CN100578016C - 药液供给装置 - Google Patents
药液供给装置 Download PDFInfo
- Publication number
- CN100578016C CN100578016C CN200710147595A CN200710147595A CN100578016C CN 100578016 C CN100578016 C CN 100578016C CN 200710147595 A CN200710147595 A CN 200710147595A CN 200710147595 A CN200710147595 A CN 200710147595A CN 100578016 C CN100578016 C CN 100578016C
- Authority
- CN
- China
- Prior art keywords
- chamber
- piston
- pump
- cylinder
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 29
- 239000003814 drug Substances 0.000 title claims description 7
- 238000007789 sealing Methods 0.000 claims description 55
- 230000005489 elastic deformation Effects 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 9
- 238000002955 isolation Methods 0.000 claims 3
- 239000012528 membrane Substances 0.000 claims 3
- 239000008155 medical solution Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 59
- 239000003566 sealing material Substances 0.000 abstract description 54
- 230000006866 deterioration Effects 0.000 abstract description 18
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 235000014347 soups Nutrition 0.000 description 31
- 230000004888 barrier function Effects 0.000 description 19
- 238000000034 method Methods 0.000 description 14
- 239000011148 porous material Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 239000007921 spray Substances 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 6
- 230000008602 contraction Effects 0.000 description 5
- 230000001360 synchronised effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000010339 dilation Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/08—Machines, pumps, or pumping installations having flexible working members having tubular flexible members
- F04B43/10—Pumps having fluid drive
- F04B43/107—Pumps having fluid drive the fluid being actuated directly by a piston
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Reciprocating Pumps (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006322235 | 2006-11-29 | ||
| JP2006322235A JP4547369B2 (ja) | 2006-11-29 | 2006-11-29 | 薬液供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101191482A CN101191482A (zh) | 2008-06-04 |
| CN100578016C true CN100578016C (zh) | 2010-01-06 |
Family
ID=39486661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710147595A Expired - Fee Related CN100578016C (zh) | 2006-11-29 | 2007-08-28 | 药液供给装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7841842B2 (enExample) |
| JP (1) | JP4547369B2 (enExample) |
| KR (1) | KR100904832B1 (enExample) |
| CN (1) | CN100578016C (enExample) |
| TW (1) | TW200823367A (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4585563B2 (ja) * | 2007-12-03 | 2010-11-24 | 株式会社コガネイ | 薬液供給装置およびポンプ組立体 |
| US8264347B2 (en) * | 2008-06-24 | 2012-09-11 | Trelleborg Sealing Solutions Us, Inc. | Seal system in situ lifetime measurement |
| US20090317028A1 (en) * | 2008-06-24 | 2009-12-24 | Larry Castleman | Seal assembly in situ lifetime measurement |
| KR100998602B1 (ko) * | 2008-08-29 | 2010-12-07 | 씨앤지하이테크 주식회사 | 약액 이송장치 |
| US9850889B2 (en) * | 2010-02-02 | 2017-12-26 | Dajustco Ip Holdings Inc. | Hydraulic fluid control system for a diaphragm pump |
| JP5114527B2 (ja) * | 2010-04-20 | 2013-01-09 | 株式会社コガネイ | 液体供給装置 |
| JP5438611B2 (ja) * | 2010-07-09 | 2014-03-12 | 株式会社コガネイ | 薬液供給装置 |
| JP5535155B2 (ja) * | 2011-09-05 | 2014-07-02 | 株式会社コガネイ | 流路切換弁およびそれを用いた流動性材料の吐出制御装置 |
| JP6438784B2 (ja) * | 2015-02-03 | 2018-12-19 | 東京応化工業株式会社 | ポンプおよび塗布装置 |
| TWI626372B (zh) | 2015-04-13 | 2018-06-11 | 徐郁輝 | 一種具摺層構造之可浮性儲水袋 |
| KR101732113B1 (ko) * | 2015-08-17 | 2017-05-04 | 이동민 | 진공 공정용 아이솔레이션 밸브 |
| KR200483917Y1 (ko) * | 2015-09-09 | 2017-07-11 | 주식회사 디엠에스 | 약액토출장치 |
| JP6709795B2 (ja) * | 2016-07-05 | 2020-06-17 | 株式会社コガネイ | チューブポンプ |
| KR101879177B1 (ko) * | 2017-07-31 | 2018-07-17 | (주)포톤 | 약액 공급 장치 |
| IL280504B2 (en) * | 2018-08-10 | 2025-07-01 | Fujikin Kk | Fluid control device, abnormality detection method of fluid control device, abnormality detection device, and abnormality detection system |
| KR102502198B1 (ko) | 2018-08-10 | 2023-02-21 | 가부시키가이샤 후지킨 | 동작 해석 시스템 |
| KR102781539B1 (ko) * | 2020-02-19 | 2025-03-17 | 주식회사 나래나노텍 | 약액 가압 장치, 및 이를 구비한 약액 공급 장치 |
| CN111765061B (zh) * | 2020-07-07 | 2022-03-29 | 鹏城实验室 | 压差驱动式吸排机构 |
| CN113303305B (zh) * | 2021-05-14 | 2022-02-11 | 北京百瑞盛田环保科技发展有限公司 | 一种施药监控方法、装置及系统 |
| US12297825B2 (en) | 2022-04-14 | 2025-05-13 | Viking Pump, Inc. | Expandable, inner liner pump |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2613607A (en) * | 1949-10-27 | 1952-10-14 | Milton Roy Co | Bellows pump |
| US2853015A (en) * | 1955-01-11 | 1958-09-23 | Pleuger Friedrich Wilhelm | Diaphragm pump |
| US3318251A (en) * | 1965-06-21 | 1967-05-09 | Manton Gaulin Mfg Company Inc | Method and apparatus for pumping fluid bodies |
| JPS4840169Y1 (enExample) * | 1970-02-26 | 1973-11-26 | ||
| DE7303301U (de) * | 1973-01-30 | 1974-04-04 | Feluwa Schlesiger & Co Kg | Membran-Kolbenpumpe |
| US4178133A (en) * | 1977-04-14 | 1979-12-11 | Binks Manufacturing Company | Double-acting flexible tube pump |
| US4474540A (en) * | 1982-09-10 | 1984-10-02 | Pennwalt Corporation | Tubular diaphragm pump |
| JPS63130973A (ja) * | 1986-11-21 | 1988-06-03 | Takeshi Hoya | 弁装置構造 |
| US5167837A (en) * | 1989-03-28 | 1992-12-01 | Fas-Technologies, Inc. | Filtering and dispensing system with independently activated pumps in series |
| JPH03149371A (ja) * | 1989-11-02 | 1991-06-25 | Nippon Fuiidaa Kogyo Kk | ダイヤフラムポンプ |
| US5165869A (en) * | 1991-01-16 | 1992-11-24 | Warren Rupp, Inc. | Diaphragm pump |
| JP3554115B2 (ja) * | 1996-08-26 | 2004-08-18 | 株式会社コガネイ | 薬液供給装置 |
| JPH1122648A (ja) * | 1997-07-04 | 1999-01-26 | Nissan Motor Co Ltd | 燃料ポンプ |
| JP3461725B2 (ja) * | 1998-06-26 | 2003-10-27 | 東京エレクトロン株式会社 | 処理液供給装置及び処理液供給方法 |
| JP2002089503A (ja) | 2000-09-18 | 2002-03-27 | Koganei Corp | アクチュエータ |
| JP2002242842A (ja) * | 2001-02-19 | 2002-08-28 | Nikkiso Co Ltd | ダイアフラムポンプ |
| JP4197107B2 (ja) | 2002-07-18 | 2008-12-17 | 大日本印刷株式会社 | 塗工装置 |
| JP4790311B2 (ja) * | 2005-02-28 | 2011-10-12 | 株式会社鷺宮製作所 | 定量送液ポンプ |
| JP4603925B2 (ja) * | 2005-04-13 | 2010-12-22 | 株式会社コガネイ | 薬液供給装置 |
| JP5060766B2 (ja) | 2006-06-19 | 2012-10-31 | 株式会社コガネイ | 薬液供給装置 |
| JP4916793B2 (ja) * | 2006-06-30 | 2012-04-18 | 株式会社鷺宮製作所 | 定量送液ポンプおよびそれを用いた薬液塗布装置 |
-
2006
- 2006-11-29 JP JP2006322235A patent/JP4547369B2/ja not_active Expired - Fee Related
-
2007
- 2007-08-14 TW TW096129958A patent/TW200823367A/zh not_active IP Right Cessation
- 2007-08-28 CN CN200710147595A patent/CN100578016C/zh not_active Expired - Fee Related
- 2007-08-28 KR KR1020070086566A patent/KR100904832B1/ko not_active Expired - Fee Related
- 2007-09-18 US US11/856,820 patent/US7841842B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101191482A (zh) | 2008-06-04 |
| US7841842B2 (en) | 2010-11-30 |
| JP4547369B2 (ja) | 2010-09-22 |
| TW200823367A (en) | 2008-06-01 |
| KR20080048913A (ko) | 2008-06-03 |
| TWI379946B (enExample) | 2012-12-21 |
| KR100904832B1 (ko) | 2009-06-25 |
| JP2008133800A (ja) | 2008-06-12 |
| US20080138214A1 (en) | 2008-06-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100106 Termination date: 20150828 |
|
| EXPY | Termination of patent right or utility model |