces of substrate 33 mutual subtends and chamfer processing.

Figure 21 uses the lapping device 80B of example 2 to come 4 end faces of substrate 33 are done to chamfer the key diagram of method for processing.At first, shown in Figure 21 (1), microscope carrier unit 60 is placed in set reference position, substrate 33 is loaded into microscope carrier unit 60 and is maintained fixed.At this moment, the minor face that the is held in substrate 33 long limit that is parallel to Y-axis or substrate 33 is parallel to X-axis.Again, among Figure 21, with key diagram shown in Figure 17 similarly, each corner part of establishing substrate 33 is respectively A, B, C, D.

Secondly, make the 1st grinding unit keep body 83A to move near the corner part A and the end face between B of substrate 33, make camera 49A can take the alignment mark of corner part A.Again, make the 2nd grinding unit keep body 83B to move near the corner part A and the end face between B of substrate 33, make camera 49A can take the alignment mark of corner part B.When being in such state, just utilizing each camera 49A to take the alignment mark of corner part A, and utilize camera 49B to take the alignment mark of corner part B.

Then, from taking by each camera 49A and 49B the image data of each alignment mark, generate the location coordinate data of 2 alignment marks by image processor 89.The location coordinate data that control part 88 uses self imaging treating apparatus 89 to send here is come the gradient of computing substrate 33 relative X-directions, correctly recognizes the state of the substrate 33 on the microscope carrier unit 60, and position information is remembered in the memory body of control part 88.

Secondly, make the 1st grinding unit keep body 83A and grinding unit 40a to move respectively, so that the 1st grinding unit keeps the grinding unit 40a of body 83A to be positioned at and the same position of readiness of position of readiness H shown in Figure 17 (4), and make the 2nd grinding unit keep body 83B and grinding unit 40a to move respectively, so that the 2nd grinding unit keeps the grinding unit 40a of body 83B to be positioned at the center and the point-symmetric each other position of readiness of position of readiness H of relative center microscope carrier 61.

Then, shown in Figure 21 (2), clockwise rotates set angle φ by control part 88 in microscope carrier unit 61.Therefore, substrate 33 rotates similarly.Angle φ is relevant with the ratio of minor face with the long limit of substrate 33, but hope is 30 °, 45 °, 60 ° unspecified angle.

Secondly, keep the grinding unit 40a of body 83A to be positioned to grind corner part D the 1st grinding unit, and grinding unit 40a is positioned to grind corner part B.At this moment, shown in Figure 21 (2), keep under the body 83A though the corner part A of substrate 33 is positioned at the 1st grinding unit, grinding unit 40a moves along Y direction from position of readiness H, so grinding unit 40a and substrate 33 are independent of each other.Again, though being positioned at the 2nd grinding unit, the corner part C of substrate 33 keeps under the body 83A, but the position of readiness away from the corner part C of substrate 33 on also comfortable Y direction of grinding unit 40b and the X-direction moves along Y direction, so can not influence the corner part C of substrate 33.

When being in such state, the 1st grinding unit keeps body 83A to move with regard to past-Y direction, and grinding unit 40a moves toward X-direction, so that the 1st grinding unit keeps the grinding unit 40a of body 83A that the end face between corner part D and the A is ground towards A from corner part D.Meanwhile, the 2nd grinding unit keeps body 83B to move toward Y direction, and grinding unit 40b past-X-direction moves, so that the 2nd grinding unit keeps the grinding unit 40b of body 83B that the end face between corner part B and the C is ground towards C from corner part B.

In the case, it with the position information of the corner part A of the substrate 33 of A-stage and B the memory body that the anglec of rotation of horizontal direction of the substrate 33 of benchmark is stored in control part 88, again, the rotationangle of microscope carrier unit 60 also is stored in the memory body of control part 88, so control part 88 uses these position informations to come the data of advancing of computing grinding unit 40a and 40b, and deposits in memory body.Therefore, control part 88 can be according to the data of advancing of grinding unit 40a that deposits in memory body and 40b, control the 1st grinding unit and keep moving of body 83A and grinding unit 40a, the two is moved along the end face between corner part D and the A, and control the 2nd grinding unit and keep moving of body 83B and grinding unit 40b, the two is moved along the end face between corner part B and the C.

When the 1st grinding unit keeps the grinding unit 40a of body 83A to arrive corner part A, promptly control the 1st grinding unit and keep body 83A and grinding unit 40a, make grinding unit 40a move along corner part A.By this, grind each end face of corner part A respectively.Similarly, when the 2nd grinding unit keeps the grinding unit 40b of body 83B to arrive corner part C, promptly control the 2nd grinding unit and keep body 83B and grinding unit 40b, make grinding unit 40b move along corner part C.By this, grind each end face of corner part C respectively.

Then, make the 1st grinding unit keep body 83A to move toward Y direction, and grinding unit 40a is moved toward X-direction, so that the 1st grinding unit keeps the grinding unit 40a of body 83A shown in Figure 21 (4) end face between corner part A and the B to be ground towards B from corner part A.Meanwhile, make the 2nd grinding unit keep body 83B past-Y direction moves, and make grinding unit 40b past-X-direction moves, so that the 2nd grinding unit keeps the grinding unit 40b of body 83B that the end face between corner part C and the D is ground towards D from corner part C.

Then, the 1st grinding unit keeps the grinding unit 40a of body 83A to arrive corner part B, and the 2nd grinding unit keeps the grinding unit 40b of body 83B to arrive corner part D, like this, 4 end faces of substrate 33 chamfer process finishing.

So, in the step shown in Figure 21 (2)～(4), be at the chamfering in the processing of 4 end faces of substrate 33, also can chamfer processing to all corner parts of substrate 33; But also can be after the step till Figure 21 (4) finishes, further shown in Figure 21 (5), the long limit that makes microscope carrier unit 60 be rotated into substrate 33 becomes behind the state of X-direction, keep the grinding unit 40a of body 83A to come corner part B done by the 1st grinding unit and chamfer processing, and keep the grinding unit 40b of body 83B to come corner part D done by the 2nd grinding unit and chamfer processing, further keep the grinding unit 40a of body 83A to come corner part A is chamfered processing by the 1st grinding unit again, and come corner part C is chamfered processing by the grinding unit 40b of the 2nd grinding unit maintenance body 83B.

So, lapping device 80B according to this example, making microscope carrier unit 60 serves as that axle rotates (30 ° of set angles on the XY plane with the center of center microscope carrier 61,45 °, 60 °), and after making 2 grinding unit 40a and 40b move to each corner part on the diagonal of substrate 33, grind continuously by grinding unit 40a and grinding unit 40b continuous end face under rotary plate 33 not to substrate 33, so the operating efficiency of chamfering of the end face of substrate 33 significantly promotes.

And, can not make the 1st grinding unit keep body 83A and the 1st grinding unit to keep body 83B all end faces of substrate 33 to be chamfered operation under influencing each other.At each corner part change grinding unit 40a of substrate 33 and the moving direction of grinding unit 40b, also can do by this and chamfer processing the end face of the corner part of substrate 33, again, also can easily chamfering of corner part be processed and change to that C is chamfered or R is chamfered.

Example 3

Figure 22 shows the vertical view of the general structure of the invention process form 3 lapping devices.Be provided with 92,4 grinding unit travel mechanisms 99 of 91,4 mobile guide body of 4 grinding units, microscope carrier unit 100, image processor 101,102,4 grinding unit feed mechanisms of control part (not shown) in this lapping device 90.

The lapping device 90 of this example possesses and is used for the central portion of mounting substrate 33 and the rectangle microscope carrier unit 100 that absorption keeps, each lateral margin along this microscope carrier unit 100 disposes 4 mobile guide body 92 that form respectively, can move 4 grinding units 91 that guide body 92 moves along each respectively, be used for making each grinding unit 91 to move the grinding unit travel mechanism 99 that guide body 92 moves back and forth along each respectively, and not shown grinding unit feed mechanism, this grinding unit feed mechanism, be used for making each grinding unit 91 respectively on the XY plane toward moving back and forth as the arrow P direction among Figure 22 of the direction that is orthogonal to mobile guide body 92 (direction vertical) with the end face of center microscope carrier.

Again, each grinding unit 91 in lapping device 90 is respectively equipped with air-blast device 96.Moreover lapping device 90 possesses the image processor 101 that is used for handling the image that is photographed by each camera 49, and according to the control part 102 of the action of the position information of the alignment mark that comes computing substrate 33 from the output data of image processor 101 and control lapping device 90.Grinding unit travel mechanism 99 is by giving control signal by control part 102 and driving.Again, among Figure 22, image processor 101 only illustrates 1, but also can be provided with more than 2.The image data that image processor 101 will be got by each camera 49 shooting is handled down in regular turn, so can handle the images of sending here from most cameras 49 with 1.

Each grinding unit 91 forms the formation identical with the grinding unit 40a of example 1, and having can be at the grinding stone aggregate 45 that moves on the Z-direction and be used for making grinding stone aggregate 45 mobile grinding head travel mechanism on Z-direction.Camera 49 is disposed at the opposition side of moving direction when grinding stone aggregate 45 is done milled processed of this grinding stone aggregate 45; Again, between grinding stone aggregate 45 and camera 49, be provided with air-blast device 96, be used for blowing away grounds travel that grinding stone aggregate 45 produces, working fluid etc.For camera 49 and air-blast device 96, can adjust apart from the position of the height and the relative substrate end-face of substrate 33 by micrometer head again.Again, air-blast device 96 is connected in not shown air pump, is used for compressed air to camera 49 ejections.Control part 102 is according to the position information of being handled the alignment mark that get by image processor 101, be loaded into substrate 33 on the microscope carrier unit 100 relative to the grinding stone 45i of the grinding stone aggregate 45 of the computing of the gradient of X-direction, each grinding unit 91 to the computing of the amount of feeding (the grinding degree of depth) of substrate 33 and be used for each grinding stone 45i along each the grinding unit travel mechanism 99 that each end face of the substrate 33 of inclination moves and the control of each grinding unit feed mechanism (not shown).Again, control part 102 also possess will be in advance the setting value that obtains of decision compare with actual amount of grinding, control each grinding unit feed mechanism, so that the amount of chamfering of substrate is certain function.

Again, microscope carrier unit 100 has the adsorption plane that is parallel to the XY plane, but is not provided with the rotating mechanism of microscope carrier.Be provided with in the inside of microscope carrier unit 100 and be used for recording the sound sensor that grinding unit 91 has been connected to the end face of substrate 33.This sound sensor records the butt of grinding unit 91 and substrate 33 by detecting the vibration that betides microscope carrier unit 100 through substrate 33.

Each grinding unit travel mechanism 99 is by respectively along each lateral margin of microscope carrier unit 100, that is, each end face 33a of the substrate 33 that is loaded into microscope carrier unit 100 and keeps be arranged to each move guide body 92 and not shown ball screw, servo motor constitutes, be used for making grinding unit 91 to move back and forth past the 2nd position, the 1st position certainly along each lateral margin (each end face 33a of substrate 33) of microscope carrier unit 100.Again, grinding unit travel mechanism 99 is not limited to be made of ball screw, servo motor, also can be made of linear motor.

The grinding unit feed mechanism is made of not shown LM guiding element and ball screw, servo motor, be used for each grinding unit 91 is moved and arrow P direction in the figure, that is, relative approaching, the direction left of each end face 33a of substrate 33 is with the end face 33a propelling of the each small quantity of the grinding stone of grinding unit 91 ground toward substrate 33.Again, the inscape of grinding unit feed mechanism is not limited to LM guiding element, ball screw, servo motor, also can be LM guiding element and linear motor.

Secondly, narration is to 4 programs that end face 33a processes simultaneously of substrate 33.At first, 100 mounting substrates, 33 soldiers in microscope carrier unit attract to keep.Secondly, camera 49 is taken the alignment mark of being located at substrate 33, and this image data of taking gained is handled at image processor 101, and generates the position information of alignment mark.Control part 102 comes the X-axis of computing substrate 33 relative datum positions, the side-play amount on the Y direction according to the position information of the alignment mark of self imaging treating apparatus 101 output, and calculates grinding starting position, and the grinding end position of substrate 33 of gradient, each grinding unit 91 of substrate 33 relative X-directions and Y direction according to operation result.

Again, control part 102 is controlled the moving direction of the X-direction of each grinding unit travel mechanism 99 and each grinding unit feed mechanism and Y direction (arrow R and arrow P direction) respectively and is ground the starting position and grind end position (below, claim this to be controlled to be linear interpolation).Therefore, even if do not remain in state on the microscope carrier unit 100 with set posture at substrate 33, that is the state that substrate 33 relative datum positions tilt in the horizontal direction still can grind along each end face 33a of substrate 33.

Afterwards, each grinding unit 91 is moved and near each end face 33a of substrate 33 under the state of grinding stone rotation along arrow P direction.Again, the sound sensor by being located at 100 the insides, microscope carrier unit detects the vibration that betides microscope carrier unit 100, to detect the end face 33a that each grinding unit 91 has been connected to substrate 33.Therefore, control part 88 detects 0 point, and 0 is that each grinding unit 91 is connected to the primary position that substrate 33 does not begin to be each end face 33a of milled processed as yet.Then, the grinding stone of each grinding unit 91 stops the rotation, and each grinding head 91 moves to position of readiness.

Secondly, the grinding stone of each grinding unit 91 rotates respectively.Under this state, relevant each grinding unit 91, the limit is supported each end face 33a of substrate 33, the side edge part of substrate 33 by substrate side edge part supporting mechanism, the limit makes grinding unit 91 move toward the direction shown in the arrow R of Figure 22 by each grinding unit travel mechanism 99 under the state that each end face 33a of substrate 33 is ground by grinding stone 45.At this moment, control part 102 is according to gradient and the grinding starting position of substrate 33 and the data of grinding end position of substrate 33 relative directions Xs of calculating and Y direction, each grinding unit 91 is moved by grinding unit travel mechanism 99 dealing R directions, and move simultaneously by lapping device feed mechanism dealing P direction.Therefore, grind the end face 33a of substrate 33 continuously by position offset, one side that linear interpolation compensates substrate 33 on each grinding unit 91 one side.

The lapping device 90 of this example, as mentioned above, can be by 4 end face 33a of 91 while of 4 grinding units substrate processing 33.Again, the grinding unit 91 that makes this lapping device 90 is when the grinding that is positioned at substrate 33 corner parts begins or grind that the corner part along substrate 33 moves when finishing, and also can do simultaneously substrate 33 all corner parts by this and chamfer operation.Moreover the moving direction of control grinding unit 91 when substrate 33 corner parts move can make the chamfering of corner part of substrate 33 arbitraryly for C is chamfered, R is chamfered chamfer by this.

Again, each grinding unit 91 moves toward the R direction simultaneously by grinding unit travel mechanism 99 on one side, Yi Bian carry out the grinding of substrate 33, simultaneously, the air-blast device 96 that is disposed at grinding stone 45 moving direction rears is the inject high pressure air.Pressure-air is used for the end face 33a of the substrate 33 after just chamfered by grinding stone 45 and removes working fluid.The end face 33 of the substrate 33 after again, the camera 49 that is disposed at grinding stone 45 rears is taken and chamfered by grinding stone 45.The image that will get by camera 49 is handled with image processor 101, to detect the amount of chamfering of the substrate 33 after in fact grinding.Higher limit and lower limit that control part 102 is differentiated compared to the amount of chamfering that configures in advance, whether the amount of chamfering of the reality of substrate 33 exceeds higher limit and lower limit.When the amount of chamfering exceeded any one of higher limit and lower limit, the grinding unit travel mechanism 99 and the grinding unit feed mechanism of control part 102 control grinding units 91 with the position of relative substrate 33 end faces of control grinding stone, carried out the compensation of substrate 33 amounts of chamfering by this.

So, for just being done the end face of substrate 33 of chamfering after the processing, remove working fluid, take with camera 49 and just chamfered the end face of the substrate 33 after the processing with air-blast device by grinding stone 45.So, control part 102 detects the amounts of chamfering, and compares with the appropriate setting value of prior setting, regulates the sendout of grinding stone 45, with the compensation amount of chamfering.By this kind compensation, can prevent the inclination of substrate 33 relative datum states and cause the amount of chamfering to change, and can carry out a certain amount of processing of chamfering at any time.Therefore, can carry out the extraordinary grinding of precision.Again, tail off as if the sendout of the amount of chamfering with respect to grinding stone 45, then the grind section of control part 102 judgement grinding stones 45 is worn and torn.At this moment, under the situation of employed grinding stone 45, make grinding head both quantitative to moving, can be in the state that to do grinding by new grinding stone by this toward upper and lower for the grinding stone aggregate of multistage structure.Therefore, needn't carry out the replacing preparation work of grinding stone, operating efficiency significantly promotes.

Though this example utilizes microscope carrier unit 100 to keep substrate 33, also can use in example 1 employed rotatable microscope carrier unit to replace microscope carrier unit 100 again.In the case, also can make center microscope carrier or the rotation of microscope carrier cell population by the microscope carrier rotating mechanism.Under the situation of using revolvable microscope carrier unit by the microscope carrier rotating mechanism, camera 49 is taken the set alignment mark of substrate 33 that is loaded into the microscope carrier unit, image processor 101 is from the position skew of the image data identification substrate 33 of camera 49, control part 102 makes the microscope carrier unit that is mounted with substrate 33 rotate set angle by the microscope carrier rotating mechanism, with the position offset of compensation substrate 33.Again, moving direction and the base board end surface at each grinding unit 91 of lapping device 90 compensates into the operation of chamfering of carrying out substrate 33 under the parallel state.

Under the situation of the lapping device 90 that uses this example, microscope carrier unit 100 little getting final product even if the size of substrate changes, also needn't be made replacing substrate loading and prepare with replacings such as microscope carriers.Again, owing to support substrate end-face to be ground, even therefore large-size substrate also can grind base board end surface well with non-deflecting state precision.Again, sometimes can grind 4 end faces, so can grind very efficiently for substrate.

Grinding unit of the present invention and lapping device can be used for brittle bases such as semiconductor crystal wafer, glass substrate, quartz base plate, ceramic substrate, are particularly useful for the contained permeation type liquid crystal projector substrate of LCD (LCD), plasma display panel panel (PDP), organic EL panel, the liquid crystal projector of adhesive substrates that 2 monolithic baseplate-laminatings are formed, comprise the manufacturing installation of the large-scale flat-panel screens (FPD) of reflective liquid crystal projector substrate and Field Emission Display (FED).

Claims (33)

1. lapping device is characterized in that possessing:

The microscope carrier unit is used for mounting substrate, with fixing this substrate that keeps of set normal condition;

The 1st grinding unit possesses the grinding stone that is used for grinding this base board end surface that this microscope carrier unit kept and is used for supporting substrate side edge part supporting mechanism below near the base board end surface of being ground by this grinding stone this substrate lateral margin portion; And

The 1st grinding unit travel mechanism grinds at this grinding stone under the state of this end face of this substrate, and the 1st grinding unit is moved with this substrate side edge part supporting mechanism this end face along this substrate.

2. lapping device as claimed in claim 1 is characterized in that wherein said the 1st grinding unit further possesses substrate side edge part maintaining body, and this that is used for keeping being supported by this substrate side edge part supporting mechanism is above the substrate side edge part.

3. lapping device as claimed in claim 1, it is characterized in that wherein said substrate side edge part supporting mechanism with low friction member support this substrate below.

4. lapping device as claimed in claim 2 is characterized in that wherein said substrate side edge part maintaining body, with low friction member keep this substrate above.

5. as claim 3 or 4 described lapping devices, it is characterized in that wherein said low friction member is free bearing.

6. lapping device as claimed in claim 1 is characterized in that wherein said microscope carrier unit possesses the central portion that is used for loading below this substrate, and attracts to keep the center microscope carrier of this central portion.

7. lapping device as claimed in claim 6 is characterized in that wherein said microscope carrier unit has most substrate supplemental support mechanisms that are disposed at around this center microscope carrier, to support the sidepiece below this substrate that remains in this center microscope carrier respectively.

8. lapping device as claimed in claim 7 is characterized in that wherein said substrate supplemental support mechanism has the supplemental support platform that is used for supporting below this substrate; This supplemental support platform with low friction member support this substrate below.

9. lapping device as claimed in claim 8 is characterized in that wherein said low friction member is free bearing.

10. lapping device as claimed in claim 7 is characterized in that wherein said substrate supplemental support mechanism has the supplemental support platform that is used for supporting below this substrate;

Be provided with the mechanism that is used for attracting keeping below this substrate in this supplemental support platform.

11. as claim 8 or 10 described lapping devices, it is characterized in that wherein said substrate supplemental support mechanism possesses slide mechanism, be used for making this supplemental support platform to slide and near and leave this center microscope carrier.

12. lapping device as claimed in claim 7 is characterized in that wherein said microscope carrier unit further possesses the microscope carrier rotating mechanism that is used for making this center microscope carrier rotation.

13. lapping device as claimed in claim 12 is characterized in that wherein said microscope carrier rotating mechanism, and substrate supplemental support mechanism is rotated with center microscope carrier one.

14. lapping device as claimed in claim 12, it is characterized in that wherein said the 1st grinding unit and the 1st grinding unit travel mechanism, be installed on the 1st grinding unit with the 1st horizontal beam and keep body, the 1st horizontal beam is along the base board end surface configuration that remains in the microscope carrier unit;

The 1st grinding unit keeps body to move in the vertical direction to the 1st horizontal beam.

15. lapping device as claimed in claim 14, it is characterized in that wherein said the 1st grinding unit is mounted to can keep the 1st horizontal beam of body to move along the 1st grinding unit, and the 1st grinding unit travel mechanism makes the 1st grinding unit move along the 1st horizontal beam.

16. lapping device as claimed in claim 14 is characterized in that wherein, is provided with the camera of the image that is used for taking the alignment mark of being located at substrate at the 1st grinding unit; And further possess:

Image processor is used for the image data of this captured alignment mark of this camera of computing; And

Control part according to the position information with this alignment mark after this image processor computing, comes computing to be loaded into the anglec of rotation of the substrate relative datum state of center cell.

17. lapping device as claimed in claim 15 is characterized in that it further possesses;

The 2nd grinding unit, possess grinding stone and substrate side edge part supporting mechanism, this grinding stone is used for grinding the end face that is positioned at the opposition side of the end face that is ground by the 1st grinding unit in the substrate that the microscope carrier unit kept, this substrate side edge part supporting mechanism be used for supporting near the substrate end-face that is ground by this grinding stone this substrate side edge part below; And

The 2nd grinding unit travel mechanism grinds at this grinding stone under the state of this base board end surface, and the 2nd grinding unit is moved along this base board end surface with this substrate side edge part supporting mechanism;

The 2nd grinding unit and the 2nd grinding unit travel mechanism are installed on the 2nd grinding unit with 2nd horizontal beam parallel with the 1st horizontal beam of the 1st grinding unit maintenance body and keep body, and the 2nd grinding unit keeps body moving the vertical direction of the 2nd horizontal beam is parallel.

18. lapping device as claimed in claim 17 is characterized in that wherein said microscope carrier rotating mechanism, this center microscope carrier is rotated into makes relative this normal condition of the substrate that is loaded into this center microscope carrier only rotate the set angle of 30～60 ° of scopes;

The 1st grinding unit and the 2nd grinding unit grind simultaneously respectively remain in this substrate on the microscope carrier of postrotational center relatively to this each end face.

19. a lapping device is characterized in that possessing:

The microscope carrier unit is used for mounting substrate, with fixing this substrate that keeps of normal condition;

4 grinding units, its possess the grinding stone of 4 each end faces that are used for grinding respectively this substrate that this microscope carrier unit kept respectively and be used for supporting respectively near this each end face of this substrate that is ground by this each grinding stone, the following substrate side edge part supporting mechanism of this substrate side edge part;

4 grinding unit travel mechanisms are used for making this each grinding unit to grind respectively under the state of this each end face of this substrate at this grinding stone respectively, move with this each substrate side edge part supporting mechanism this each end face along this substrate; And

4 grinding unit feed mechanisms, be used for making this each grinding unit respectively near and the direction of leaving this each end face of this substrate move.

20. lapping device as claimed in claim 19 is characterized in that wherein being respectively equipped with at this each grinding unit being used for taking respectively the image of the alignment mark of being located at this substrate, and takes the camera of the grinding part that this each grinding stone grinds; And further possess:

Image processor is used for to carrying out computing from this alignment mark of this each camera gained and the image data of this grinding part; And

Control part, according to position information with this alignment mark of this image processor computing, the anglec of rotation that this substrate that comes computing to be loaded into this center cell is counted from normal condition, and the amount of grinding of this each end face of computing are controlled this each grinding unit feed mechanism respectively.

21. lapping device as claimed in claim 20 is characterized in that wherein said each grinding unit between this each camera and this each grinding stone, has the air-blast device that is used for to this each camera winding-up air respectively.

22. a Ginding process utilizes the lapping device of claim 1 to carry out the grinding of substrate end-face, it is characterized in that, comprises:

Keep step,, fix this substrate of maintenance with this normal condition by this microscope carrier unit in this this substrate of microscope carrier unit load;

Support step, the side edge part of this substrate that this microscope carrier unit is kept, supported with this substrate side edge part supporting mechanism of the 1st grinding unit; And

Mobile step under this grinding stone of the 1st grinding unit grinds by the state of this side edge part end face of this substrate side edge part supporting mechanism support, makes the 1st grinding unit move along this end face in grinding by the 1st grinding unit travel mechanism.

23. Ginding process as claimed in claim 22, the 1st grinding unit that it is characterized in that wherein said lapping device have the substrate side edge part maintaining body above the side edge part that is used for keeping this substrate of being supported by this substrate side edge part supporting mechanism;

After this supports step, further comprise by this substrate side edge part maintaining body and keep this maintenance step above substrate side edge part of being supported by this substrate side edge part supporting mechanism.

24. Ginding process as claimed in claim 22 is characterized in that the center microscope carrier of wherein said microscope carrier unit has the attraction mechanism that is used for attracting this substrate center portion;

This keeps attracting the central portion of this substrate with this attraction mechanism of this center microscope carrier in the step.

25. Ginding process as claimed in claim 24, this microscope carrier unit that it is characterized in that wherein said lapping device, have most substrate supplemental support mechanisms that are disposed at around this center microscope carrier, to support the sidepiece below this substrate that this center microscope carrier kept respectively;

This keeps in step, and the sidepiece below this substrate that remains in this center microscope carrier that is fixed is supported by at least 1 this substrate supplemental support mechanism.

26. Ginding process as claimed in claim 25, this substrate supplemental support mechanism that it is characterized in that wherein said lapping device have this supplemental support platform is slided and near and leave the slide mechanism of this center microscope carrier;

This keeps in step, and this substrate auxiliary support member is slided, to support the sidepiece of this substrate that this center microscope carrier is maintained fixed.

27. Ginding process as claimed in claim 22 is characterized in that this microscope carrier unit of wherein said lapping device has the microscope carrier rotating mechanism that is used for making its center microscope carrier rotation;

This keeps in step, this end face of this substrate, the moving direction rotation of the 1st grinding unit that carries out along the 1st grinding unit travel mechanism by this rotating mechanism.

28. Ginding process as claimed in claim 22, the 1st grinding unit and the 1st grinding unit travel mechanism that it is characterized in that wherein said lapping device, be installed on the 1st grinding unit and keep body with horizontal beam, this base board end surface configuration that this horizontal beam is kept along this microscope carrier unit, the 1st grinding unit keep body moving the vertical direction of this horizontal beam is parallel;

In this mobile step, the 1st grinding unit during being moved by the 1st grinding unit travel mechanism, keeps body to move along this end face of this substrate by the 1st grinding unit.

29. a Ginding process utilizes the lapping device of claim 15 to carry out the grinding of substrate end-face, it is characterized in that, comprises:

Keep step,, this substrate is fixed maintenance with normal condition by this microscope carrier unit in this microscope carrier unit load substrate;

Support step, the 1st grinding unit, the side edge part that remains in this substrate of this microscope carrier unit are supported by this substrate side edge part supporting mechanism; And

Mobile step is ground at this grinding stone of the 1st grinding unit under the state of end face of the side edge part that is supported by this substrate side edge part supporting mechanism, by the 1st grinding unit travel mechanism the 1st grinding unit is moved along just polished end face;

And further comprise:

After this maintenance step and before this moves step, take the step of the set alignment mark of this substrate that this microscope carrier unit kept by a camera;

Then, the image data of this alignment mark is handled by an image processor, and generated the step of the position information of this alignment mark; And

Then, according to the position information of this alignment mark after handling at this image processor, come this substrate of computing step of the anglec of rotation of this normal condition relatively;

Move in the step at this, control the 1st grinding unit according to the anglec of rotation after this computing and keep moving of body, the 1st grinding unit is moved along this end face of this substrate.

30. a Ginding process utilizes the grinding of the substrate end-face that the described lapping device of claim 18 carries out, and it is characterized in that, comprises:

Keep step,, this substrate is kept so that this normal condition is fixing by this microscope carrier unit in this this substrate of microscope carrier unit load;

The rotation step makes this microscope carrier unit rotate this substrate set angle of this reference position relatively with this microscope carrier rotating mechanism;

Support step, will remain in this substrate side edge part respect to one another of this microscope carrier unit, respectively this substrate side edge part supporting mechanism with the 1st grinding unit and the 2nd grinding unit is supported respectively; And

Mobile step, respectively this grinding stone at the 1st grinding unit and the 2nd grinding unit grinds under the state of the side edge part end face that is supported by this each substrate side edge part supporting mechanism, keep body and keep body with the 1st grinding unit travel mechanism and the 1st grinding unit, make the 1st grinding unit and the 2nd grinding unit along being moved respectively by this each end face in grinding with the 2nd grinding unit travel mechanism and the 2nd grinding unit.

31. Ginding process as claimed in claim 30 is characterized in that wherein said set angle, relatively the angle of 30 of this normal condition °～60 ° of scopes.

32. a Ginding process utilizes the described lapping device of claim 20 to carry out the grinding of substrate end-face, it is characterized in that, comprises:

Keep step,, this substrate is fixed maintenance with this normal condition by this microscope carrier unit in this this substrate of microscope carrier unit load;

Support step, the side edge part of this substrate that this microscope carrier unit is kept is supported respectively with this substrate side edge part supporting mechanisms of this 4 grinding units; And

Mobile step under this grinding stone of this each grinding unit grinds by the state of each end face of the side edge part of this each substrate side edge part supporting mechanism support, makes this each grinding unit move along just polished this end face with this each grinding unit travel mechanism.

33. Ginding process as claimed in claim 32, it is characterized in that in the wherein said mobile step, according to image data, come the amount of grinding of this each end face of computing respectively, to control this each grinding unit feed mechanism respectively from this grinding part of this each camera gained.

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