1237535 Δ7 Α7 Β7 五、發明説明（i ) [技術領域] 本發明係關於焊接印刷基板之方法及其裝置。 [習知技術] 使用衣:置進f了印刷基板之焊接方法中，有浸漬法及回 流法。 所謂浸漬法，係以設有助焊劑機、預熱器、焊錫槽、 冷卻裝置之自動焊接裝置進行焊接之方法。該浸漬法，係 將離散兀件之長引線插入印刷基板之孔中，或將具有多數 引線之表面安裝元件暫時固定後，將該印刷基板以自動焊 接裝置之助焊劑機來進行助焊劑塗佈'以預熱器進行預熱 、於焊錫槽中附著熔融之焊錫、再以冷卻裝置予以冷卻者 。該浸漬法’係使印刷基板僅通過一次自動焊接裝置，即 能將所有的焊接位置予以焊接之生產性最優異者。 所謂回流法，係以設有預熱器、加熱器、冷卻裝置之 回流爐進行焊接之方法。該回流法，係預先於印刷基板之 焊接部塗佈由粉狀焊錫與助焊劑所構成之焊錫膏（solder paste)，於該塗佈部裝載QFP、s〇IC、晶片電容、晶片電 阻等之表面安裝元件。然後，將此印刷基板以回流爐之預 熱器預熱、以加熱器加熱至粉狀焊錫之熔融溫度以上使粉 狀焊錫熔融後，再以冷卻裝置予以冷卻、以進行焊接者。 現有的浸漬法或回流法，在熔融焊錫附著於印刷基板 後’係以冷卻裝置進行冷卻，此一冷卻以急速冷卻較佳， 因此想出了各種辦法。例如，在自動焊接裝置中於焊錫槽 4 _ 紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 1237535 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（y ) 旁設置風扇，或在回流爐中於加熱器旁設置風扇或冷風噴 吹裝置等來使熔融之焊錫急速冷卻。 一般來說，現有的浸漬法或回流法中將熔融之焊錫附 著於印刷基板後，所進行之冷卻的冷卻速度爲3°C/秒以上 ，此外，最近爲了防止剝離，亦有進行冷卻速度爲10°C/秒 以上之急速冷卻。 現有的焊接方法中，使熔融焊錫急速冷卻之理由，係 由於在以搬送裝置搬送印刷基板時若產生振動，熔融之焊 錫會在凝固時因爲振動而產生裂縫或裂痕之故。 目前，一般所使用之焊錫合金係Sn-Pb合金。此Sn-Pb合金中，共晶組成者其熔點爲183°C，以此焊錫進行之 焊接溫度，亦即、浸漬法之焊錫槽之熔融焊錫之溫住約爲 230°C，又，回流法之加熱溫度約爲220°C。使用此Sn-Pb 合金之浸漬法或回流法的焊接溫度，係不會對電子元件或 印刷基板造成熱損傷之適當的溫度。_ 此外，由於Sn-Pb合金對印刷基板或電子元件具有非 常良好之濕性，因此如未焊接等之焊接不良的情形少、可 靠性優異。 然而，以Sn-Pb焊錫加以焊接之電氣製品變舊、或故 障而以掩埋方式加以丟棄的話，將會因酸雨使得其中之鉛 成份溶解而滲入地下，混入地下水中。若長年飮用含有鉛 成份之地下水的話，鉛的成份即會積於體內、最後導致鉛 中毒。是以，最近皆鼓勵使用一種完全不含給之焊錫，亦 即所謂之「無鉛焊錫」。所謂之無鉛焊錫，係在Sn之主成 5 (請先閱讀背面之注意事項再填寫本頁)1237535 Δ7 Α7 B7 V. Description of the Invention (i) [Technical Field] The present invention relates to a method and a device for soldering a printed circuit board. [Know-how] Use clothing: Among the soldering methods in which a printed circuit board is placed, there are a dipping method and a reflux method. The so-called dipping method is a method of welding by an automatic welding device provided with a flux machine, a preheater, a solder bath, and a cooling device. The dipping method is to insert long leads of discrete components into holes of a printed circuit board, or temporarily fix a surface-mounted component having a large number of leads, and then apply flux to the printed circuit board using a flux machine of an automatic welding device. 'The person who preheats with a preheater, adheres the molten solder in a solder bath, and cools it with a cooling device. This immersion method 'is the one with the best productivity that enables a printed circuit board to be soldered at all soldering positions only by an automatic soldering device once. The so-called reflow method is a method of performing soldering in a reflow furnace provided with a preheater, a heater, and a cooling device. In this reflow method, a solder paste composed of powdered solder and a flux is applied to a soldering portion of a printed circuit board in advance, and QFP, soIC, chip capacitors, chip resistors, and the like are mounted on the coating portion. Surface mount components. Then, the printed circuit board is preheated by a preheater in a reflow furnace, heated by a heater to a temperature higher than the melting temperature of the powder solder, and the powder solder is melted, and then cooled by a cooling device to perform soldering. In the conventional dipping method or reflow method, after the molten solder is attached to the printed substrate, it is cooled by a cooling device. This cooling is preferably performed by rapid cooling. Therefore, various methods have been devised. For example, in an automatic soldering device for the solder bath 4 _ paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back before filling this page) Order the Intellectual Property Bureau Employee Consumer Cooperatives Printed 1237535 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. The description of the invention (y) Install a fan next to it, or install a fan or cold air blowing device next to the heater in the reflow furnace to rapidly cool the molten solder. . Generally, in the conventional dipping method or reflow method, after the molten solder is attached to a printed circuit board, the cooling rate for cooling is 3 ° C / sec or more. In addition, recently, in order to prevent peeling, the cooling rate is also Rapid cooling above 10 ° C / s. In the conventional soldering method, the reason for rapidly cooling the molten solder is that if vibration occurs when the printed circuit board is transported by the transfer device, the molten solder may crack or crack due to vibration when it is solidified. At present, the commonly used solder alloys are Sn-Pb alloys. In this Sn-Pb alloy, the eutectic composition has a melting point of 183 ° C, and the soldering temperature of this solder, that is, the temperature of the molten solder in the solder bath of the dipping method is about 230 ° C, and the reflow method The heating temperature is about 220 ° C. The soldering temperature using the dip method or reflow method of this Sn-Pb alloy is an appropriate temperature that does not cause thermal damage to electronic components or printed boards. _ In addition, since Sn-Pb alloy has very good wettability to printed circuit boards or electronic components, there are few cases of poor soldering such as non-soldering and excellent reliability. However, if electrical products soldered with Sn-Pb solder become old or fail and are discarded in a buried manner, lead components in them will dissolve due to acid rain and infiltrate into the ground, mixing them into groundwater. If groundwater containing lead is used for many years, lead will accumulate in the body and lead to lead poisoning. Therefore, the use of a completely free solder has been recently encouraged, so-called "lead-free solder". The so-called lead-free solder is based on Sn 5 (Please read the precautions on the back before filling this page)
本紙張尺度適用中國國家標準（CNS ) Μ規格（210X297公釐） 1237535 at B7 五、發明説明（）） 份中添加 Ag、Cu、Zn、Sb、Bi、In、Ni、Cr、Mo、Fe、 Co、P、Ga等之一種以上者。 雖然在無鉛焊錫中大量添加Bi或In等即能大幅降低 熔點，但大量添加Bi會使得焊錫本身變脆，而使得焊接後 易自焊接處剝離，又，由於In之價格高昂，故In之大量 添加在經濟上亦不適宜。因此’不大量添加Bi、In之一般 的無鉛焊錫，其熔點爲200°C以上之高溫，焊接溫度在浸 清法爲250°C以上，回流法則在240°C以上。諸如此種焊接 溫度較高之情形中，須縮短電子元件及印刷基板曝露於高 溫下之時間以減少熱影響，因此加以急冷被視爲是理所當 然之事。 [發明欲解決之課題] 經濟部智慧財產局員工消費合作社印製 n Jn ...... - - — j I— ......- ......m - (請先閲讀背面之注意事項再填寫本頁) 然而，以無鉛焊錫進行焊接後，若將印刷基板加以急 冷的話，會有產生縮孔使黏著強度變弱、或使電子元件發 生破損等之問題。本發明之目的，即在提供一種即使以無 鉛焊錫焊接印刷基板，亦不致產生縮孔或電子元件之破損 的焊接方法及裝置。 [用以解決課題之方法] 本案發明人在對焊接部之縮孔及電子元件破損之原因 經過銳意硏究後之結果，發現其原因全係由於焊接後之急 冷所造成。亦即，在將焊接部所附著之熔融焊錫急冷後， 先凝固之部份雖無體積變化，但最後凝固之部份會因全體 一 _ 6 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1237535 A7 B7 五、發明説明（十） (請先閲讀背面之注意事項再填寫本頁} 之凝固收縮量集中於此而產生非常大的收縮，亦即成爲縮 孔。此外’右在焊接後將印刷基板急冷的話，在焊接時全 體被加熱成高溫之電子元件，其表面之溫度下降而與內部 產生溫度差。如此一來，僅電子元件之表面熱收縮而產生 裂縫。 因此，本案發明人著眼於爲了不使焊接部產生縮孔， 只要使熔融焊錫全體同樣的凝固，爲了不使電子元件破損 ，只要使冷卻時全體之溫度一定，以及最近的自動焊接裝 置及回流爐之搬送裝置皆以良好之精度之製造，因此在班 送過程中極少產生振動等，而完成了本發明。 本案之第1發明，係一印刷基板之焊接方法，其特徵 在於··於印刷基板焊接後之冷卻時，在印刷基板所附著之 熔融焊錫達到該熔融焊錫之固相線溫度前，以rc/秒以 下之冷卻速度進行冷卻。 經濟部智慧財產局員工消費合作社印製 本案之第2發明，係一印刷基板之焊接方法，其特徵 在於：於以自動焊接裝置實施印刷基板上之助焊劑塗佈、 預熱、與熔融焊錫之接觸後的冷卻時，在印刷基板所附著 之熔融焊錫達到該熔融焊錫之固相線溫度前，以1°C/秒 以下之冷卻速度進行冷卻。 本案之第3發明，係一印刷基板之焊接方法，其特徵 在於：於印刷基板塗佈焊錫膏、將該焊錫膏以回流爐加以 熔融後之冷卻時，在印刷基板所附著之熔融焊錫達到該熔 融焊錫之固相線溫度前，以1°C/秒以下之冷卻速度進行 冷卻。 2_ 本紙張尺度適用中國國家標準（CNS ) A4規格（X 297公釐） 1237535 A7 B7 五、發明説明（彳） 本案之第4發明，係一自動焊接裝置，其特徵在於： 於搬送裝置之下方沿印刷基板之行進方向依序設置助焊劑 機、預熱器、焊錫槽，且鄰接焊錫槽設置漸冷裝置。 本案之第5發明，係一回流爐，其特徵在於：於險道 內（tunnel)沿印刷基板之行進方向依序設置、預熱器、加熱 器，且鄰接加熱器設置漸冷裝置。 [圖示之簡單說明] 第1圖，係設置熱風吹出型加熱器來作爲漸冷裝置之 本發明之自動焊接裝置的前視截面圖。 第2圖，係設置紅外線加熱器來作爲漸冷裝置之本發 明之自動焊接裝置的前視截面圖。 第3圖，係設置空洞體來作爲漸冷裝置之本發明之自 動焊接裝置的前視截面圖。 第4圖，係設置熱風吹出型加熱器來作爲漸冷裝置之 本發明之回流爐的前視截面圖。 自動焊接裝置 搬送裝置 助焊劑機 預熱器 焊錫槽 漸冷裝置 _____8 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) -訂 [符號說明] 1 2 3 4 5 6 經濟部智慧財產局員工消費合作社印製 Α7 Β7 1237535 五、發明説明（ο 7、40 螺旋槳風扇 13 、 37 、 38 、 39 熱風吹出型加熱器 21 紅外線加熱器 24 空涧體 30 回流爐 31 隧道 33 預熱區 34 加熱區 35 漸冷區 36 冷卻區 Ρ 印刷基板 [實施形態] 璉濟部智慧財產局員工消費合作社印製 本發明之焊接方法中，若冷卻附著於印刷基板之熔融 焊錫的冷卻速度較l°c/秒爲快的話，則熔融焊錫全體之 凝固加快，局部會最後凝固而產生縮孔。此外，附著於印 刷基板之熔融焊錫的冷卻狀態大致與印刷基板縮搭載之電 子元件的冷卻狀態相同，但若電子元件的冷卻速度較rc /秒爲快的話，如陶瓷積層電子元件般者即會在表面與內 部之間產生溫度差而破損。 本發明之自動焊接裝置，係鄰接焊錫槽設置漸冷裝置 。該漸冷裝置，只要是能使印刷基板所附著之熔融焊錫達 到該熔融焊錫之固相線溫度前，慢慢的加以冷卻的話，無 論何種裝置皆可採用，但較適合本發明所使用之裝置，有 ___ 9 本紙張尺度適用中國國家榡準（CNS ) μ規格（210X297公釐） 1237535 A7 B7 五、發明説明（q) 一邊對被加熱物進行加熱一邊能漸漸的予以冷卻之熱風吹 出型加熱器、或紅外線加熱器，此外，將行進之印刷基板 之周圍加以包覆以進行加溫之空洞體亦能進行逐漸冷卻。 又，本發明之回流爐亦可採用與前述自動焊接裝置丰目 同之冷卻裝置。 [實施例] 以下，根據圖式說明本發明。第1圖，係設置熱風吹 出型加熱器來作爲漸冷裝置之本發明之自動焊接裝置的前 視截面圖，第2圖，係設置紅外線加熱器來作爲漸冷裝置 之本發明之自動焊接裝置的前視截面圖，第3圖，係設置 空洞體來作爲漸冷裝置之本發明之自動焊接裝置的前視截 面圖’第4圖，係設置熱風吹出型加熱器來作爲漸冷裝置 之本發明之回流爐的前視截面圖。 經濟部智慧財產局員工消費合作社印製 首先，就第1圖所示之實施例加以說明。自動焊接裝 置1上，搬送裝置2係相對行進方向（箭頭A方向）以略爲 向上方傾斜(3〜5度)之方式行進。於搬送裝置2的下方，. 沿行進方向依序設置助熔劑機3、預熱器4、焊錫槽5、漸 冷裝置6，此外，進一步的，於前面上方設有冷卻裝置之 螺旋槳風扇7。 搬送裝置2,其一對無端鏈條輸送帶以同一速度向同 一方向行進，於鏈上安裝有多數之爪。欲焊接之印刷基板 P ’即在鏈條間以多數之爪加以保持進行搬送。 助焊劑機3，係以發泡管使液體狀之助焊劑8成爲泡 ^___\〇______ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 經濟部智慧財產局員工消費合作社印製 1237535 A7 B7 五、發明説明u ) 狀後加以噴出，將助焊劑均勻的塗佈於通過上方之印刷基 板的下面者。 預熱器4，係設置電熱器9之紅外線加熱器。預熱器 ，係用以將助焊劑塗佈後之印刷基板預熱至約110。(：左右 ，以使助焊劑中之溶劑揮發，且促進助焊劑之活性化，同 時在下一個高溫之熔融焊錫浸漬時，用以緩和對印刷基板 及電子元件之熱衝擊者。 焊錫槽5，係使投入之焊錫熔融且保持一定溫度者。 焊錫槽內設有一次噴嘴11與二次噴嘴12。一次噴嘴11係 噴出較強之氣流，以使熔融焊錫侵入電子元件之角落部及 穿透孔等熔融焊錫較不易侵入之位置，二次噴嘴12係噴出 較爲穩定之氣流，以正在一次噴嘴之浮接時所產生之_橋 接現象或焊珠。 第1圖所不之貫施例中的漸冷裝置6，係熱風吹出型 加熱器13,係對在焊接槽10中附著熔融焊錫之印刷基板 進行漸冷者。該熱風吹出型加熱器，係不使印刷基板昇溫 而使其溫度漸漸下降者’其冷卻速度爲1°C/秒以下。熱 風吹出型加熱器13，其本體爲箱型，於底部形成有流入口 15，流入口以流通路Π連通於上部開口之吸入口 16。本 體14之上部，設有包覆陶瓷18之多孔質金屬板19，該多 孔質金屬板之下面設有電熱器。又，流通路17中在流 入口 15的下部設有橫流式(cross flow)風機21。 接著，說明熱風吹出型加熱器之漸冷作用。首先，對 熱風吹出型加熱器13之電熱器2〇通電使成爲加熱狀態。 11 5^尺度適用中國國家標準（（：奶）八4規格（210/297公釐)This paper size applies Chinese National Standard (CNS) M specification (210X297 mm) 1237535 at B7 V. Description of the invention ()) Ag, Cu, Zn, Sb, Bi, In, Ni, Cr, Mo, Fe, One or more of Co, P, Ga and the like. Although a large amount of Bi or In added to lead-free solder can greatly reduce the melting point, a large amount of Bi will make the solder itself brittle, and it will be easy to peel off from the soldering place after welding. In addition, due to the high price of In, a large amount of In Addition is also economically inappropriate. Therefore, the general lead-free solder that does not add a large amount of Bi and In has a melting point of 200 ° C or higher, the soldering temperature is 250 ° C or higher by the immersion method, and 240 ° C or higher by the reflow method. In such cases where the soldering temperature is high, it is necessary to shorten the exposure time of electronic components and printed boards to high temperatures to reduce thermal effects. Therefore, it is considered natural to quench. [Questions to be Invented] Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs n Jn ......---j I-......- ...... m-(Please read first Note on the back of this page, please fill in this page again) However, after soldering with lead-free solder, if the printed circuit board is rapidly cooled, it may cause shrinkage holes, weaken the adhesive strength, or damage electronic components. An object of the present invention is to provide a soldering method and apparatus that do not cause shrinkage or damage to electronic components even when a printed circuit board is soldered with lead-free solder. [Method to solve the problem] The inventor of this case studied the causes of shrinkage in the soldering part and the damage of the electronic components, and found that all the causes were caused by the rapid cooling after soldering. In other words, after the molten solder attached to the soldering part is quenched, the solidified part will not change in volume, but the solidified part will be changed for the whole. 6 This paper size applies the Chinese National Standard (CNS) A4 specification ( 210X297 mm) 1237535 A7 B7 V. Description of the invention (ten) (Please read the precautions on the back before filling out this page} The amount of solidification shrinkage concentrated on this causes a very large shrinkage, that is, shrinkage. In addition, 'right If the printed circuit board is rapidly cooled after soldering, the entire electronic component that is heated to a high temperature during soldering will have a lower surface temperature and a temperature difference from the inside. As a result, only the surface of the electronic component will shrink due to thermal contraction. Therefore, The inventors of this case focused on not to cause shrinkage in the soldering portion, as long as the entire molten solder is solidified, and in order not to damage the electronic components, as long as the entire temperature is kept constant during cooling, and the latest automatic soldering equipment and reflow furnace transport The devices are all manufactured with good accuracy, so that vibrations and the like are rarely generated during the course delivery, and the present invention has been completed. The invention is a soldering method for a printed circuit board, characterized in that, when the printed circuit board is cooled after the soldering, before the molten solder adhered to the printed circuit board reaches the solidus temperature of the molten solder, it is cooled by rc / sec or less The second invention, printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, is a method for soldering a printed circuit board, which is characterized in that the automatic soldering device is used to apply flux on the printed circuit board, preheat, During the cooling after contact with the molten solder, before the molten solder attached to the printed substrate reaches the solidus temperature of the molten solder, the cooling is performed at a cooling rate of 1 ° C / sec or less. A soldering method for a printed circuit board is characterized in that when a soldering paste is applied to the printed circuit board and the soldering paste is melted in a reflow furnace and cooled, before the molten solder adhered to the printed circuit board reaches the solidus temperature of the molten solder, , Cooling at a cooling rate below 1 ° C / sec. 2_ This paper size applies the Chinese National Standard (CNS) A4 specification (X 297 mm) 1237 535 A7 B7 V. Description of the Invention (4) The fourth invention of this case is an automatic soldering device, which is characterized in that a flux machine, a preheater, and a solder bath are sequentially arranged below the conveying device in the direction of the printed substrate. A cooling device is provided adjacent to the solder bath. The fifth invention of the present case is a reflow furnace, which is characterized in that a preheater, a heater, and a heater are sequentially arranged in a tunnel along the traveling direction of the printed substrate, and A gradual cooling device is provided adjacent to the heater. [Simplified description of the figure] FIG. 1 is a front cross-sectional view of the automatic welding device of the present invention in which a hot-air blow-out heater is provided as a gradual cooling device. FIG. 2 is a set The infrared heater is a front sectional view of the automatic welding device of the present invention as a progressive cooling device. Fig. 3 is a front sectional view of the automatic welding device of the present invention provided with a hollow body as a gradually cooling device. Fig. 4 is a front sectional view of a reflow furnace according to the present invention in which a hot-air blow-out heater is provided as a gradually cooling device. Automatic soldering device transfer device Flux machine preheater solder tank cooling device _____8 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)-Order [Symbol description] 1 2 3 4 5 6 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Α7 Β7 1237535 V. Description of the invention (ο 7, 40 Propeller fans 13, 37, 38, 39 Hot-air blow-out heater 21 Infrared heater 24 Empty carcass 30 Reflow furnace 31 Tunnel 33 Preheating zone 34 Heating zone 35 Cooling zone 36 Cooling zone P Printed substrate [Embodiment] The Ministry of Economic Affairs ’Intellectual Property Bureau employee consumer cooperative prints the welding method of the present invention. If the cooling rate of the molten solder adhered to the printed circuit board is faster than 1 ° C / sec, the solidification of the entire molten solder will be accelerated, and the partial solidification will eventually cause shrinkage. In addition, the cooled state of the molten solder adhered to the printed circuit board is roughly It is the same as the cooling state of the electronic components mounted on the printed circuit board, but if the cooling speed of the electronic components is faster than rc / s, such as A ceramic laminated electronic component will cause a temperature difference between the surface and the inside to cause damage. The automatic soldering device of the present invention is provided with a cooling device adjacent to the solder bath. The cooling device can be used as long as it can attach the printed substrate. If the molten solder is cooled slowly before it reaches the solidus temperature of the molten solder, no matter what kind of device can be used, but it is more suitable for the device used in the present invention. ___ 9 This paper size is applicable to China's national standards (CNS) μ specifications (210X297 mm) 1237535 A7 B7 V. Description of the invention (q) Hot air blow-out heater or infrared heater that can gradually cool while heating the object to be heated. The cavity surrounding the printed substrate for heating can also be gradually cooled. In addition, the reflow furnace of the present invention can also use the same cooling device as the aforementioned automatic welding device. [Example] Hereinafter, according to the figure The present invention is illustrated by the formula. FIG. 1 is a front sectional view of the automatic welding apparatus of the present invention in which a hot-air blow-out heater is provided as a gradually cooling device. FIG. 2 is a front cross-sectional view of the automatic welding device of the present invention provided with an infrared heater as a progressive cooling device, and FIG. 3 is a front view of the automatic welding device of the present invention provided with a hollow body as a progressive cooling device Section 4 'is a front sectional view of the reflow furnace of the present invention in which a hot-air blow-out heater is provided as a gradually cooling device. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs First, as shown in Figure 1 The embodiment will be described. In the automatic welding device 1, the conveying device 2 travels in a manner inclined slightly upward (3 to 5 degrees) with respect to the traveling direction (direction of arrow A). Below the conveying device 2, a flux machine 3, a preheater 4, a solder tank 5, and a cooling device 6 are sequentially arranged along the traveling direction. Furthermore, a propeller fan 7 of a cooling device is further provided above the front. The conveying device 2 has a pair of endless chain conveyor belts traveling at the same speed in the same direction, and a plurality of claws are mounted on the chain. The printed substrate P 'to be soldered is held by a plurality of claws between the chains and conveyed. Flux machine 3 is made of foamed tube to make liquid flux 8 become a bubble ^ ___ \ 〇 ______ This paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm) Employees of Intellectual Property Bureau of the Ministry of Economy The cooperative prints 1237535 A7 B7 V. Description of the invention u) and spray it out, and the flux is evenly applied to the lower part of the printed substrate passing through it. The preheater 4 is an infrared heater provided with an electric heater 9. The preheater is used to preheat the printed substrate after the flux is applied to about 110. (: Left and right, to make the solvent in the flux evaporate and promote the activation of the flux, and at the same time, to reduce the thermal shock to the printed circuit board and electronic components when the next high temperature molten solder is immersed. Solder bath 5, series Those who melt the input solder and maintain a certain temperature. A primary nozzle 11 and a secondary nozzle 12 are provided in the solder bath. The primary nozzle 11 emits a strong airflow to allow molten solder to intrude into the corners and penetration holes of electronic components. Where the molten solder is less susceptible to intrusion, the secondary nozzle 12 emits a relatively stable airflow, so that the _ bridging phenomenon or welding beads generated when the primary nozzle floats. The gradual change in the embodiment shown in Figure 1 The cooling device 6 is a hot-air blow-out heater 13 that cools a printed circuit board with molten solder adhered to the soldering tank 10. The hot-air blow-out heater is a device that does not increase the temperature of the printed circuit board and gradually lower its temperature. 'The cooling rate is 1 ° C / sec or less. The hot-air blow-out heater 13 has a box shape, and an inflow port 15 is formed at the bottom. The inflow port communicates with the upper opening through a flow path Π. 16. On the upper part of the main body 14, a porous metal plate 19 coated with ceramic 18 is provided, and an electric heater is provided on the lower surface of the porous metal plate. A cross-flow type (cross) flow) fan 21. Next, the gradual cooling effect of the hot-air blow-out heater will be described. First, the electric heater 20 of the hot-air blow-out heater 13 is energized to become a heating state. 11 5 ^ size applies Chinese national standards ((: milk ) 8 4 specifications (210/297 mm)
1237535 A7 B7 五、發明説明（1 ) 此時與該電熱器接觸之多孔質金屬板19被加熱，且表面所 包覆之陶瓷18亦被加熱。由於陶瓷被加熱後會射出遠紅外 線，遠紅外線即均勻的加熱被加熱物全體。此時，以未圖 示之馬達使橫流式風機21旋轉，即自吸入口 16吸入空氣 送至本體14內。送至本體14內之空氣被電熱器20加熱， 且在通過多孔質金屬板19時亦被加熱成爲溫風吹出。此時 之溫風溫度，不至使印刷基板昇溫而使其溫度漸漸下降， 其冷卻速度爲1C/秒以下。 該熱風吹出型加熱器，當印刷基板通過上方時，吹到 印刷基板之溫風即被印刷基板彈回而向吸入口 16方向流動 。然後，由於該溫風係自吸入口 16以溫的狀態流入本體 14內，因此熱放射少而能節省能源。 冷卻裝置之螺旋槳風扇7，係在漸冷裝置6之附近設 置於搬送裝置2的上方。螺旋槳風扇，係用來在以漸冷裝 置冷卻、焊錫完全凝固後，將印刷基板取出時不至使作業 者受到烫傷程度之冷卻用。 經濟部智慧財產局員工消費合作社印製 第2圖係設置紅外線加熱器21來作爲漸冷裝置者。第 2圖所示之實施例，由於除了漸冷裝置外皆與第1圖之實 施例相同，因此同一構成係賦予相同符號並省略其說明。 紅外線加熱器22，其內部設置電熱器23，導電時即會 發熱，向上方射出紅外線。該紅外線加熱器之漸冷裝置之 溫度，係對在焊錫槽中附著於印刷基板之熔融焊錫進行逐 漸冷卻程度之溫度，此處，漸冷之冷卻速度爲1°C/秒以 下。 ‘12 _ ^^尺度適用中國國家標準（CNS ) A4規格（210X297公釐1 " 1237535 A7 B7 五、發明説明（β ) 第3圖係設置空洞體24來作爲漸冷裝置者。第3圖所 示之實施例，由於除了漸冷裝置外皆與第丨圖之實施例相 同，因此同一構成係賦予相同符號並省略其說明。 空洞體24，以能覆蓋預熱器4、焊錫槽5、及自焊錫 槽到前方之搬送裝置2者較佳。空洞體係利用自預熱器4 及焊錫槽5所發出之熱者，藉覆蓋預熱器及焊錫槽，不至 使該等所發出之熱輻射至外部，因此能對焊接後之印刷基 板予以保溫以進行漸冷。 其次’說明實施例1之自動焊接裝置之印刷基板的焊 接方法。焊錫槽中之焊錫，係使用SN—3Ag- 0.5Cii之無 鉛焊錫(熔點爲217°C)。 經濟部智慧財產局員工消費合作社印製 印刷基板P上，於穿透孔中插入引線構件之引線。該 印刷基板，係以搬送速度爲1.3m/分行進之搬送裝置2加 以搬送，以助熔劑機3塗佈樹脂系之助熔劑、以預熱器4 預熱至130°C，然後使用焊錫之熔融溫度爲240°C之焊錫槽 5的一次噴嘴11、二次噴嘴12將熔融焊錫附著於其上。附 著了熔融焊錫之印刷積基板，接著通過漸冷裝置6之熱風 吹出型加熱器13上，此時印刷基板因熱風吹出型加熱器 13所發出之遠紅外線及吹出之溫風而漸漸冷卻。此時之冷 卻速度爲〇.7t/秒。接著，印刷基板所附著之熔融焊錫在 熱風吹出型加熱器13之端部附近完全凝固後，再以冷卻裝 置之螺旋槳風扇7以5t/秒之冷卻速度加以急冷，而冷 卻至即使觸摸亦不至受到烫傷的程度。 以上述焊接方法加以焊接之印刷基板，不會在焊接部 _____13___ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1237535 A7 B7 五、發明説明（u) 產生縮孔，即使拉扯電子元件亦未產生引線輕易自穿透孔 脫離之情形。 其次，說明本發明之回流爐。回流爐30，其內部爲隧 道31，搬送裝置32行進於其中。隧道內，沿搬送裝置32 之行進方向（箭頭B)依序爲預熱區33、加熱區34、漸冷區 35、冷卻區36。 於預熱區33之上下部設有熱風吹出型加熱器37,於 加熱區34之上下部亦設有熱風吹出型加熱器38。又，於 漸冷區35之上下部亦設有熱風吹出型加熱器39。由於對 熱風吹出型加熱器之構造及作用等已在第1圖之實施例中 加以說明，因此此處予以省略。於冷卻區36之上下部設有 冷卻裝置之螺旋槳風扇40。 經濟部智慧財產局員工消費合作社印製 接著，說明使用上述回流爐之印刷基板的焊接方法。 印刷基板上塗佈SN- 3Ag—0.5Cii之無鉛焊錫(熔點爲217 °C)之焊錫膏，於該塗佈部裝載有陶瓷積層表面安裝元件。 印刷基板P以搬送速度爲1.5m/分之搬送裝置32搬送至 回流爐30之隧道31內，首先以預熱區33之熱風吹出型加 熱器37預熱至約150°C，其次以加熱區34之熱風吹出型 加熱器38加熱至約250t以熔融焊錫。然後，附著熔融焊 錫之印刷基板被漸冷區35所設置之熱風吹出型加熱器39 加以逐漸冷卻，熔融焊錫完即完全凝固。此時之冷卻速度 爲 〇.5°C/秒。 以上述焊接方法加以焊接之印刷基板上的陶瓷表面安 裝元件’完全沒有因熱衝擊所造成之裂縫或剝離等的破損 —_ _ 14 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1237535 五、發明説明（〆） 情形。 [發明效果] 若根據以上說明之本發明，以浸漬法進行之印刷基板 之焊接，由於在焊接部不會產生縮孔，因此不會使電子元 件與印刷基板之黏著強度變弱，此外，以回流法進行之印 刷基板之焊接，由於不至對印刷基板所搭載之陶瓷積層電 子元件造成熱損傷，因此該電子元件不會產生裂縫或剝離 等之意外，而能獲得可靠性優異之焊接部。 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）1237535 A7 B7 5. Description of the invention (1) At this time, the porous metal plate 19 in contact with the electric heater is heated, and the ceramic 18 coated on the surface is also heated. Since the ceramic emits far-infrared rays after being heated, the far-infrared rays uniformly heat the entire object to be heated. At this time, the cross-flow fan 21 is rotated by a motor (not shown), that is, the air is sucked from the suction port 16 and sent to the main body 14. The air sent into the main body 14 is heated by the electric heater 20 and is also heated and blown out by warm air when passing through the porous metal plate 19. The temperature of the warm air at this time does not gradually increase the temperature of the printed circuit board, and its cooling rate is 1C / sec or less. When the hot air blow-out heater passes through the printed board, the warm air blown to the printed board is rebounded by the printed board and flows toward the suction port 16. Then, the warm air flows into the body 14 from the suction port 16 in a warm state, so that heat radiation is small and energy can be saved. The propeller fan 7 of the cooling device is arranged near the inching device 6 and above the conveying device 2. The propeller fan is used to cool the operator without scalding when the printed circuit board is taken out after being cooled by the gradually cooling device and the solder is completely solidified. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 2 shows the installation of an infrared heater 21 as a gradually cooling device. The embodiment shown in Fig. 2 is the same as the embodiment shown in Fig. 1 except for the gradual cooling device. Therefore, the same components are assigned the same reference numerals and descriptions thereof are omitted. The infrared heater 22 is provided with an electric heater 23 inside, and when it conducts electricity, it generates heat and emits infrared rays upward. The temperature of the gradual cooling device of the infrared heater is a temperature that gradually cools the molten solder attached to the printed circuit board in the solder bath. Here, the gradual cooling speed is 1 ° C / sec or less. '12 _ ^^ scale is applicable to China National Standard (CNS) A4 specification (210X297 mm 1 " 1237535 A7 B7 V. Description of the invention (β) Figure 3 shows a hollow body 24 as a gradually cooling device. Figure 3 The embodiment shown is the same as the embodiment in FIG. 丨 except for the gradually cooling device, so the same structure is given the same symbol and its description is omitted. The hollow body 24 can cover the preheater 4, the solder bath 5, And the transfer device 2 from the solder tank to the front is better. The cavity system uses the heat generated from the preheater 4 and the solder tank 5 to cover the preheater and the solder tank, so as not to make the emitted heat The radiation to the outside can heat the printed circuit board after soldering to gradually cool it. Next, the method of soldering the printed circuit board of the automatic soldering device of Example 1 will be described. The solder in the solder bath uses SN-3Ag-0.5Cii Lead-free solder (melting point: 217 ° C). The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed a printed substrate P and inserted the lead of the lead member into the penetration hole. The printed substrate was transported at a speed of 1.3m / min. Travelling loading 2 Carry it, apply flux to the resin machine 3, preheat it to 130 ° C with preheater 4, and use the primary nozzle 11 and the secondary of the solder bath 5 with the melting temperature of 240 ° C. The nozzle 12 attaches the molten solder to it. The printed substrate on which the molten solder is attached is then passed through the hot-air blow-out heater 13 of the incubator 6. At this time, the printed board is emitted by the far-infrared rays of the hot-air blow-out heater 13. And the warm air blown out gradually cools. The cooling rate at this time is 0.7 t / s. Then, the molten solder attached to the printed substrate is completely solidified near the end of the hot-air blow-out heater 13, and then cooled by the cooling device. The propeller fan 7 is rapidly cooled at a cooling rate of 5t / s, and is cooled to the extent that it will not be scalded even if touched. The printed circuit board welded by the above welding method will not be in the welding part. _____13___ This paper is applicable to China Standard (CNS) A4 specification (210X297 mm) 1237535 A7 B7 V. Description of the invention (u) Shrinkage occurs, even if the electronic component is pulled, the lead does not easily come off the penetrating hole. Next, the reflow furnace of the present invention will be described. The reflow furnace 30 has a tunnel 31 inside and a conveying device 32 travels therein. In the tunnel, the preheating zone 33 and heating are sequentially performed along the traveling direction of the conveying device 32 (arrow B). Zone 34, gradually cooling zone 35, and cooling zone 36. Hot air blow-out heaters 37 are provided above and below the preheating zone 33, and hot air blow-out heaters 38 are also provided above and below the heating zone 34. Furthermore, Yu gradually The hot zone blow-out heater 39 is also provided above and below the cold zone 35. Since the structure and function of the hot air blow-out heater have been described in the embodiment of FIG. 1, it is omitted here. A propeller fan 40 of a cooling device is provided above and below the cooling zone 36. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Next, a method for soldering a printed circuit board using the above-mentioned reflow furnace will be described. A solder paste of SN-3Ag—0.5Cii lead-free solder (melting point: 217 ° C) is coated on the printed substrate, and a ceramic laminated surface-mounted component is mounted on the coating portion. The printed substrate P is conveyed into the tunnel 31 of the reflow furnace 30 by a conveying device 32 with a conveying speed of 1.5 m / min. First, it is preheated to about 150 ° C by a hot air blowing heater 37 in a preheating zone 33, and secondly in a heating zone The hot air blow-out heater 38 of 34 is heated to about 250t to melt the solder. Then, the printed circuit board to which the molten solder is adhered is gradually cooled by the hot-air blow-out heater 39 provided in the gradual cooling zone 35, and the molten solder is completely solidified. The cooling rate at this time was 0.5 ° C / sec. The ceramic surface-mounted components on the printed circuit board soldered by the above-mentioned soldering method are completely free of cracks, peeling, and other damage caused by thermal shock—_ _ 14 This paper size applies to China National Standard (CNS) A4 (210X297 mm ) 1237535 V. Description of Invention (i) Situation. [Effects of the Invention] According to the invention described above, the soldering of the printed circuit board by the immersion method does not cause shrinkage holes in the soldering portion, so that the adhesion strength between the electronic component and the printed circuit board is not weakened. The soldering of the printed circuit board by the reflow method does not cause thermal damage to the ceramic laminated electronic component mounted on the printed substrate, so the electronic component does not cause accidents such as cracks or peeling, and can obtain a solder joint with excellent reliability. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) A4 (210X297 mm)