CN100517076C - 曝光装置和曝光方法 - Google Patents
曝光装置和曝光方法 Download PDFInfo
- Publication number
- CN100517076C CN100517076C CNB2006100655013A CN200610065501A CN100517076C CN 100517076 C CN100517076 C CN 100517076C CN B2006100655013 A CNB2006100655013 A CN B2006100655013A CN 200610065501 A CN200610065501 A CN 200610065501A CN 100517076 C CN100517076 C CN 100517076C
- Authority
- CN
- China
- Prior art keywords
- exposure
- current mirror
- marking
- relative movement
- exposure unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims description 61
- 230000002093 peripheral effect Effects 0.000 claims description 25
- 239000003550 marker Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 description 28
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/708—Mark formation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005079425 | 2005-03-18 | ||
| JP2005079425A JP4664102B2 (ja) | 2005-03-18 | 2005-03-18 | 露光装置及び露光方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1834789A CN1834789A (zh) | 2006-09-20 |
| CN100517076C true CN100517076C (zh) | 2009-07-22 |
Family
ID=37002592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100655013A Active CN100517076C (zh) | 2005-03-18 | 2006-03-20 | 曝光装置和曝光方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4664102B2 (enExample) |
| KR (1) | KR100908548B1 (enExample) |
| CN (1) | CN100517076C (enExample) |
| TW (1) | TW200643648A (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4491447B2 (ja) * | 2005-11-04 | 2010-06-30 | 株式会社オーク製作所 | レーザビーム・紫外線照射周辺露光装置およびその方法 |
| JP4533874B2 (ja) * | 2005-11-04 | 2010-09-01 | 株式会社オーク製作所 | レーザビーム露光装置 |
| JP4491444B2 (ja) * | 2005-11-04 | 2010-06-30 | 株式会社オーク製作所 | レーザビーム・紫外線照射周辺露光装置およびその方法 |
| JP4491445B2 (ja) * | 2005-11-04 | 2010-06-30 | 株式会社オーク製作所 | 周辺露光装置およびその方法 |
| JP4491446B2 (ja) * | 2005-11-04 | 2010-06-30 | 株式会社オーク製作所 | 周辺露光装置およびその方法 |
| CN100593469C (zh) * | 2007-02-12 | 2010-03-10 | 深圳市大族激光科技股份有限公司 | 模块化曝光系统 |
| JP2011013512A (ja) * | 2009-07-03 | 2011-01-20 | Orc Manufacturing Co Ltd | 周辺露光装置 |
| TWI454687B (zh) * | 2009-08-03 | 2014-10-01 | Toray Eng Co Ltd | Marking device and method |
| CN102514385B (zh) * | 2011-11-29 | 2015-04-15 | 深圳市华星光电技术有限公司 | 标识码打印方法和打印设备 |
| JP5896459B2 (ja) | 2012-03-06 | 2016-03-30 | 東レエンジニアリング株式会社 | マーキング装置及び方法 |
| CN109116593B (zh) * | 2018-08-02 | 2021-07-20 | 深圳市华星光电半导体显示技术有限公司 | 母板曝光方法 |
| CN116699951B (zh) * | 2023-06-16 | 2024-10-22 | 江西景旺精密电路有限公司 | 一种曝光平台及ldi曝光装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08150485A (ja) * | 1994-11-28 | 1996-06-11 | Komatsu Ltd | レーザマーキング装置 |
| JPH08224675A (ja) * | 1995-02-22 | 1996-09-03 | Toshiba Corp | マーキングパターン形成装置 |
| JP4356161B2 (ja) * | 1999-12-20 | 2009-11-04 | 株式会社安川電機 | 描画装置 |
| KR100322621B1 (ko) * | 1999-12-31 | 2002-03-18 | 황인길 | 투사형 액정 디스플레이를 이용한 아이디 마킹장치 |
| JP2001205462A (ja) * | 2000-01-26 | 2001-07-31 | Nec Corp | レーザマーキング装置及びレーザマーキング方法 |
| JP3321733B2 (ja) * | 2000-09-20 | 2002-09-09 | 東レエンジニアリング株式会社 | 露光装置 |
| JP3547418B2 (ja) * | 2001-10-25 | 2004-07-28 | 三菱商事株式会社 | レーザビームによる液晶パネルのマーキング方法及び装置 |
| JP2003290939A (ja) * | 2002-03-28 | 2003-10-14 | Sunx Ltd | レーザマーキング装置 |
-
2005
- 2005-03-18 JP JP2005079425A patent/JP4664102B2/ja not_active Expired - Lifetime
-
2006
- 2006-03-02 TW TW095107019A patent/TW200643648A/zh unknown
- 2006-03-17 KR KR1020060024663A patent/KR100908548B1/ko active Active
- 2006-03-20 CN CNB2006100655013A patent/CN100517076C/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006259515A (ja) | 2006-09-28 |
| TW200643648A (en) | 2006-12-16 |
| JP4664102B2 (ja) | 2011-04-06 |
| CN1834789A (zh) | 2006-09-20 |
| TWI350946B (enExample) | 2011-10-21 |
| KR100908548B1 (ko) | 2009-07-20 |
| KR20060101337A (ko) | 2006-09-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |