CN100533704C - 基片处理装置和基片容纳方法 - Google Patents

基片处理装置和基片容纳方法 Download PDF

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Publication number
CN100533704C
CN100533704C CNB2006100570585A CN200610057058A CN100533704C CN 100533704 C CN100533704 C CN 100533704C CN B2006100570585 A CNB2006100570585 A CN B2006100570585A CN 200610057058 A CN200610057058 A CN 200610057058A CN 100533704 C CN100533704 C CN 100533704C
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CN
China
Prior art keywords
substrate
wafer
semiconductor wafer
difference
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006100570585A
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English (en)
Chinese (zh)
Other versions
CN1838398A (zh
Inventor
桥本胜行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
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Olympus Corp
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Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of CN1838398A publication Critical patent/CN1838398A/zh
Application granted granted Critical
Publication of CN100533704C publication Critical patent/CN100533704C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CNB2006100570585A 2005-03-22 2006-03-17 基片处理装置和基片容纳方法 Expired - Fee Related CN100533704C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005081607 2005-03-22
JP2005081607A JP2006269497A (ja) 2005-03-22 2005-03-22 基板処理装置及び基板収納方法

Publications (2)

Publication Number Publication Date
CN1838398A CN1838398A (zh) 2006-09-27
CN100533704C true CN100533704C (zh) 2009-08-26

Family

ID=37015718

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100570585A Expired - Fee Related CN100533704C (zh) 2005-03-22 2006-03-17 基片处理装置和基片容纳方法

Country Status (4)

Country Link
US (1) US7747343B2 (https=)
JP (1) JP2006269497A (https=)
CN (1) CN100533704C (https=)
TW (1) TWI417977B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8600150B2 (en) * 2006-02-13 2013-12-03 Samsung Electronics Co., Ltd. Wafer aligning apparatus and related method
JP4914761B2 (ja) * 2007-05-16 2012-04-11 オリンパス株式会社 外観検査装置
JP5303254B2 (ja) * 2008-12-15 2013-10-02 東京エレクトロン株式会社 異物除去方法及び記憶媒体
KR102238649B1 (ko) * 2014-09-16 2021-04-09 삼성전자주식회사 반도체 칩 본딩 장치
JP6985815B2 (ja) * 2017-05-09 2021-12-22 キヤノン株式会社 搬送装置、システム、および物品の製造方法
CN114235684A (zh) * 2020-09-09 2022-03-25 旺矽科技股份有限公司 巨观及微观检测设备及检测方法
KR102624577B1 (ko) * 2020-10-28 2024-01-15 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
TW202238803A (zh) * 2021-02-26 2022-10-01 日商東京威力科創股份有限公司 搬運系統、搬運裝置及搬運方法
JP7609676B2 (ja) * 2021-03-29 2025-01-07 東京エレクトロン株式会社 基板処理装置及び基板搬送位置調整方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263518A (ja) 1994-03-18 1995-10-13 Fujitsu Ltd 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置
JPH09102257A (ja) 1995-07-28 1997-04-15 Matsushita Electric Works Ltd 封止接点装置
US5822213A (en) * 1996-03-29 1998-10-13 Lam Research Corporation Method and apparatus for determining the center and orientation of a wafer-like object
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
TW350115B (en) * 1996-12-02 1999-01-11 Toyota Automatic Loom Co Ltd Misregistration detection device and method thereof
WO2001084606A1 (en) * 2000-04-27 2001-11-08 Shin-Etsu Handotai Co., Ltd. Semiconductor wafer and device for semiconductor device manufacturing process
US6327517B1 (en) * 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
TW559855B (en) 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
US6678055B2 (en) * 2001-11-26 2004-01-13 Tevet Process Control Technologies Ltd. Method and apparatus for measuring stress in semiconductor wafers
US6900877B2 (en) * 2002-06-12 2005-05-31 Asm American, Inc. Semiconductor wafer position shift measurement and correction
US20050151947A1 (en) * 2002-07-31 2005-07-14 Nikon Corporation Position measuring method, position control method, exposure method and exposure apparatus, and device manufacturing method
KR100935291B1 (ko) * 2002-11-28 2010-01-06 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 도포 현상 장치
JP3880589B2 (ja) * 2004-03-31 2007-02-14 キヤノン株式会社 位置計測装置、露光装置及びデバイス製造方法

Also Published As

Publication number Publication date
US7747343B2 (en) 2010-06-29
TWI417977B (zh) 2013-12-01
CN1838398A (zh) 2006-09-27
JP2006269497A (ja) 2006-10-05
US20060215152A1 (en) 2006-09-28
TW200703537A (en) 2007-01-16

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Granted publication date: 20090826

Termination date: 20210317