CN100425572C - 陶瓷复合材料及其制造方法 - Google Patents

陶瓷复合材料及其制造方法 Download PDF

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CN100425572C
CN100425572C CNB2004800322601A CN200480032260A CN100425572C CN 100425572 C CN100425572 C CN 100425572C CN B2004800322601 A CNB2004800322601 A CN B2004800322601A CN 200480032260 A CN200480032260 A CN 200480032260A CN 100425572 C CN100425572 C CN 100425572C
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carbon
ceramic
phase
littler
grain size
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CN1874973A (zh
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上野友之
吉村雅司
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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  • Compositions Of Oxide Ceramics (AREA)

Abstract

本发明提供了适合作切削工具、滑动部件和成型模具材料的高耐磨、低摩擦的陶瓷复合材料。该陶瓷复合材料的特征在于由具有平均晶粒尺寸为3μm或更小,优选30nm或更小的碳作为主组分的相以及陶瓷相(条件是排除碳)构成。所述陶瓷相为选自Al、Si、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物中的至少一种。该陶瓷复合材料是通过在800至1500℃烧结温度和200MPa或更高烧结压力下烧结原料粉末而制得。

Description

陶瓷复合材料及其制造方法
技术领域
本发明涉及在室温至中/高温范围具有优良机械性能的陶瓷复合材料,其在各种应用中被用作高耐磨、低摩擦的陶瓷材料,所述应用包括各种结构部件、切削工具、滑动部件以及成型模具材料;本发明还涉及该复合材料的制造方法。
背景技术
将固体润滑剂如碳的粒子分散入诸如氮化硅的陶瓷基质中以改善材料的摩擦系数和相对磨损率,由此所得的材料目前是公知的。
例如,由氮化硅和氮化钛以及0.5至20wt%石墨及碳的复合材料得到的具有突出摩擦特性和耐磨性能的材料报道于日本专利公报特开2003-34580中。然而在该特开2003-34580中所述条件下制备的粉末烧结试样,用扫描电子显微镜在2000倍放大倍数下鉴定,观察到大量直径20μm或更大、开口气孔率为3%或更高的气孔,这证明此材料用于模具是不可能的。
同时,将0.5至6wt%的C、Cr、Mo、W、Al、Ti和Ni作为抗氧化合金掺入到氧化铝和氧化锆中所得的超硬材料报道于日本专利公报特开昭60-100646中,然而当碳含量低至0.1至0.2%时,材料缺乏用于模具的润滑性。
另外,将2至50wt%颗粒尺寸为5μm或更大的碳加入至碳化硅中所得的具有出色耐磨性的材料报道于日本专利公报特开平09-87029中;将3至30wt%平均晶粒尺寸3至6μm的石墨分散入碳化钛基质中所得的材料报道于日本专利公报特开平05-301773中。然而,当碳的平均晶粒尺寸大到3μm或更大时,在将材料加工成所期望的形状时表面粗糙度就受到晶粒尺寸的影响,这使得难以得到10nm或更低平均粗糙度的材料反射面。
此外,日本专利公报特开平10-231174介绍了将石墨和氮化硼分散入非氧化物陶瓷中所得的材料,在其界面层之间插入铁化合物(如铁的氧化物或硅化物)。然而,这种材料由于包含铁而存在一些问题,例如由于氧化而致的劣化以及高温下的稳定性受损,使其不适合用作模具材料。
本发明公开内容
鉴于上文讨论的情况,本发明的目的是制造可用的陶瓷复合材料,该材料除了在室温到中/高温度范围内具有优良的机械性能外,且对玻璃、树脂和陶瓷以及其他材料具有增强的脱模性能;同时提供制造该复合材料的方法。
通过反复研究,本发明人发现,在含有以碳作为主组分的相的陶瓷复合材料中,通过使该陶瓷复合材料的平均晶粒尺寸为3μm或更小,优选30nm或更小,则可解决上文详述的问题,由此完成了本发明。
具体地,本发明具有下列构成特征。
(1).陶瓷复合材料,其特征在于由含有平均晶粒尺寸为3μm或更小,优选30nm或更小的碳作为主组分的相以及陶瓷相(条件是排除碳)构成。
(2).如上文(1)所述的陶瓷复合材料,其特征在于含有碳作为主组分的相的含量是2-98wt%。
(3).如上文(1)和(2)所述的陶瓷复合材料,其特征在于抛光之后复合材料表面的开口气孔率为1%或更小。
(4).如上文(1)和(2)所述的陶瓷复合材料,其特征在于烧结形式的复合材料的维氏硬度为10GPa或更大。
(5).如上文(1)至(4)所述的陶瓷复合材料,其特征在于所述陶瓷相由选自由Al、Si、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种构成。
(6).制造由具有平均晶粒尺寸为3μm或更小,优选30nm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的方法,其特征在于将平均晶粒尺寸为3μm或更小,优选30nm或更小的陶瓷粉末(条件是排除碳)与碳粉末的粉末混合物进行成型,并将获得的成型体在非氧化性气氛中于800至1500℃的烧结温度和200MPa或更高的烧结压力下进行烧结。
(7).制造如上文(5)所述、由具有平均晶粒尺寸为3μm或更小,优选30nm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的方法,其特征在于所述陶瓷粉末为选自由Al、Si、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种。
(8).如上文(6)和(7)所述的、制造由具有平均晶粒尺寸为3μm或更小,优选30nm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的方法,其特征在于粉末混合物进一步包括选自Al、Si、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo和W的至少一种金属。
本发明最佳实施方式
本发明为陶瓷复合材料,其特征在于,由具有平均晶粒尺寸为3μm或更小、优选30nm或更小的碳作为主组分的相以及陶瓷相构成。该陶瓷复合材料中以碳为主组分的相对于玻璃、树脂和陶瓷以及其他材料显示出优良的脱模性能。如果陶瓷复合材料相的平均晶粒尺寸超过3μm,则在将复合材料加工成所期望的形状时,平均粗糙度将达到如此之大以至于如镜面般的光洁度将难以达到。
此外,本发明的“碳”应该是其构成物质由碳组成的物质,因此可合适地选自例如石墨(C)、石墨碳(GC)、金刚石、碳纳米管(CNT)、足球烯(C60)和碳纳米纤维(CNF)的材料。复合材料中的碳含量期望为2-98wt%;小于该含量是不期望的,因为这样材料的脱模性能将受到损害,高于该含量同样不期望,因为这样材料将不能烧结。优选的碳含量是30-80wt%;特别优选40-60wt%。这一数值范围内的碳含量能更加改善所述复合材料对于例如玻璃、树脂和陶瓷的材料的脱模性能。
本发明陶瓷复合材料中的陶瓷相期望由选自由Al、Si、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物和氧化物组成的组中的至少一种形成。此外,陶瓷相还可以是刚才所提及金属的复合氮化物、复合碳化物或复合氧化物,或者可以是刚才所列举金属的碳氮化物、氧氮化物、碳氮氧化物或碳氧化物。根据形成自复合材料的模具将要成型的材料,合适地选择用于陶瓷相的一种或多种这些种类的陶瓷材料并且陶瓷相材料的含量是2-98wt%是有利的。为了改善复合材料的烧结能力,还可根据需要而使用公知的烧结助剂,但是不希望氧化物基烧结助剂的含量大,因为助剂会与碳强烈反应,这使得难以制造超细材料且损害材料的机械性能。
本发明的陶瓷复合材料是通过将至少一种平均晶粒尺寸为3μm或更小,优选30nm或更小的Al、Si、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo或W的氮化物、碳化物或氧化物的陶瓷粉末与碳粉末的粉末混合物进行成型,并在非氧化性气氛下于800至1500℃的烧结温度和200MPa或更高的烧结压力下将所得成型体进行烧结而得到。非氧化性气氛可选择真空气氛或惰性气体气氛如H2、N2或Ar,优选真空气氛。前述粉末混合物也可进一步包含至少一种选自Al、Si、Ti、Zr、Hf、V、Nb、Ta、Cr、Mo和W的金属。这些金属与粉末混合物中的碳反应形成碳化物,或者,如果非氧化性气氛是N2,则与N2反应形成氮化物。此外,一些金属能通过混合物中的机械化学反应形成碳化物或氮化物等。
如果烧结温度低于800℃,则烧结反应不能进行,这将使得难以得到陶瓷复合材料。同样,如果温度高于1500℃将导致烧结过度进行,使颗粒尺寸变粗且损害材料的机械性能。1000至1400℃的烧结温度是尤其合适的。
此外,如果烧结压力低于200MPa,烧结反应将不能进行,导致不能得到陶瓷复合材料。最优的压力是500MPa或更高。
如下将给出实施方案的实例详细阐述本发明。应该指出的是以下的wt%表示内比例。
实施方案中使用的测定方法如下。
(1).粉末平均颗粒尺寸的测定
使用透射电子显微镜(TEM:H-9000 UHRIII mfd.由Hitachi制造)。
在由TEM得到的图像的任意区域中,随机选出100个粉末颗粒,测定颗粒尺寸,尺寸的平均值被作为粉末的平均颗粒尺寸。
(2).平均晶粒尺寸的测定
使用透射电子显微镜(TEM:H-9000 UHRIII mfd.由Hitachi制造)。
在由TEM得到的图像的任意位置,划出穿过50个颗粒的程度的直线,用线的长度除以颗粒数量,以此得到颗粒尺寸。该操作在5个任意位置施行,平均值作为平均晶粒尺寸。
(3).开口气孔率的测定
使用压汞孔隙度仪(9420mfd.由Shimadzu Seisakusho制造)。
水银在压力下被压入样品,并且通过被压入的水银体积计算气孔体积和气孔尺寸。
(4).抗弯强度的测定
使用通用材料测定仪(5585mfd.由Instron制造)。
根据标准JIS R 1601计算从三点抗弯测得的数据。
实施方案1
在0.1MPa的氮气气氛下,将作为烧结助剂的2.5wt%Y2O3粉末和1wt%Al2O3粉末加入至平均颗粒尺寸为0.5μm的市售Si3N4粉末中,并进一步加入20wt%平均颗粒尺寸为1μm的金属Zr粉和40wt%平均颗粒尺寸为5μm的石墨粉,粉末的混合通过使用Si3N4制球的球磨方法在10G的加速度下进行。
将所得复合材料粉末通过X-射线衍射(XRD)进行定性分析,其中Si3N4、ZrN、ZrCN、ZrC和C的衍射峰能够被确认。此外,复合材料粉末在透射电子显微镜下的观测结果显示,平均颗粒尺寸为3μm或更小。
接着,利用上述所得复合材料粉末,在真空气氛和表I所记录的条件下通过烧结该粉末而制造陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
表I
Figure C20048003226000111
*:比较例
在完成对所得陶瓷复合材料的磨削(grinding)和精研(lapping)操作后,使用透射电子显微镜在每一陶瓷复合材料的任意10个位置进行平均晶粒尺寸的测定。随后使用压汞孔隙度仪完成对每一陶瓷复合材料开口气孔率的测定。接着使用维氏硬度计测定所获得复合材料的维氏硬度。这些测量的结果列于表II。
Figure C20048003226000121
表II的结果证明,应用800至1500℃烧结温度和200至5000Pa烧结压力的条件所制造的陶瓷复合材料的平均晶粒尺寸是3μm或更小。当烧结温度为1700℃时,晶粒生长显著增长,由此平均晶粒尺寸变得大于3μm,这意味着陶瓷复合材料表面上精研抛光(lap-polished)区域的表面粗糙度不能提供所期望的精度。
根据表II的结果,很明显,应用前述烧结条件所得烧结体的开口气孔率小于1%,这是相当良好的。当开口气孔率大于1%时,如果陶瓷复合材料被用作例如玻璃的成型模具,则玻璃进入气孔区域,引起脱模性能问题和界面上产生毛刺的问题以及其他困难。
实施方案2
在0.1Mpa的氮气气氛下,将作为烧结助剂的2.5wt%Y2O3粉末和1wt%Al2O3粉末加入至平均颗粒尺寸为0.5μm的市售Si3N4粉末中,并进一步加入20wt%平均颗粒尺寸为1μm的金属Zr粉,之后将平均颗粒尺寸为5μm的石墨粉以表III所列比例加入,并将粉末掺混,粉末的混合通过使用Si3N4制球的球磨方法在10G的加速度下进行。
表III
  试验编号   烧结粉末中加入的石墨数量(wt%)
  2-1<sup>*</sup>   1
  2-2   2
  2-3   20
  2-4   40
  2-5   70
  2-6   98
  2-7<sup>*</sup>   99
*:比较例
所得复合材料粉末通过X-射线衍射(XRD)进行定性分析,其中Si3N4、ZrN、ZrCN、ZrC和C的衍射峰能够被确认。此外,复合材料粉末在透射电子显微镜下的观测结果显示,平均颗粒尺寸为3μm或更小。
接着,利用刚才所述的复合材料粉末,通过在真空气氛和1150℃烧结温度、1000MPa烧结压力的条件下烧结该粉末而制造陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
在完成对所得陶瓷复合材料的磨削和精研操作后,进行复合材料平均晶粒尺寸、开口气孔率和抗弯强度的评价。然后为确定对光学玻璃进行模具成型时的脱模性能,使用硅酸硼玻璃(Pyrex)进行评价。在评价方法中,将本发明的陶瓷复合材料切割成20mm的计量长度,然后表面精研抛光至0.02μm(Ra)的表面粗糙度,并且在720℃成型温度、10MPa成型压力的条件下用作模具对10mm计量长度的前述硅酸硼玻璃(Pyrex)压60秒。进行100次玻璃成型试验,对以下含量作出脱模性能评价。起初,在成型操作完成后,硅酸硼玻璃(Pyrex)在不施加外力的情况下与模具脱离,随后在硅酸硼玻璃(Pyrex)外表面的检测中,这些产品没有碎屑、裂纹或污斑,并且成型后硅酸硼玻璃(Pyrex)转印面的粗糙度为0.03μm或更小(Ra)被认为是合格的。脱模性能(%)被定义为合格的产品数除以成型试验次数所得的百分数。举例来说,如果在100次成型试验中得到50个合格产品,那么脱模性能就是50%。脱模性能评价的结果列于表IV。
表IV
试验编号 石墨数量(wt%) 开口气孔率(%) 平均颗粒尺寸(μm) 抗弯强度(MPa)   对硅酸硼玻璃(Pyrex)的脱模性能(%)
  2-1<sup>*</sup>   1   2.3   4.7   1120   18
  2-2   2   0.8   2.8   1100   59
  2-3   20   0.3   2.1   918   97
  2-4   40   0.2   1.7   717   100
2-5 70 0.3 1.9 414 100
  2-6   98   0.9   2.6   112   91
  2-7<sup>*</sup>   99   未烧结   未烧结   未烧结   未烧结
硅酸硼玻璃(Pyrex)的脱模性能试验:720℃/10MPa压力条件下压60秒;试验次数n=100
表IV的结果表明,在石墨含量为2至98wt%的陶瓷复合材料中,开口气孔率小于1%且平均晶粒尺寸为3μm或更小。进一步,含有石墨比例20至98wt%的模具样品对硅酸硼玻璃(Pyrex)的脱模性能是非常优良的,为90%或更高,甚至当样品中所述含量比例为2%时,脱模性能也接近60%;由此显示出复合材料可充分用作模具。同时,在石墨含量为1wt%的样品中,脱模性能严重恶化。相反,对石墨含量高于90wt%的复合材料,其烧结被证明是有问题的;含量为98wt%的,烧结体在数次尝试中有一次是可制造的,但是随着石墨含量超过99wt%,制备烧结体被证明是完全不可能的。
实施方案3
按照表V所列的配方,通过将平均颗粒尺寸0.5μm的40wt%表V所示陶瓷粉末(1)、20wt%平均颗粒尺寸0.5μm的陶瓷粉末(2)和平均颗粒尺寸不超过5μm的作为余量的碳粉末以及根据需要而添加的烧结助剂共混合,并在10G的加速度下使用球磨机混合该共混物而制得掺混粉末。
表V
  试验编号   陶瓷粉末(1)  陶瓷粉末(2)   碳   烧结助剂
  3-1   SiC  ZrCn   C   2.5wt%Y<sub>2</sub>O<sub>3</sub>+1wt%Al<sub>2</sub>O<sub>3</sub>
  3-2   Si<sub>3</sub>N<sub>4</sub>  TiCN   GC   2.5wt%Y<sub>2</sub>O<sub>3</sub>+1wt%Al<sub>2</sub>O<sub>3</sub>
  3-3   AlN  CrN   C   0.6wt%Y<sub>2</sub>O<sub>3</sub>
  3-4   Al<sub>2</sub>O<sub>3</sub>  MoO<sub>2</sub>   C   -
  3-5   3Y-ZrO<sub>2</sub><sup>*</sup>  WC   GC   -
  3-6   SiC  VN   GC   2.5wt%Y<sub>2</sub>O<sub>3</sub>+1wt%Al<sub>2</sub>O<sub>3</sub>
  3-7   Si<sub>3</sub>N<sub>4</sub>  TiCO   C   2.5wt%Y<sub>2</sub>O<sub>3</sub>+1wt%Al<sub>2</sub>O<sub>3</sub>
  3-8   尖晶石  NbHfC   C<sub>60</sub>   0.6wt%Y<sub>2</sub>O<sub>3</sub>
  3-9   β-SiAlON  TaNbC   CNT   -
  3-10   莫来石  TaNbN   碳黑   -
*)3Y-ZrO2:以3wt%Y2O3稳定的ZrO2
所得复合材料粉末在透射电子显微镜下的观测结果显示,平均晶粒尺寸为3μm或更小。
接着,利用刚才所述的复合材料粉末,在真空气氛和1150℃烧结温度、1000MPa烧结压力的条件下通过烧结该粉末而制造陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
在完成对所得陶瓷复合材料的磨削和精研操作后,进行复合材料开口气孔率、平均晶粒尺寸和抗弯强度的评价。然后,为了确定对光学玻璃进行模具成型时的转印精度和脱模性能,以与实施方案2同样的方式使用硅酸硼玻璃(Pyrex)进行100次成型试验,评价脱模性能。评价和试验的结果列于表VI。
表VI
试验编号 开口气孔率(%) 平均颗粒尺寸(μm) 抗弯强度(MPa)  对硅酸硼玻璃(Pyrex)的脱模性能(%)<sup>*</sup>
  3-1   0.3   1.4  433  100
  3-2   0.2   1.7  720  100
  3-3   0.4   1.8  428  100
  3-4   0.5   2.3  287  100
  3-5   0.2   1.6  686  100
  3-6   0.2   1.6  728  100
  3-7   0.3   1.7  720  100
  3-8   0.4   1.7  402  100
  3-9   0.4   2.2  416  100
  3-10   0.2   1.7  337  100
*:720℃/10MPa压力条件下压60秒
试验次数n=100
实施方案4
按照表VII所列的配方,利用平均颗粒尺寸为0.5μm的表VII所示陶瓷粉末,和使余量为平均颗粒尺寸5μm或更小的碳粉末,并根据需要向此共混物中添加烧结助剂,通过共混以上材料并且在10G的加速度下使用球磨机混合该共混物而制得掺混粉末。
表VII
Figure C20048003226000181
*)3Y-ZrO2:以3wt% Y2O3稳定的ZrO2
Figure C20048003226000182
:比较例
所得粉末掺混物在透射电子显微镜下的观测结果显示,平均晶粒尺寸为3μm或更小。接着,对陶瓷粉末分别为Si3N4和AlN的样品在N2气气氛下,对陶瓷粉末分别为SiC、Al2O3和3Y-ZrO2(以3wt%Y2O3稳定的ZrO2)的样品在Ar气气氛下,通过1150℃烧结温度、1000MPa烧结压力的条件烧结该粉末掺混物而制造陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定的。
在完成对所得陶瓷复合材料的磨削和精研操作后,进行复合材料的开口气孔率、平均晶粒尺寸和抗弯强度的评价。然后,为了确定对光学玻璃进行模具成型时的转移精度和脱模性能,以与实施方案2同样的方式使用硅酸硼玻璃(Pyrex)进行100次成型试验,评价脱模性能。评价和试验的结果列于表VIII。
表VIII
Figure C20048003226000191
*比较例
Figure C20048003226000192
*比较例
Figure C20048003226000201
*比较例
Figure C20048003226000202
*比较例
硅酸硼玻璃(Pyrex)的脱模性能试验:720℃/10MPa压力条件下压60秒;试验次数n=100
实施方案5
在0.1Mpa的氮气气氛下,将作为烧结助剂的2.5wt%Y2O3粉末以及1wt%Al2O3粉末加入至平均颗粒尺寸为0.5μm的市售SiC粉末中,并进一步加入20wt%平均颗粒尺寸为3μm的金属CrN粉和40wt%平均颗粒尺寸为5μm的石墨粉,粉末的混合通过使用SiC制球的球磨方法在10G的加速度下进行。
所得复合材料粉末通过XRD进行定性分析,其中SiC、CrN、CrCN、CrC和C的衍射峰能够被确认。此外,复合材料粉末在透射电子显微镜下的观测结果显示,平均晶粒尺寸为3μm或更小。
接着,将刚才所述的复合材料粉末在真空气氛和表IX所记录的条件下进行烧结以生成陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
表IX
*:比较例
在完成对所得陶瓷复合材料的磨削和精研操作后,为了确定在对光学玻璃进行模具成型时的形状转印精度和脱模性能,以与实施方案2同样的方式使用硅酸硼玻璃(Pyrex)进行100次成型试验,评价脱模性能。试验和评价的结果列于表X。
表X
Figure C20048003226000221
*:比较例
硅酸硼玻璃(Pyrex)的脱模性能试验:720℃/10MPa压力条件下压60秒;试验次数n=100
表X的结果证明,应用800至1500℃烧结温度和200MPa或更高烧结压力的条件所制造的烧结体与硅酸硼玻璃(Pyrex)之间的脱模性能是优良的。然而,当烧结温度为1700℃时,晶粒显著生长以至于脱模性能明显恶化。同时,在烧结温度为600℃的样品中,尽管烧结压力为1000MPa或更高的那些样品显示出了脱模性能,但对应用低于该水平的烧结压力而得到的陶瓷复合材料,模具经不起成型时的加压力而解体。最后,400℃的烧结温度被证明会抑制烧结体的制造。
实施方案6
在0.1Mpa的氮气气氛下,将作为烧结助剂的2.5wt%Y2O3粉末以及1wt%Al2O3粉末加入至平均颗粒尺寸为0.5μm的市售Si3N4粉末中,并进一步加入30wt%平均颗粒尺寸为0.5μm的金属Ti粉和40wt%平均颗粒尺寸为5μm的石墨粉,粉末的混合通过使用Si3N4制球的球磨方法在150G的加速度下完成。
所得复合材料粉末通过XRD进行定性分析,其中Si3N4、TiN、TiCN、TiC和C的宽衍射峰能够被确认。此外,复合材料粉末在透射电子显微镜下的观测结果显示,平均颗粒尺寸为30nm或更小。
接着,将上述方式制造的复合材料粉末在真空气氛和表XI所记录的条件下进行烧结以生成陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
表XI
*:比较例
在完成对所得陶瓷复合材料的磨削和精研操作后,使用透射电子显微镜在每一陶瓷复合材料的任意10个位置进行平均晶粒尺寸的测定。随后使用压汞孔隙度仪完成对每一陶瓷复合材料开口气孔率的测定。这些测量的结果列于表XII。
Figure C20048003226000241
Figure C20048003226000251
表X II的结果证明,应用800至1500℃烧结温度和200至5000MPa烧结压力的条件所制造的陶瓷复合材料的平均晶粒尺寸是30nm或更小。当烧结温度超过1600℃时,导致颗粒生长显著增加,由此平均晶粒尺寸变得大于30nm,这意味着陶瓷复合材料表面上精研抛光区域的表面粗糙度不能提供所期望的精度。
根据表X II的结果,很明显,应用上述烧结条件的烧结体的开口气孔率小于1%,这是相当良好的。当开口气孔率大于1%时,如果将陶瓷复合材料用作例如玻璃的成型模具,则玻璃进入气孔区域,引起脱模性能问题和界面上产生毛刺的问题以及其他困难。
实施方案7
在0.1Mpa的氮气气氛下,将作为烧结助剂的2.5wt%Y2O3粉末以及1wt%Al2O3粉末加入至平均颗粒尺寸为0.5μm的市售Si3N4粉末中,并且进一步加入30wt%平均颗粒尺寸为0.5μm的金属Ti粉,之后将平均颗粒尺寸为5μm的石墨粉以表XIII所列比例加入,并将粉末掺混,粉末的混合通过采用Si3N4制球的球磨方法在150G的加速度下进行12小时。
表X III
  试验编号   烧结粉末中加入的石墨量(wt%)
  7-1<sup>*</sup>   1
  7-2   2
  7-3   20
  7-4   40
  7-5   60
  7-6   80
  7-7   98
  7-8<sup>*</sup>   99
*:比较例
所得复合材料粉末通过XRD进行定性分析,其中Si3N4、TiN、TiCN、TiC和C的宽衍射峰能够被确认。此外,复合材料粉末在透射电子显微镜下的观测结果显示,平均颗粒尺寸为30nm或更小。
接着,利用刚才所述的复合材料粉末,通过在真空气氛和1200℃烧结温度、1000MPa烧结压力的条件下烧结该粉末而生成陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
在完成对所获陶瓷复合材料的磨削和精研操作后,进行复合材料平均晶粒尺寸、开口气孔率和抗弯强度的评价。然后为确定对光学玻璃进行模具成型时的脱模性能,使用硅酸硼玻璃(Pyrex)进行评价。在该评价方法中,将本发明的陶瓷复合材料切割成20mm的计量长度,然后表面精研抛光至0.02μm(Ra)的表面粗糙度,并且在720℃成型温度、10MPa成型压力的条件下用作模具对10mm计量长度的前述硅酸硼玻璃(Pyrex)压60秒。进行500次玻璃成型试验,对以下含量作出脱模性能评价。起初,在成型操作完成后,硅酸硼玻璃(Pyrex)在不施加外力的情况下与模具脱离,随后在硅酸硼玻璃(Pyrex)外表面的检测中,这些产品没有碎屑、裂纹或污斑,并且成型后硅酸硼玻璃(Pyrex)的转移表面粗糙度为0.03μm或更小(Ra)被认为是合格的。脱模性能(%)被定义为合格产品数除以成型试验次数所得的百分数。举例来说,如果在500次成型试验中得到50个合格产品,那么脱模性能就是10%。脱模性能评价的结果列于表XIV。
表XIV
试验编号 石墨含量(wt%) 开口气孔率(%) 平均颗粒尺寸(nm) 抗弯强度(MPa)   对硅酸硼玻璃(Pyrex)的脱模性能(%)
  7-1<sup>*</sup>   1   1.4   53   1350   23
  7-2   2   0.4   28   1326   64
  7-3   20   0.2   19   1107   99
  7-4   40   0.1   14   863   100
  7-5   60   0.2   15   620   100
  7-6   80   0.3   15   377   98
  7-7   98   0.6   17   134   96
  7-8<sup>*</sup>   99   未烧结   未烧结   未烧结   未烧结
硅酸硼玻璃(Pyrex)的脱模性能试验:720℃/10MPa压力条件下压60秒;试验次数n=500
表X IV的结果表明,在石墨含量为2至98wt%的陶瓷复合材料中,开口气孔率小于1%且平均晶粒尺寸为30nm或更小。进一步,含有石墨比例20至98wt%的模具样品对于硅酸硼玻璃(Pyrex)的脱模性能是非常优良的,为90%或更高,甚至当样品中所述含量比例为2%时,脱模性能也是60%或更好;由此显示出复合材料可充分用作模具。同时,在石墨含量为1wt%的样品中,脱模性能严重恶化。反之,对于石墨含量高于90wt%的复合材料,其烧结被证明是有问题的;含量为98wt%的,烧结体在数次尝试中有一次是可制造的,但是随着石墨含量超过99wt%,制备烧结体被证明是完全不可能的。
实施方案8
按照表XV所列的配方,通过将40wt%平均颗粒尺寸0.5μm的表XV所示陶瓷粉末(1)、20wt%平均颗粒尺寸0.5μm的陶瓷粉末(2)和平均颗粒尺寸不超过5μm作为余量的碳粉末以及根据需要而添加的烧结助剂共混,并且在150G加速度下使用球磨机混合该共混物12小时而制得掺混粉末。
表X V
  试验编号  陶瓷粉末(1)  陶瓷粉末(2)   碳   烧结助剂
  8-1  SiC  ZrCn   C   1wt%Al<sub>2</sub>O<sub>3</sub>
  8-2  Si<sub>3</sub>N<sub>4</sub>  TiCN   GC   2.5wt%Y<sub>2</sub>O<sub>3</sub>+1wt%Al<sub>2</sub>O<sub>3</sub>
  8-3  AlN  CrN   C   0.6wt%Y<sub>2</sub>O<sub>3</sub>
  8-4  Al<sub>2</sub>O<sub>3</sub>  MoO<sub>2</sub>   C   -
  8-5  3Y-ZrO<sub>2</sub>  WC   GC   -
8-6 SiC VN GC 1wt%Al<sub>2</sub>O<sub>3</sub>
  8-7  Si<sub>3</sub>N<sub>4</sub>  TiCO   C   2.5wt%Y<sub>2</sub>O<sub>3</sub>+1wt%Al<sub>2</sub>O<sub>3</sub>
  8-8  尖晶石  NbHfC   C<sub>60</sub>   0.6wt%Y<sub>2</sub>O<sub>3</sub>
  8-9  β-SiAlON  TaNbC   CNT   -
  8-10  莫来石  TaNbN   炭黑   -
  8-11  Si<sub>3</sub>N<sub>4</sub>  TiCN   CNF   -
所得复合材料粉末在透射电子显微镜下的观测结果显示,平均颗粒尺寸为30nm或更小。
接着,利用刚才所述的复合材料粉末,通过在真空气氛和1200℃烧结温度、1000MPa烧结压力的条件下烧结该粉末而生成陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
在完成对所得陶瓷复合材料的磨削和精研操作后,进行复合材料开口气孔率、平均颗粒尺寸和抗弯强度的评价。然后,为了确定对Pyrex光学玻璃进行模具成型时的脱模性,在720℃、10MPa条件下压按硅酸硼玻璃(Pyrex)后,以与实施方案7同样的方式进行500次成型试验,评价脱模性能的情况。评价的结果列于表XVI。
表XVI
  试验编号   开口气孔率(%)   平均颗粒尺寸(μm)   抗弯强度(MPa)  对硅酸硼玻璃(Pyrex)的脱模性能(%)<sup>*</sup>
  8-1   0.2   15   514  100
  8-2   0.1   14   860  100
  8-3   0.2   16   508  100
  8-4   0.1   20   341  100
  8-5   0.1   14   815  100
  8-6   0.1   13   508  100
8-7 0.1 16 860 100
  8-8   0.2   15   61  100
  8-9   0.2   21   547  100
  8-10   0.1   18   39  100
  8-11   0.2   20   800  100
*:720℃/10MPa压力条件下压60秒
试验次数n=500
实施方案9
利用平均颗粒尺寸为0.5μm的表XVII所示陶瓷粉末,并使余量为平均颗粒尺寸5μm或更小的碳粉末,且根据需要在该共混物中加入烧结助剂,由此按照表X VII所列的共混物配方,在150G的加速度下使用球磨机混合该共混物12小时而制得掺混粉末。
所得复合材料粉末在透射电子显微镜下的观测结果显示,平均晶粒尺寸为30nm或更小。
表X VII
Figure C20048003226000311
*)3Y-ZrO2:以3wt% Y2O3稳定的ZrO2
Figure C20048003226000312
Figure C20048003226000313
:比较例
接着,通过在1200℃烧结温度、1000MPa烧结压力的条件下烧结上述粉末掺混物而生成陶瓷复合材料,烧结时陶瓷粉末分别为Si3N4和AlN的样品处于N2气气氛下,陶瓷粉末分别为SiC、Al2O3和3Y-ZrO2的样品处于Ar气气氛下(以3wt%Y2O3稳定的ZrO2)。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
在完成对所得陶瓷复合材料的磨削和精研操作后,进行复合材料开口气孔率、平均颗粒尺寸和抗弯强度的评价。然后,为了确定对光学玻璃进行模具成型时的转印精度和脱模性能,使用硅酸硼玻璃(Pyrex)以与实施方案7同样的方式进行500次成型试验来完成评价。评价和试验的结果列于表X VIII。
表X VIII
Figure C20048003226000321
*比较例
Figure C20048003226000322
*比较例
Figure C20048003226000331
*比较例
Figure C20048003226000332
*比较例
硅酸硼玻璃(Pyrex)的脱模性能试验:720℃/10MPa压力条件下压60秒
实施方案10
在0.1Mpa的氮气气氛下,将作为烧结助剂的2.5wt% Y2O3粉末以及1wt% Al2O3粉末加入至平均颗粒尺寸为0.5μm的市售SiC粉末中,并进一步加入20wt%平均颗粒尺寸为3μm的金属CrN粉和40wt%平均颗粒尺寸为5μm的石墨粉,粉末的混合通过使用SiC制球的球磨方法在150G的加速度下进行12小时。
所得复合材料粉末通过XRD进行定性分析,其中SiC、CrN、CrCN、CrC和C的宽衍射峰能够被确认。此外,复合材料粉末在透射电子显微镜下的观测结果显示,平均晶粒尺寸为30nm或更小。
接着,将刚才所述的复合材料粉末在真空气氛和表X IX所记录的条件下进行烧结以生成陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
表X IX
Figure C20048003226000341
在完成对所得陶瓷复合材料的磨削和精研操作后,为了确定对Pyrex光学玻璃进行模具成型时的脱模性,在720℃、10MPa条件下压按硅酸硼玻璃(Pyrex)后,以与实施方案7同样的方式进行500次成型试验,评价脱模性能的情况。评价的结果列于表XX。
表XX
Figure C20048003226000351
*:比较例
硅酸硼玻璃(Pyrex)的脱模性能试验:720℃/10MPa压力条件下压60秒;试验次数n=500
表XX的结果证明,应用800至1500℃烧结温度和200MPa或更高烧结压力的条件所制造的烧结体与硅酸硼玻璃(Pyrex)之间的脱模性能是优良的。然而,当烧结温度为1600℃时,晶粒生长显著以至于脱模性能明显恶化。同时,在烧结温度为600℃的样品中,尽管烧结压力为1000MPa或更高的那些样品显示出脱模性能,但对应用低于该水平的烧结压力而得到的烧结体,模具经不起成型时的加压力而解体。最后,400℃的烧结温度被证明会抑制烧结体的生成。
实施方案11
在0.1Mpa的氮气气氛下,将平均颗粒尺寸为5μm的石墨粉以表XXI所列比例加入至平均颗粒尺寸为0.5μm的市售SiC粉末中,不加烧结助剂,各粉末的混合通过使用Si3N4制球的球磨方法在150G的加速度下进行12小时。
表XX I
  陶瓷(SiC)(重量份)   石墨(重量份)
  99   1
  98   2
  90   10
  80   20
  60   40
  40   60
  20   80
  10   90
  2   98
  1   99
将所得复合材料粉末通过XRD进行定性分析,其中SiC和C的宽衍射峰能够被确认。此外,复合材料粉末在透射电子显微镜下的观测结果显示,平均颗粒尺寸为30nm或更小。
接着,利用刚才所述的复合材料粉末,通过在真空气氛和1200℃烧结温度、1000MPa烧结压力的条件下烧结该粉末而生成陶瓷复合材料。复合材料制造中的温度是通过使用红外光学高温计测量成型模具表面温度而测定。
以采用所得陶瓷复合材料的模具对ZnS陶瓷进行烧结-成型时,为了确定脱模性能,使用市售ZnS粉末进行评价。在评价方法中,将本发明的陶瓷复合材料切割成20mm的计量长度,然后表面精研抛光至0.02μm(Ra)的表面粗糙度,并且在1000℃烧结温度、50MPa成型压力的条件下用作模具来压按20mm计量长度的前述ZnS陶瓷。进行100次成型试验,对以下含量作出脱模性能评价。起初,在成型操作完成后,ZnS陶瓷在不施加外力的情况下与模具脱离,随后在这些成型后的ZnS陶瓷产品上没有碎屑、裂纹或污染,并且成型后ZnS陶瓷的转移表面粗糙度为0.03μm或更小(Ra)被认为是合格的。脱模性能(%)被定义为合格的产品数除以成型试验次数所得的百分数。举例来说,如果在100次成型试验中得到50个合格产品,那么脱模性能就是50%。脱模性能评价的结果列于表XXII。
表XXII
Figure C20048003226000371
*模具在第68次试验中破裂
烧结条件:1200℃;1000MPa
产业适用性
由于本发明中的陶瓷复合材料具有出众的耐磨和低摩擦性能,还对玻璃、树脂和陶瓷以及其他材料有着优良的脱模性能,所以该复合材料用作切削工具、滑动部件和成型模具材料是极好的。

Claims (16)

1.陶瓷复合材料,其特征在于由含有平均晶粒尺寸为3μm或更小的碳作为主组分的相以及排除碳的陶瓷相构成,其中所述含有碳作为主组分的相的含量为20重量%~98重量%。
2.陶瓷复合材料,其特征在于由含有平均晶粒尺寸为30nm或更小的碳作为主组分的相以及排除碳的陶瓷相构成,其中所述含有碳作为主组分的相的含量为20重量%~98重量%。
3.如权利要求1所述的陶瓷复合材料,其特征在于由含有平均晶粒尺寸为3μm或更小的碳作为主组分的相以及排除碳的陶瓷相构成,其中,所述陶瓷相由选自由Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种构成。
4.如权利要求2所述的陶瓷复合材料,其特征在于由含有平均晶粒尺寸为30nm或更小的碳作为主组分的相以及排除碳的陶瓷相构成,其中,所述陶瓷相由选自由Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种构成。
5.如权利要求1或3所述的陶瓷复合材料,其特征在于由含有平均晶粒尺寸为3μm或更小的碳作为主组分的相以及排除碳的陶瓷相构成,其中,所述含有碳作为主组分的相的含量为20重量%~98重量%,并且所述陶瓷相由选自由Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种构成。
6.如权利要求2或4所述的陶瓷复合材料,其特征在于由含有平均晶粒尺寸为30nm或更小的碳作为主组分的相以及排除碳的陶瓷相构成,其中,所述含有碳作为主组分的相的含量为20重量%~98重量%,并且所述陶瓷相由选自由Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种构成。
7.如权利要求1至3任一项所述的陶瓷复合材料,其特征在于抛光之后复合材料表面的开口气孔率为1%或更小。
8.如权利要求1至4任一项所述的陶瓷复合材料,其特征在于烧结形式的复合材料的维氏硬度为10GPa或更高。
9.如权利要求1、3、5、7和8任一项所述的由含有平均晶粒尺寸为3μm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的制造方法,其特征在于将平均晶粒尺寸为3μm或更小的排除碳的陶瓷粉末与碳粉末的混合粉末进行成型,并将获得的成型体在非氧化性气氛中于800至1500℃的烧结温度和200MPa或更高的烧结压力下进行烧结,其中所述碳粉末的含量为20重量%~98重量%。
10.如权利要求1、3、5、7~9任一项所述的由含有平均晶粒尺寸为3μm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的制造方法,其特征在于将平均晶粒尺寸为3μm或更小的排除碳的陶瓷粉末与碳粉末的混合粉末进行成型,并将获得的成型体在非氧化性气氛中于800至1500℃的烧结温度和200MPa或更高的烧结压力下进行烧结,其中所述陶瓷粉末由选自由Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种构成。
11.如权利要求1、3、5、7~10任一项所述的由含有平均晶粒尺寸为3μm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的制造方法,其征在于将平均晶粒尺寸为3μm或更小的排除碳的陶瓷粉末与碳粉末的混合粉末进行成型,并将获得的成型体在非氧化性气氛中于800至1500℃的烧结温度和200MPa或更高的烧结压力下进行烧结,其中,所述碳粉末的含量为20重量%~98重量%,所述陶瓷粉末由选自由Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种构成。
12.如权利要求9~11任一项所述的由含有平均晶粒尺寸为3μm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的制造方法,其特征在于混合粉末进一步包括选自Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的至少一种金属。
13.如权利要求2、4、6~8任一项所述的由含有平均晶粒尺寸为30nm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的制造方法,其特征在于将平均晶粒尺寸为30nm或更小的排除碳的陶瓷粉末与碳粉末的混合粉末进行成型,并将获得的成型体在非氧化性气氛中于800至1500℃的烧结温度和200MPa或更高的烧结压力下进行烧结,其中所述碳粉末的含量为20重量%~98重量%。
14.如权利要求2、4、6~9、13任一项所述的由含有平均晶粒尺寸为30nm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的制造方法,其特征在于将平均晶粒尺寸为30nm或更小的排除碳的陶瓷粉末与碳粉末的混合粉末进行成型,并将获得的成型体在非氧化性气氛中于800至1500℃的烧结温度和200MPa或更高的烧结压力下进行烧结,其中所述陶瓷粉末由选自由Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种构成。
15.如权利要求2、4、6~9、13~14任一项所述的由含有平均晶粒尺寸为30nm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的制造方法,其特征在于将平均晶粒尺寸为30nm或更小的排除碳的陶瓷粉末与碳粉末的混合粉末进行成型,并将获得的成型体在非氧化性气氛中于800至1500℃的烧结温度和200MPa或更高的烧结压力下进行烧结,其中所述碳粉末的含量为20重量%~98重量%,所述陶瓷粉末由选自由Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的氮化物、碳化物、氧化物、复合氮化物、复合碳化物、复合氧化物、碳氮化物、氧氮化物、碳氮氧化物和碳氧化物组成的组中的至少一种构成。
16.如权利要求9~11任一项所述的由含有平均晶粒尺寸为30nm或更小的碳作为主组分的相以及陶瓷相构成的陶瓷复合材料的制造方法,其特征在于混合粉末进一步包括选自Al、Si、Zr、Hf、V、Nb、Ta、Cr、Mo和W的至少一种金属。
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