CN100546435C - 金属层的树脂层的形成方法、印刷线路板及其制造方法 - Google Patents

金属层的树脂层的形成方法、印刷线路板及其制造方法 Download PDF

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Publication number
CN100546435C
CN100546435C CNB2006101154799A CN200610115479A CN100546435C CN 100546435 C CN100546435 C CN 100546435C CN B2006101154799 A CNB2006101154799 A CN B2006101154799A CN 200610115479 A CN200610115479 A CN 200610115479A CN 100546435 C CN100546435 C CN 100546435C
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CN
China
Prior art keywords
layer
resin
conductor circuit
polyamide
imide
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2006101154799A
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English (en)
Chinese (zh)
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CN1933702A (zh
Inventor
高井健次
森池教夫
上山健一
增田克之
长谷川清
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication of CN1933702A publication Critical patent/CN1933702A/zh
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Publication of CN100546435C publication Critical patent/CN100546435C/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CNB2006101154799A 2003-11-14 2004-11-11 金属层的树脂层的形成方法、印刷线路板及其制造方法 Expired - Fee Related CN100546435C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2003385852 2003-11-14
JP2003385853 2003-11-14
JP2003385852 2003-11-14
JP2004018139 2004-01-27
JP2004024422 2004-01-30
JP2004024400 2004-01-30

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100910018A Division CN1311719C (zh) 2003-11-14 2004-11-11 印刷线路板及其制造方法

Publications (2)

Publication Number Publication Date
CN1933702A CN1933702A (zh) 2007-03-21
CN100546435C true CN100546435C (zh) 2009-09-30

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CNB2006101154799A Expired - Fee Related CN100546435C (zh) 2003-11-14 2004-11-11 金属层的树脂层的形成方法、印刷线路板及其制造方法

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JP (1) JP2009188429A (https=)
CN (1) CN100546435C (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111819077A (zh) * 2018-03-09 2020-10-23 株式会社有泽制作所 层叠体及其制造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6009300B2 (ja) 2012-09-27 2016-10-19 新光電気工業株式会社 配線基板及びその製造方法
EP4079520B1 (en) * 2019-12-16 2025-04-16 Dow-Mitsui Polychemicals Co., Ltd. Resin composition for solar cell sealing material, solar cell sealing material, method for producing solar cell sealing material, and solar cell module

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3719833B2 (ja) * 1997-10-23 2005-11-24 日立化成工業株式会社 変性シアネートエステル系樹脂フィルム及びその製造方法
JP3432409B2 (ja) * 1997-11-28 2003-08-04 日立化成工業株式会社 耐熱性樹脂組成物及びそれを用いた接着フィルム
JP4137279B2 (ja) * 1999-04-23 2008-08-20 イビデン株式会社 プリント配線板及びその製造方法
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
JP2003152317A (ja) * 2000-12-25 2003-05-23 Ngk Spark Plug Co Ltd 配線基板
JP2002314243A (ja) * 2001-04-11 2002-10-25 Nippon Paint Co Ltd 多層プリント配線板用プライマー組成物
JP4370074B2 (ja) * 2002-02-04 2009-11-25 日本電解株式会社 プリント配線板用銅箔とその製造方法
KR20070073999A (ko) * 2002-03-05 2007-07-10 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 금속 피복 적층판, 그를 이용한 프린트배선판 및 그의 제조 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111819077A (zh) * 2018-03-09 2020-10-23 株式会社有泽制作所 层叠体及其制造方法
CN111819077B (zh) * 2018-03-09 2023-07-07 株式会社有泽制作所 层叠体及其制造方法

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Publication number Publication date
CN1933702A (zh) 2007-03-21
JP2009188429A (ja) 2009-08-20

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