CN1006612B - 物品的钎焊装置 - Google Patents

物品的钎焊装置

Info

Publication number
CN1006612B
CN1006612B CN86104933A CN86104933A CN1006612B CN 1006612 B CN1006612 B CN 1006612B CN 86104933 A CN86104933 A CN 86104933A CN 86104933 A CN86104933 A CN 86104933A CN 1006612 B CN1006612 B CN 1006612B
Authority
CN
China
Prior art keywords
brazing
heat transfer
liquid
transfer liquid
solder paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CN86104933A
Other languages
English (en)
Chinese (zh)
Other versions
CN86104933A (zh
Inventor
近藤权士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CN86104933A publication Critical patent/CN86104933A/zh
Publication of CN1006612B publication Critical patent/CN1006612B/zh
Expired legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0002—Soldering by means of dipping in a fused salt bath
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Molten Solder (AREA)
CN86104933A 1985-09-17 1986-07-30 物品的钎焊装置 Expired CN1006612B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP203345/85 1985-09-17
JP60203345A JPS6264475A (ja) 1985-09-17 1985-09-17 物品の融着接合装置
JP203345/88 1985-09-17

Publications (2)

Publication Number Publication Date
CN86104933A CN86104933A (zh) 1987-03-18
CN1006612B true CN1006612B (zh) 1990-01-31

Family

ID=16472487

Family Applications (1)

Application Number Title Priority Date Filing Date
CN86104933A Expired CN1006612B (zh) 1985-09-17 1986-07-30 物品的钎焊装置

Country Status (4)

Country Link
EP (1) EP0217588A1 (enExample)
JP (1) JPS6264475A (enExample)
KR (1) KR870003680A (enExample)
CN (1) CN1006612B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4747533A (en) * 1986-04-28 1988-05-31 International Business Machines Corporation Bonding method and apparatus
DE4103098C1 (enExample) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
WO2002051221A1 (en) * 2000-12-21 2002-06-27 Fujitsu Limited Reflow soldering apparatus and reflow soldering method
DE102007054710B3 (de) * 2007-11-16 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Herstellung einer Halbleiterbaugruppe

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765475A (en) * 1971-06-04 1973-10-16 Iteck Corp Apparatus for soldering thick film substrates
US3866307A (en) * 1973-09-07 1975-02-18 Western Electric Co Method for soldering, fusing or brazing
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing
US4032033A (en) * 1976-03-18 1977-06-28 Western Electric Company, Inc. Methods and apparatus for heating articles
US4389797A (en) * 1981-06-23 1983-06-28 The Htc Corporation Continuous vapor processing system
US4558524A (en) * 1982-10-12 1985-12-17 Usm Corporation Single vapor system for soldering, fusing or brazing
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere

Also Published As

Publication number Publication date
JPH0354030B2 (enExample) 1991-08-16
EP0217588A1 (en) 1987-04-08
CN86104933A (zh) 1987-03-18
JPS6264475A (ja) 1987-03-23
KR870003680A (ko) 1987-04-18

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SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C13 Decision
GR02 Examined patent application
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term