CN100475996C - 高温无铅焊料用组合物、生产方法及元件 - Google Patents

高温无铅焊料用组合物、生产方法及元件 Download PDF

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Publication number
CN100475996C
CN100475996C CNB018232760A CN01823276A CN100475996C CN 100475996 C CN100475996 C CN 100475996C CN B018232760 A CNB018232760 A CN B018232760A CN 01823276 A CN01823276 A CN 01823276A CN 100475996 C CN100475996 C CN 100475996C
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CN
China
Prior art keywords
weight
composition
alloy
solder
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB018232760A
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English (en)
Chinese (zh)
Other versions
CN1507499A (zh
Inventor
J·拉勒纳
N·迪安
M·魏泽
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Honeywell International Inc
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Honeywell International Inc
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Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of CN1507499A publication Critical patent/CN1507499A/zh
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Publication of CN100475996C publication Critical patent/CN100475996C/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K2035/008—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of silicium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
CNB018232760A 2001-05-28 2001-05-28 高温无铅焊料用组合物、生产方法及元件 Expired - Fee Related CN100475996C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/017491 WO2002097145A1 (en) 2001-05-28 2001-05-28 Compositions, methods and devices for high temperature lead-free solder

Publications (2)

Publication Number Publication Date
CN1507499A CN1507499A (zh) 2004-06-23
CN100475996C true CN100475996C (zh) 2009-04-08

Family

ID=21742612

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018232760A Expired - Fee Related CN100475996C (zh) 2001-05-28 2001-05-28 高温无铅焊料用组合物、生产方法及元件

Country Status (7)

Country Link
EP (2) EP1705258A3 (https=)
JP (1) JP2004533327A (https=)
KR (1) KR100700233B1 (https=)
CN (1) CN100475996C (https=)
AT (1) ATE351929T1 (https=)
DE (1) DE60126157T2 (https=)
WO (1) WO2002097145A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101745752B (zh) * 2009-12-17 2011-12-14 北京有色金属研究总院 一种纳米增强铋基无铅高温焊料及其制备方法

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DE10147378A1 (de) * 2001-09-26 2003-02-20 Infineon Technologies Ag Bleifreies Weichlot, insbesondere Elektroniklot
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置
JP4639791B2 (ja) * 2004-12-20 2011-02-23 パナソニック株式会社 はんだ材料の生産方法
CN101232967B (zh) * 2005-08-11 2010-12-08 千住金属工业株式会社 电子部件用无铅焊膏、钎焊方法以及电子部件
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
US20070138442A1 (en) * 2005-12-19 2007-06-21 Weiser Martin W Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
EP2061625A1 (en) * 2006-09-13 2009-05-27 Honeywell International Inc. Modified solder alloys for electrical interconnects, mehtods of production and uses thereof
JP2009158725A (ja) 2007-12-27 2009-07-16 Panasonic Corp 半導体装置およびダイボンド材
JPWO2009084155A1 (ja) * 2007-12-27 2011-05-12 パナソニック株式会社 接合材料、電子部品および接合構造体
CN101332544A (zh) * 2008-05-28 2008-12-31 广州瀚源电子科技有限公司 高熔点无铅焊料及其生产工艺
WO2009157130A1 (ja) 2008-06-23 2009-12-30 パナソニック株式会社 接合構造および電子部品
JP5383795B2 (ja) * 2009-04-22 2014-01-08 パナソニック株式会社 半導体装置
JP2011014705A (ja) * 2009-07-01 2011-01-20 Hitachi Ltd 半導体装置および半導体装置の製造方法
JP2011071152A (ja) * 2009-09-24 2011-04-07 Panasonic Corp 半導体装置及びその製造方法
JP4807465B1 (ja) 2010-06-28 2011-11-02 住友金属鉱山株式会社 Ｐｂフリーはんだ合金
US9205513B2 (en) * 2010-06-30 2015-12-08 Senju Metal Industry Co., Ltd. Bi—Sn based high-temperature solder alloy
JP5667467B2 (ja) * 2011-02-18 2015-02-12 有限会社 ナプラ 合金材料、回路基板、電子デバイス及びその製造方法
JP5093373B2 (ja) 2011-03-08 2012-12-12 住友金属鉱山株式会社 Ｐｂフリーはんだペースト
CN102430873B (zh) * 2011-10-26 2015-06-03 浙江亚通焊材有限公司 一种高温电子封装用无铅钎料及其制备方法
CN103014401B (zh) * 2012-12-05 2014-12-03 昆明贵金属研究所 一种金合金及其制备方法
KR20140121211A (ko) * 2013-04-05 2014-10-15 부산대학교 산학협력단 고융점 무연 솔더 조성물, 고융점 무연 솔더 합금 제조방법 및 이의 용도
US20160234945A1 (en) * 2013-09-20 2016-08-11 Sumitomo Metal Mining Co., Ltd. Bi-BASED SOLDER ALLOY, METHOD OF BONDING ELECTRONIC COMPONENT USING THE SAME, AND ELECTRONIC COMPONENT-MOUNTED BOARD
JP5852080B2 (ja) * 2013-11-05 2016-02-03 ローム株式会社 半導体装置
KR20160121562A (ko) 2014-02-20 2016-10-19 허니웰 인터내셔날 인코포레이티드 무연 솔더 조성물
JP6543890B2 (ja) * 2014-04-14 2019-07-17 富士電機株式会社 高温はんだ合金
KR101637288B1 (ko) * 2014-11-14 2016-07-07 현대자동차 주식회사 은 페이스트의 접합 방법
CN106001982A (zh) * 2016-07-08 2016-10-12 重庆科技学院 一种高熔点无铅铋银锡钎料及其制备方法
TWI647316B (zh) * 2016-07-15 2019-01-11 Ｊｘ金屬股份有限公司 Solder alloy
CN106914711B (zh) * 2017-04-13 2019-04-23 杭州哈尔斯实业有限公司 一种不锈钢真空容器用无铅焊料及其制造方法和钎焊方法
CN108004429A (zh) * 2017-11-29 2018-05-08 广西厚思品牌策划顾问有限公司 一种低熔点无铅焊料合金及其制备方法
FR3087369B1 (fr) * 2018-10-19 2021-06-04 Dehon Sa Alliage de brasure et utilisation d'un tel alliage
CN114248037A (zh) * 2021-12-28 2022-03-29 昆山市天和焊锡制造有限公司 一种高抗氧化性无铅焊锡材料

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CN1195592A (zh) * 1997-02-15 1998-10-14 三星电子株式会社 焊料用无铅合金

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US5389160A (en) * 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
EP0787819B1 (de) * 1996-01-31 1999-12-22 LEYBOLD MATERIALS GmbH Sputtertarget aus einer Zinn- oder Zinn-Basislegierung
JP3249774B2 (ja) * 1997-06-05 2002-01-21 トヨタ自動車株式会社 摺動部材
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JP2001121285A (ja) * 1999-10-25 2001-05-08 Sumitomo Metal Mining Co Ltd ダイボンディング用半田合金

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101745752B (zh) * 2009-12-17 2011-12-14 北京有色金属研究总院 一种纳米增强铋基无铅高温焊料及其制备方法

Also Published As

Publication number Publication date
JP2004533327A (ja) 2004-11-04
DE60126157T2 (de) 2007-12-13
WO2002097145B1 (en) 2004-05-27
EP1705258A3 (en) 2007-01-17
ATE351929T1 (de) 2007-02-15
EP1399600A1 (en) 2004-03-24
KR20030096420A (ko) 2003-12-24
KR100700233B1 (ko) 2007-03-26
CN1507499A (zh) 2004-06-23
DE60126157D1 (de) 2007-03-08
WO2002097145A1 (en) 2002-12-05
EP1705258A2 (en) 2006-09-27
EP1399600A4 (en) 2005-05-04
EP1399600B1 (en) 2007-01-17

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Termination date: 20120528