CN100552876C - 衬底处理装置 - Google Patents

衬底处理装置 Download PDF

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CN100552876C
CN100552876C CNB200710097046XA CN200710097046A CN100552876C CN 100552876 C CN100552876 C CN 100552876C CN B200710097046X A CNB200710097046X A CN B200710097046XA CN 200710097046 A CN200710097046 A CN 200710097046A CN 100552876 C CN100552876 C CN 100552876C
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pin
supporting plate
lifter pin
substrate
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CN101055836A (zh
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全宗镇
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Advanced Display Process Engineering Co Ltd
ADP Engineering Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

本发明涉及一种衬底处理装置,更具体地涉及一种可以安装升降销并且使用例如扳手之类的工具很容易调整升降销的高度的衬底处理装置。本发明的衬底处理装置包括:室;销托板,设置在该室的内部或外部;驱动装置,用于提升或降低该销托板;以及至少一个升降销,以穿透该销托板的方式连接到该销托板,并且所述升降销具有在所述升降销的下端形成的工具插槽。

Description

衬底处理装置
技术领域
本发明涉及一种衬底处理装置,更具体地涉及一种可以安装升降销(1iftpin)并且使用例如扳手之类的工具很容易调整升降销的高度的衬底处理装置。
背景技术
通常地,半导体器件和LCD面板的制造需要衬底的等离子体处理。在衬底的这种等离子体处理中,衬底被装入并且被固定在真空室中,并且将处理气体和高频电源施加到真空室以产生等离子体,从而进行预定的等离子体处理。
参照图1描述传统的衬底处理装置。真空室10包括上电极12和电极部分20,其中将处理气体施加到上电极12,并且将高频电源施加到电极部分20。
通过运载机器人把衬底S从外部装入真空室10,并且所装入的衬底S被放下且被固定到电极部分20。
这时,设置衬底升降单元,从而安全并且准确地执行从运载机器人接收衬底S并将衬底S放到电极部分20上的处理。衬底升降单元包括:多个升降销31,用于支撑衬底S;销托板32,具有形成有连接凹槽32a的上表面,在该连接凹槽32a中升降销31被稳固;以及驱动装置30,用于提升或降低销托板32。
衬底升降单元还包括:活塞杆33,用于将来自驱动装置30的驱动力传送到销托板32;以及波纹管40,用于密封地包绕在真空室10与销托板32之间的升降销31。
同时,在通过降低升降销31使衬底S位于电极部分20上时,存在衬底S在电极部分20上滑动的现象。为了防止这种现象发生,这样设置多个升降销31,即所述升降销的高度从中心升降销到最外面的升降销逐渐增加。也就是说,在升降销中心部分下陷的状态下降低衬底S。
为此,将升降销31构建为使其高度能被调整。所述升降销31被设置在所调整的高度。
更具体地,如图1的放大部分所示,具有预定厚度的一个或多个垫圈34被插入到在销托板32中形成的每个连接凹槽32a中,然后使升降销31连接到垫圈上。根据预先插入的垫圈34的厚度或数目可以调整升降销31的高度。
然而,在这种情况下,由于放置在升降销31下面的垫圈34的缘故,升降销31本身连接不稳定。因此,就有这样的问题,即由于外部冲击或真空压力导致升降销31任意移动,从而升降销31的高度不会恒定地保持。
此外,由于垫圈34具有标准化的厚度,为了确保准确的高度将制造并且插入额外的垫圈。因而,存在工作复杂并且变得繁琐的问题。即使使用这种分别制造的额外的垫圈可以调整升降销的高度,也存在很难精确地调整高度的问题。
发明内容
为解决现有技术中存在的前述问题作出本发明。本发明的目的是提供一种可以安装升降销并且使用例如扳手之类的工具很容易调整升降销的高度的衬底处理装置。
为实现该目的,本发明提供一种衬底处理装置,该装置包括:室;销托板,设置在该室的内部或外部;驱动装置,用于提升或降低该销托板;以及至少一个升降销,以穿透该销托板的方式连接到该销托板,并且所述升降销具有在所述升降销的下端形成的工具插槽。
使用这种构造,利用例如扳手之类的工具操作升降销的下端,从而可以使升降销的高度调整到期望的高度,其中该升降销的下端在穿透销托板底面的同时伸出销托板的底面。
此外,第一螺母可以被紧固到销托板下方的升降销的下端,从而固定其高度已被调整到期望高度的升降销。此外,第二螺母可以进一步接着紧固在第一螺母的下方,从而防止第一螺母任意移动。
此外,该装置还包括防护帽,该防护帽用于使升降销的位于销托板下方的连接部分保持密封状态。
附图说明
从结合附图给出的优选实施例的以下描述中,本发明的上述和其它目的、特征和优点将变得显而易见,其中:
图1示出传统衬底处理装置的剖视图;
图2示出根据本发明的实施例的衬底处理装置的剖视图;
图3示出图2所示的衬底处理装置的主要部分的放大剖视图;以及
图4示出根据本发明另一实施例的衬底处理装置的剖视图。
图中主要部分的附图标记说明
100:真空室    110:电极部分
120:升降销    121:工具插槽
122:销托板    128:螺母
128a:辅助螺母 134:活塞杆
136:驱动装置  140:防护帽
具体实施方式
下文参照附图将详细描述本发明实施例的构成和操作。
参照图2,根据本发明实施例的衬底处理装置包括室100、上电极、电极部分110以及衬底升降单元。衬底升降单元包括:多个升降销120,用于支撑衬底S以提升或降低衬底;销托板122,在其上安装有升降销120;驱动装置136,用于产生驱动力;以及活塞杆134,用于传送驱动力。此外,可以看出销托板122设置在室100的外下方。
参照图3,具体地,在该实施例中可以看出安装升降销120并使其穿透销托板122。此外,每个升降销120的外圆周和销托板122中每个孔的内圆周形成有螺纹120a。
此外,在升降销120的下端形成有工具插槽121,其中例如扳手之类的工具(未示出)要被插入并且啮合到该工具插槽121。因而,通过将例如扳手之类的工具插入到工具插槽121中并且旋转该升降销120可以很容易地调整升降销的高度。
此外,应该防止由于外部冲击、真空压力等导致的其高度已被调整的升降销120任意移动。因而,需要固定其高度已被调整的升降销120。在该实施例中,螺母128被紧固到伸出销托板122底面的升降销120的下端。也就是说,通过使螺母128与销托板122紧密接触防止了升降销120的移动。此外,为防止螺母128任意移动,与螺母128具有相同构造的辅助螺母128a也接着被紧固。
在该实施例中由于销托板122被安装在真空室100的外部,为了保持真空室100的真空度,需要使升降销120的连接部分保持密封状态。为此,可以理解在销托板122的下方还设置有防护帽140。
图4示出根据本发明另一实施例的衬底处理装置。从图中可以看出销托板122a和122b安装在真空室100的内部。
此外,在多个升降销中,独立地提升或降低中心销120b和边缘销120a,其中中心销120b用于提升或者降低衬底S的中心部分,而边缘销122a用于提升或者降低衬底的边缘。为此,分别形成连接到中心销120b的中心销托板122b和连接到边缘销120a的边缘销托板122a。
此外,也分别形成活塞杆134b和驱动装置136b以及活塞杆134a和驱动装置136a,其中活塞杆134b和驱动装置136b用于驱动中心销托板122b,而活塞杆134a和驱动装置136a用于驱动边缘销托板122a。
使用这种构造,可以独立地提升或降低衬底S的中心部分和边缘部分。
例如,可以这样构造中心销托板122b和边缘销托板122a,即以一定的时间间隔提升或降低它们。也就是说,首先提升或降低边缘销托板122a,然后提升或降低中心销托板122b。这时优选为中心销托板122b的提升或降低速度大于边缘销托板122a的提升或降低速度。当边缘销托板122a比中心销托板122b早开始提升或降低时,在衬底S到达顶部位置时能够实现衬底的水平状态。
另外,也可以在要提升销托板时先提升边缘销托板122a,而在要降低销托板时先降低中心销托板122b。
根据本发明可以安装衬底处理装置的升降销,并且使用例如扳手之类的工具很容易调整升降销的高度。

Claims (4)

1.一种衬底处理装置,包括:
室;
电极部分和衬底,该电极部分安装在该室中并且该衬底装在该电极部分上;
至少一个升降销,以穿透该电极部分的方式安装,并且所述升降销的上端支撑装在该电极部分上的该衬底;
销托板,设置在该室的内部或外部,并且具有形成在该销托板的孔的内圆周上的螺纹,所述升降销的螺纹连接至该销托板的螺纹,其中所述升降销的螺纹形成在所述升降销的外圆周上并且穿透该销托板,以及通过旋转所述升降销上下移动所述升降销;
驱动装置,用于提升或降低该销托板;以及该升降销的下端伸出该销托板的下方,并且在该升降销的下端形成有用于旋转该升降销的工具插槽。
2.如权利要求1所述的装置,其中通过将第一螺母紧固到位于该销托板下方的所述升降销的下端来固定按设定高度安装的所述升降销。
3.如权利要求2所述的装置,其中在该第一螺母的下方还接着紧固第二螺母,以防止该第一螺母任意移动。
4.如权利要求1所述的装置,还包括防护帽,该防护帽用于使所述升降销的位于该销托板下方的连接部分保持密封状态。
CNB200710097046XA 2006-04-13 2007-04-12 衬底处理装置 Expired - Fee Related CN100552876C (zh)

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US9011602B2 (en) * 2009-01-29 2015-04-21 Lam Research Corporation Pin lifting system
KR101362458B1 (ko) * 2010-12-30 2014-02-12 엘아이지에이디피 주식회사 리프트 핀 모듈 및 이것을 포함하는 평판표시소자 제조장치
CN104576491A (zh) * 2013-10-16 2015-04-29 北京北方微电子基地设备工艺研究中心有限责任公司 一种顶针升降装置和反应腔室
CN108866493B (zh) * 2018-06-29 2020-05-12 宁波江丰电子材料股份有限公司 一种半导体靶材的安装工具及半导体芯片生产系统

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US20070240646A1 (en) 2007-10-18
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TW200739724A (en) 2007-10-16
TWI398922B (zh) 2013-06-11
KR100994470B1 (ko) 2010-11-16

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