KR100998602B1 - 약액 이송장치 - Google Patents
약액 이송장치 Download PDFInfo
- Publication number
- KR100998602B1 KR100998602B1 KR1020080084893A KR20080084893A KR100998602B1 KR 100998602 B1 KR100998602 B1 KR 100998602B1 KR 1020080084893 A KR1020080084893 A KR 1020080084893A KR 20080084893 A KR20080084893 A KR 20080084893A KR 100998602 B1 KR100998602 B1 KR 100998602B1
- Authority
- KR
- South Korea
- Prior art keywords
- chemical liquid
- pumps
- discharge
- pump
- present
- Prior art date
Links
- 239000000126 substance Substances 0.000 title claims abstract description 87
- 239000007788 liquid Substances 0.000 title claims abstract description 79
- 238000012546 transfer Methods 0.000 claims description 21
- 230000005484 gravity Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000010349 pulsation Effects 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/0009—Special features
- F04B43/0054—Special features particularities of the flexible members
- F04B43/0063—Special features particularities of the flexible members bell-shaped flexible members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/0009—Special features
- F04B43/0045—Special features with a number of independent working chambers which are actuated successively by one mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
- Y10T137/86131—Plural
- Y10T137/86139—Serial
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Reciprocating Pumps (AREA)
- Details Of Reciprocating Pumps (AREA)
Abstract
Description
Claims (5)
- 삭제
- 삭제
- 서로 다른 흡입 행정 시점과 배출 행정 시점을 갖는 3개 이상의 벨로우즈 펌프들을 일렬로 배치한 약액 이송장치에 있어서,상기 벨로우즈 펌프들의 흡입구들을 통합 연결하는 흡입관과 상기 벨로우즈 펌프들의 배출구들을 통합 연결하는 배출관을 더 포함하고,상기 벨로우즈 펌프들은 벨로우즈 펌프 내부를 유동하는 모든 약액을 잔류시키지 않고 배출시킬 수 있도록 벨로우즈 펌프들의 흡입구 및 배출구들이 중력방향을 향하도록 설치되는 것을 특징으로 하는 약액 이송장치.
- 청구항 3에 있어서, 상기 펌프들의 흡입 행정 및 배출 행정의 순서는 상기 펌프들의 배열순서와 무관하게 이루어지는 것을 특징으로 하는 약액 이송장치.
- 청구항 4에 있어서, 상기 펌프들의 흡입 행정 및 배출 행정의 순서를 제어하는 제어수단을 더 포함하는 것을 특징으로 하는 약액 이송장치.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080084893A KR100998602B1 (ko) | 2008-08-29 | 2008-08-29 | 약액 이송장치 |
CN200880130658.7A CN102105968B (zh) | 2008-08-29 | 2008-09-10 | 化学液体供给设备 |
JP2011524877A JP5422653B2 (ja) | 2008-08-29 | 2008-09-10 | 薬液移送装置 |
US13/056,574 US8616865B2 (en) | 2008-08-29 | 2008-09-10 | Chemical liquid feeding device |
PCT/KR2008/005329 WO2010024488A1 (en) | 2008-08-29 | 2008-09-10 | Chemical liquid feeding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080084893A KR100998602B1 (ko) | 2008-08-29 | 2008-08-29 | 약액 이송장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100026064A KR20100026064A (ko) | 2010-03-10 |
KR100998602B1 true KR100998602B1 (ko) | 2010-12-07 |
Family
ID=41721638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080084893A KR100998602B1 (ko) | 2008-08-29 | 2008-08-29 | 약액 이송장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8616865B2 (ko) |
JP (1) | JP5422653B2 (ko) |
KR (1) | KR100998602B1 (ko) |
CN (1) | CN102105968B (ko) |
WO (1) | WO2010024488A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106151026A (zh) * | 2015-04-21 | 2016-11-23 | 王治清 | 一种揉动式增压泵 |
CN106139471A (zh) * | 2015-04-21 | 2016-11-23 | 王治清 | 消防车及其消防设备 |
US11598331B2 (en) * | 2021-02-24 | 2023-03-07 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electroactive polymer actuator for multi-stage pump |
WO2024176608A1 (ja) * | 2023-02-24 | 2024-08-29 | 株式会社日立ハイテク | 自動分析装置、及び、自給式ポンプの交換方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008002335A (ja) * | 2006-06-21 | 2008-01-10 | Kimoto Denshi Kogyo Kk | 送液ポンプ |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4302163A (en) * | 1979-10-30 | 1981-11-24 | Hope Henry F | Adjustable output pump for liquids |
JPS59105977A (ja) * | 1982-12-08 | 1984-06-19 | Hitachi Ltd | 直動型往復動ポンプ装置 |
JPS63106379A (ja) * | 1986-10-23 | 1988-05-11 | Sunstar Giken Kk | 流体圧送用ポンプシステム |
US4869397A (en) * | 1987-06-24 | 1989-09-26 | Liquipak International, Inc. | Adjustable fill motor assembly |
JPH0457324U (ko) * | 1990-09-27 | 1992-05-18 | ||
JP2001107872A (ja) * | 1999-10-13 | 2001-04-17 | Ebara Udylite Kk | 送液システムおよびこれにもちいるポンプユニット |
KR20020029976A (ko) * | 2000-10-16 | 2002-04-22 | 박종섭 | 반도체 제조용 약액 공급펌프 |
JP3853641B2 (ja) * | 2001-11-15 | 2006-12-06 | 株式会社コガネイ | 薬液供給装置およびその製造方法 |
KR20030048515A (ko) * | 2001-12-12 | 2003-06-25 | 가부시키가이샤 고가네이 | 약액공급장치 |
EP1602830A1 (en) * | 2004-06-02 | 2005-12-07 | Ailand Corporation S.A. | Hydraulically driven multicylinder pumping machine |
JP4547369B2 (ja) * | 2006-11-29 | 2010-09-22 | 株式会社コガネイ | 薬液供給装置 |
-
2008
- 2008-08-29 KR KR1020080084893A patent/KR100998602B1/ko active IP Right Grant
- 2008-09-10 CN CN200880130658.7A patent/CN102105968B/zh active Active
- 2008-09-10 WO PCT/KR2008/005329 patent/WO2010024488A1/en active Application Filing
- 2008-09-10 JP JP2011524877A patent/JP5422653B2/ja active Active
- 2008-09-10 US US13/056,574 patent/US8616865B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008002335A (ja) * | 2006-06-21 | 2008-01-10 | Kimoto Denshi Kogyo Kk | 送液ポンプ |
Also Published As
Publication number | Publication date |
---|---|
WO2010024488A1 (en) | 2010-03-04 |
CN102105968B (zh) | 2014-04-30 |
JP2012501399A (ja) | 2012-01-19 |
JP5422653B2 (ja) | 2014-02-19 |
CN102105968A (zh) | 2011-06-22 |
US20110174400A1 (en) | 2011-07-21 |
KR20100026064A (ko) | 2010-03-10 |
US8616865B2 (en) | 2013-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100998602B1 (ko) | 약액 이송장치 | |
KR101132118B1 (ko) | 약액 공급 시스템 | |
CN111540694B (zh) | 基板处理装置和基板处理方法 | |
EP2685107B1 (en) | Quick-release vacuum pump | |
TWI513903B (zh) | 螺旋真空泵 | |
JP2008201588A (ja) | 流体または粉体搬送装置 | |
US11333142B2 (en) | Tube body and pumping device | |
BR112019017107A2 (pt) | bomba de pó em fase densa. | |
CN201044235Y (zh) | 基板处理装置 | |
KR102145951B1 (ko) | 기판 처리 장치 | |
KR101293653B1 (ko) | 다단식 썩션노즐을 구비한 감압장치 | |
KR101066634B1 (ko) | 가스 흐름을 이용한 감압모듈 및 반도체 제조용 진공장치 | |
US20130291966A1 (en) | Quick-release vacuum pump | |
CN110875212B (zh) | 基板处理装置 | |
CN210159889U (zh) | 减压装置和具有其的点胶控制器 | |
CN110102443B (zh) | 减压装置和具有其的点胶控制器 | |
KR102254187B1 (ko) | 기판 건조 장치 | |
JP2008014278A (ja) | 増圧可能なエア駆動による往復動ポンプ | |
WO2023042538A1 (ja) | 正負圧力切替回路 | |
CN115083954A (zh) | 衬底处理装置及供给阀 | |
CN220121808U (zh) | 一种晶圆真空过滤系统 | |
CN211838811U (zh) | 点胶装置 | |
JP6396274B2 (ja) | 液体供給装置および液体供給方法 | |
CN118287280A (zh) | 一种粉料输送系统 | |
JP2006035155A (ja) | 液体吐出圧力制御装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20131226 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20141103 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20151103 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20161102 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20171103 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20191125 Year of fee payment: 10 |