TW200643648A - Exposure apparatus and exposure method - Google Patents

Exposure apparatus and exposure method

Info

Publication number
TW200643648A
TW200643648A TW095107019A TW95107019A TW200643648A TW 200643648 A TW200643648 A TW 200643648A TW 095107019 A TW095107019 A TW 095107019A TW 95107019 A TW95107019 A TW 95107019A TW 200643648 A TW200643648 A TW 200643648A
Authority
TW
Taiwan
Prior art keywords
exposure
substrate
stage
units
exposure unit
Prior art date
Application number
TW095107019A
Other languages
English (en)
Chinese (zh)
Other versions
TWI350946B (enExample
Inventor
Hiroki Tanikawa
Takeshi Tsuneyoshi
Masanori Tao
Toru Ito
Shinya Izumida
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW200643648A publication Critical patent/TW200643648A/zh
Application granted granted Critical
Publication of TWI350946B publication Critical patent/TWI350946B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/708—Mark formation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Laser Beam Processing (AREA)
TW095107019A 2005-03-18 2006-03-02 Exposure apparatus and exposure method TW200643648A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005079425A JP4664102B2 (ja) 2005-03-18 2005-03-18 露光装置及び露光方法

Publications (2)

Publication Number Publication Date
TW200643648A true TW200643648A (en) 2006-12-16
TWI350946B TWI350946B (enExample) 2011-10-21

Family

ID=37002592

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107019A TW200643648A (en) 2005-03-18 2006-03-02 Exposure apparatus and exposure method

Country Status (4)

Country Link
JP (1) JP4664102B2 (enExample)
KR (1) KR100908548B1 (enExample)
CN (1) CN100517076C (enExample)
TW (1) TW200643648A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4491447B2 (ja) * 2005-11-04 2010-06-30 株式会社オーク製作所 レーザビーム・紫外線照射周辺露光装置およびその方法
JP4533874B2 (ja) * 2005-11-04 2010-09-01 株式会社オーク製作所 レーザビーム露光装置
JP4491444B2 (ja) * 2005-11-04 2010-06-30 株式会社オーク製作所 レーザビーム・紫外線照射周辺露光装置およびその方法
JP4491445B2 (ja) * 2005-11-04 2010-06-30 株式会社オーク製作所 周辺露光装置およびその方法
JP4491446B2 (ja) * 2005-11-04 2010-06-30 株式会社オーク製作所 周辺露光装置およびその方法
CN100593469C (zh) * 2007-02-12 2010-03-10 深圳市大族激光科技股份有限公司 模块化曝光系统
JP2011013512A (ja) * 2009-07-03 2011-01-20 Orc Manufacturing Co Ltd 周辺露光装置
TWI454687B (zh) * 2009-08-03 2014-10-01 Toray Eng Co Ltd Marking device and method
CN102514385B (zh) * 2011-11-29 2015-04-15 深圳市华星光电技术有限公司 标识码打印方法和打印设备
JP5896459B2 (ja) 2012-03-06 2016-03-30 東レエンジニアリング株式会社 マーキング装置及び方法
CN109116593B (zh) * 2018-08-02 2021-07-20 深圳市华星光电半导体显示技术有限公司 母板曝光方法
CN116699951B (zh) * 2023-06-16 2024-10-22 江西景旺精密电路有限公司 一种曝光平台及ldi曝光装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08150485A (ja) * 1994-11-28 1996-06-11 Komatsu Ltd レーザマーキング装置
JPH08224675A (ja) * 1995-02-22 1996-09-03 Toshiba Corp マーキングパターン形成装置
JP4356161B2 (ja) * 1999-12-20 2009-11-04 株式会社安川電機 描画装置
KR100322621B1 (ko) * 1999-12-31 2002-03-18 황인길 투사형 액정 디스플레이를 이용한 아이디 마킹장치
JP2001205462A (ja) * 2000-01-26 2001-07-31 Nec Corp レーザマーキング装置及びレーザマーキング方法
JP3321733B2 (ja) * 2000-09-20 2002-09-09 東レエンジニアリング株式会社 露光装置
JP3547418B2 (ja) * 2001-10-25 2004-07-28 三菱商事株式会社 レーザビームによる液晶パネルのマーキング方法及び装置
JP2003290939A (ja) * 2002-03-28 2003-10-14 Sunx Ltd レーザマーキング装置

Also Published As

Publication number Publication date
CN100517076C (zh) 2009-07-22
JP2006259515A (ja) 2006-09-28
JP4664102B2 (ja) 2011-04-06
CN1834789A (zh) 2006-09-20
TWI350946B (enExample) 2011-10-21
KR100908548B1 (ko) 2009-07-20
KR20060101337A (ko) 2006-09-22

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