JP2009188429A - プリント配線板及びその製造方法 - Google Patents

プリント配線板及びその製造方法 Download PDF

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Publication number
JP2009188429A
JP2009188429A JP2009125160A JP2009125160A JP2009188429A JP 2009188429 A JP2009188429 A JP 2009188429A JP 2009125160 A JP2009125160 A JP 2009125160A JP 2009125160 A JP2009125160 A JP 2009125160A JP 2009188429 A JP2009188429 A JP 2009188429A
Authority
JP
Japan
Prior art keywords
layer
printed wiring
wiring board
resin
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009125160A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009188429A5 (https=
Inventor
Kenji Takai
健次 高井
Katsuyuki Masuda
克之 増田
Kiyoshi Hasegawa
清 長谷川
Michio Moriike
教夫 森池
Kenichi Kamiyama
健一 上山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009125160A priority Critical patent/JP2009188429A/ja
Publication of JP2009188429A publication Critical patent/JP2009188429A/ja
Publication of JP2009188429A5 publication Critical patent/JP2009188429A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2009125160A 2003-11-14 2009-05-25 プリント配線板及びその製造方法 Pending JP2009188429A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009125160A JP2009188429A (ja) 2003-11-14 2009-05-25 プリント配線板及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003385852 2003-11-14
JP2009125160A JP2009188429A (ja) 2003-11-14 2009-05-25 プリント配線板及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004024400A Division JP2005167172A (ja) 2003-11-14 2004-01-30 プリント配線板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2009188429A true JP2009188429A (ja) 2009-08-20
JP2009188429A5 JP2009188429A5 (https=) 2009-10-01

Family

ID=37879258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009125160A Pending JP2009188429A (ja) 2003-11-14 2009-05-25 プリント配線板及びその製造方法

Country Status (2)

Country Link
JP (1) JP2009188429A (https=)
CN (1) CN100546435C (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9232644B2 (en) 2012-09-27 2016-01-05 Shinko Electric Industries Co., Ltd. Wiring substrate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11317507B2 (en) * 2018-03-09 2022-04-26 Arisawa Mfg. Co., Ltd. Laminate and method for manufacturing the same
EP4079520B1 (en) * 2019-12-16 2025-04-16 Dow-Mitsui Polychemicals Co., Ltd. Resin composition for solar cell sealing material, solar cell sealing material, method for producing solar cell sealing material, and solar cell module

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11124452A (ja) * 1997-10-23 1999-05-11 Hitachi Chem Co Ltd 変性シアネートエステル系樹脂フィルム及びその製造方法
JPH11217503A (ja) * 1997-11-28 1999-08-10 Hitachi Chem Co Ltd 耐熱性樹脂組成物及びそれを用いた接着フィルム
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
JP2000307245A (ja) * 1999-04-23 2000-11-02 Ibiden Co Ltd プリント配線板及びその製造方法、金属張積層板
JP2002314243A (ja) * 2001-04-11 2002-10-25 Nippon Paint Co Ltd 多層プリント配線板用プライマー組成物
JP2003152317A (ja) * 2000-12-25 2003-05-23 Ngk Spark Plug Co Ltd 配線基板
JP2003229648A (ja) * 2002-02-04 2003-08-15 Nippon Denkai Kk プリント配線板用銅箔とその製造方法
WO2003074268A1 (fr) * 2002-03-05 2003-09-12 Hitachi Chemical Co., Ltd. Feuille metallique presentant un stratifie a revetement metallique et resine, carte de circuit imprime utilisant cette feuille metallique, et procede de production associe

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11124452A (ja) * 1997-10-23 1999-05-11 Hitachi Chem Co Ltd 変性シアネートエステル系樹脂フィルム及びその製造方法
JPH11217503A (ja) * 1997-11-28 1999-08-10 Hitachi Chem Co Ltd 耐熱性樹脂組成物及びそれを用いた接着フィルム
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
JP2000307245A (ja) * 1999-04-23 2000-11-02 Ibiden Co Ltd プリント配線板及びその製造方法、金属張積層板
JP2003152317A (ja) * 2000-12-25 2003-05-23 Ngk Spark Plug Co Ltd 配線基板
JP2002314243A (ja) * 2001-04-11 2002-10-25 Nippon Paint Co Ltd 多層プリント配線板用プライマー組成物
JP2003229648A (ja) * 2002-02-04 2003-08-15 Nippon Denkai Kk プリント配線板用銅箔とその製造方法
WO2003074268A1 (fr) * 2002-03-05 2003-09-12 Hitachi Chemical Co., Ltd. Feuille metallique presentant un stratifie a revetement metallique et resine, carte de circuit imprime utilisant cette feuille metallique, et procede de production associe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9232644B2 (en) 2012-09-27 2016-01-05 Shinko Electric Industries Co., Ltd. Wiring substrate

Also Published As

Publication number Publication date
CN1933702A (zh) 2007-03-21
CN100546435C (zh) 2009-09-30

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