CN100452408C - Soi晶片及其制造方法 - Google Patents

Soi晶片及其制造方法 Download PDF

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Publication number
CN100452408C
CN100452408C CNB2004800058863A CN200480005886A CN100452408C CN 100452408 C CN100452408 C CN 100452408C CN B2004800058863 A CNB2004800058863 A CN B2004800058863A CN 200480005886 A CN200480005886 A CN 200480005886A CN 100452408 C CN100452408 C CN 100452408C
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CN
China
Prior art keywords
wafer
mentioned
zone
silicon
active layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB2004800058863A
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English (en)
Chinese (zh)
Other versions
CN1757115A (zh
Inventor
樱田昌弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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Publication of CN1757115A publication Critical patent/CN1757115A/zh
Application granted granted Critical
Publication of CN100452408C publication Critical patent/CN100452408C/zh
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20—Controlling or regulating
    • C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76243—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using silicon implanted buried insulating layers, e.g. oxide layers, i.e. SIMOX techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Element Separation (AREA)
  • Recrystallisation Techniques (AREA)
CNB2004800058863A 2003-03-18 2004-03-12 Soi晶片及其制造方法 Expired - Lifetime CN100452408C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003073768A JP4854917B2 (ja) 2003-03-18 2003-03-18 Ｓｏｉウェーハ及びその製造方法
JP073768/2003 2003-03-18

Publications (2)

Publication Number Publication Date
CN1757115A CN1757115A (zh) 2006-04-05
CN100452408C true CN100452408C (zh) 2009-01-14

Family

ID=33027796

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800058863A Expired - Lifetime CN100452408C (zh) 2003-03-18 2004-03-12 Soi晶片及其制造方法

Country Status (7)

Country Link
US (1) US7518187B2 (cg-RX-API-DMAC7.html)
EP (1) EP1605510B1 (cg-RX-API-DMAC7.html)
JP (1) JP4854917B2 (cg-RX-API-DMAC7.html)
KR (1) KR101007678B1 (cg-RX-API-DMAC7.html)
CN (1) CN100452408C (cg-RX-API-DMAC7.html)
TW (1) TW200423378A (cg-RX-API-DMAC7.html)
WO (1) WO2004084308A1 (cg-RX-API-DMAC7.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200428637A (en) * 2003-01-23 2004-12-16 Shinetsu Handotai Kk SOI wafer and production method thereof
JP4854917B2 (ja) * 2003-03-18 2012-01-18 信越半導体株式会社 Ｓｏｉウェーハ及びその製造方法
JP2006294737A (ja) * 2005-04-07 2006-10-26 Sumco Corp Ｓｏｉ基板の製造方法及びその製造における剥離ウェーハの再生処理方法。
JP4604889B2 (ja) * 2005-05-25 2011-01-05 株式会社Sumco シリコンウェーハの製造方法、並びにシリコン単結晶育成方法
JP2007067321A (ja) * 2005-09-02 2007-03-15 Sumco Corp Ｓｉｍｏｘ基板およびその製造方法
WO2007074552A1 (ja) * 2005-12-27 2007-07-05 Shin-Etsu Chemical Co., Ltd. Ｓｏｉウェーハの製造方法及びｓｏｉウェーハ
JP5121139B2 (ja) * 2005-12-27 2013-01-16 ジルトロニック アクチエンゲゼルシャフト アニールウエハの製造方法
JP4805681B2 (ja) * 2006-01-12 2011-11-02 ジルトロニック アクチエンゲゼルシャフト エピタキシャルウェーハおよびエピタキシャルウェーハの製造方法
FR2938118B1 (fr) * 2008-10-30 2011-04-22 Soitec Silicon On Insulator Procede de fabrication d'un empilement de couches minces semi-conductrices
FR3003997B1 (fr) * 2013-03-29 2015-03-20 Soitec Silicon On Insulator Procede de fabrication d'une structure composite
JP7495238B2 (ja) * 2020-02-19 2024-06-04 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204150A (ja) * 1992-12-28 1994-07-22 Sumitomo Sitix Corp 半導体用シリコン単結晶基板の製造方法
JP2000351690A (ja) * 1999-06-08 2000-12-19 Nippon Steel Corp シリコン単結晶ウエーハおよびその製造方法
JP2001044398A (ja) * 1999-07-30 2001-02-16 Mitsubishi Materials Silicon Corp 張り合わせ基板およびその製造方法
JP2001146498A (ja) * 1999-11-12 2001-05-29 Shin Etsu Handotai Co Ltd シリコン単結晶ウエーハおよびその製造方法並びにｓｏｉウエーハ
JP2002134518A (ja) * 2000-10-27 2002-05-10 Mitsubishi Materials Silicon Corp 抵抗率を調整したシリコンウェーハ及びそのウェーハの製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69508473T2 (de) * 1994-07-06 1999-10-28 Shin-Etsu Handotai Co., Ltd. Verfahren zur Herstellung von Silizium-Einkristall und Tiegel aus geschmolzenem Silika dafür
JPH1079498A (ja) 1996-09-03 1998-03-24 Nippon Telegr & Teleph Corp <Ntt> Ｓｏｉ基板の製造方法
JPH1140786A (ja) 1997-07-18 1999-02-12 Denso Corp 半導体基板及びその製造方法
US6548382B1 (en) * 1997-07-18 2003-04-15 Silicon Genesis Corporation Gettering technique for wafers made using a controlled cleaving process
US6083324A (en) * 1998-02-19 2000-07-04 Silicon Genesis Corporation Gettering technique for silicon-on-insulator wafers
JP3932369B2 (ja) 1998-04-09 2007-06-20 信越半導体株式会社 剥離ウエーハを再利用する方法および再利用に供されるシリコンウエーハ
DE19823962A1 (de) * 1998-05-28 1999-12-02 Wacker Siltronic Halbleitermat Verfahren zur Herstellung eines Einkristalls
US6224668B1 (en) * 1998-06-02 2001-05-01 Shin-Etsu Handotai Co., Ltd. Method for producing SOI substrate and SOI substrate
US6077343A (en) * 1998-06-04 2000-06-20 Shin-Etsu Handotai Co., Ltd. Silicon single crystal wafer having few defects wherein nitrogen is doped and a method for producing it
JP3762144B2 (ja) * 1998-06-18 2006-04-05 キヤノン株式会社 Ｓｏｉ基板の作製方法
JP2000082679A (ja) * 1998-07-08 2000-03-21 Canon Inc 半導体基板とその作製方法
US6180497B1 (en) * 1998-07-23 2001-01-30 Canon Kabushiki Kaisha Method for producing semiconductor base members
JP2001144275A (ja) * 1999-08-27 2001-05-25 Shin Etsu Handotai Co Ltd 貼り合わせｓｏｉウエーハの製造方法および貼り合わせｓｏｉウエーハ
US6653209B1 (en) * 1999-09-30 2003-11-25 Canon Kabushiki Kaisha Method of producing silicon thin film, method of constructing SOI substrate and semiconductor device
JP3994665B2 (ja) * 2000-12-28 2007-10-24 信越半導体株式会社 シリコン単結晶ウエーハおよびシリコン単結晶の製造方法
US20020084451A1 (en) * 2000-12-29 2002-07-04 Mohr Thomas C. Silicon wafers substantially free of oxidation induced stacking faults
DE10124032B4 (de) * 2001-05-16 2011-02-17 Telefunken Semiconductors Gmbh & Co. Kg Verfahren zur Herstellung von Bauelementen auf einem SOI-Wafer
JP2003204048A (ja) * 2002-01-09 2003-07-18 Shin Etsu Handotai Co Ltd Ｓｏｉウエーハの製造方法及びｓｏｉウエーハ
JP4207577B2 (ja) * 2003-01-17 2009-01-14 信越半導体株式会社 Ｐドープシリコン単結晶の製造方法
JP4854917B2 (ja) * 2003-03-18 2012-01-18 信越半導体株式会社 Ｓｏｉウェーハ及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204150A (ja) * 1992-12-28 1994-07-22 Sumitomo Sitix Corp 半導体用シリコン単結晶基板の製造方法
JP2000351690A (ja) * 1999-06-08 2000-12-19 Nippon Steel Corp シリコン単結晶ウエーハおよびその製造方法
JP2001044398A (ja) * 1999-07-30 2001-02-16 Mitsubishi Materials Silicon Corp 張り合わせ基板およびその製造方法
JP2001146498A (ja) * 1999-11-12 2001-05-29 Shin Etsu Handotai Co Ltd シリコン単結晶ウエーハおよびその製造方法並びにｓｏｉウエーハ
JP2002134518A (ja) * 2000-10-27 2002-05-10 Mitsubishi Materials Silicon Corp 抵抗率を調整したシリコンウェーハ及びそのウェーハの製造方法

Also Published As

Publication number Publication date
US7518187B2 (en) 2009-04-14
EP1605510A1 (en) 2005-12-14
CN1757115A (zh) 2006-04-05
KR101007678B1 (ko) 2011-01-13
EP1605510B1 (en) 2011-10-05
EP1605510A4 (en) 2009-09-16
TWI334217B (cg-RX-API-DMAC7.html) 2010-12-01
KR20050109568A (ko) 2005-11-21
JP4854917B2 (ja) 2012-01-18
US20060086313A1 (en) 2006-04-27
JP2004281883A (ja) 2004-10-07
WO2004084308A1 (ja) 2004-09-30
TW200423378A (en) 2004-11-01

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