CN100424899C - MOCVD法超低温制备高电导率、绒面未掺杂ZnO薄膜 - Google Patents
MOCVD法超低温制备高电导率、绒面未掺杂ZnO薄膜 Download PDFInfo
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- CN100424899C CN100424899C CNB2006100162514A CN200610016251A CN100424899C CN 100424899 C CN100424899 C CN 100424899C CN B2006100162514 A CNB2006100162514 A CN B2006100162514A CN 200610016251 A CN200610016251 A CN 200610016251A CN 100424899 C CN100424899 C CN 100424899C
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 title abstract 4
- 239000011521 glass Substances 0.000 claims abstract description 7
- 230000001939 inductive effect Effects 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 51
- 239000010409 thin film Substances 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 230000012010 growth Effects 0.000 claims description 11
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 5
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
- 238000005566 electron beam evaporation Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000000376 reactant Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 8
- 230000008020 evaporation Effects 0.000 abstract description 2
- 238000001704 evaporation Methods 0.000 abstract description 2
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 4
- 238000000149 argon plasma sintering Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000004549 pulsed laser deposition Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2006100162514A CN100424899C (zh) | 2006-10-24 | 2006-10-24 | MOCVD法超低温制备高电导率、绒面未掺杂ZnO薄膜 |
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CNB2006100162514A CN100424899C (zh) | 2006-10-24 | 2006-10-24 | MOCVD法超低温制备高电导率、绒面未掺杂ZnO薄膜 |
Publications (2)
Publication Number | Publication Date |
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CN1945858A CN1945858A (zh) | 2007-04-11 |
CN100424899C true CN100424899C (zh) | 2008-10-08 |
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CNB2006100162514A Expired - Fee Related CN100424899C (zh) | 2006-10-24 | 2006-10-24 | MOCVD法超低温制备高电导率、绒面未掺杂ZnO薄膜 |
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CN (1) | CN100424899C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160192480A1 (en) * | 2014-12-30 | 2016-06-30 | Clemson University Research Foundation | Electronic device including transparent and flexible mica substrate and method for manufacturing the same |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100494486C (zh) * | 2007-05-08 | 2009-06-03 | 中国科学院上海光学精密机械研究所 | 金属有机化学气相沉积生长m面或a面ZnO薄膜的方法 |
KR100870837B1 (ko) * | 2008-03-04 | 2008-11-28 | 한국철강 주식회사 | 산화아연 박막의 수분 제거 방법 |
CN105349966A (zh) * | 2015-10-15 | 2016-02-24 | 南开大学 | 一种绒面复合结构ZnO-TCO薄膜的制备方法及应用 |
CN106968015B (zh) * | 2016-08-17 | 2019-08-06 | 佛山市中山大学研究院 | 一种紫外透明导电薄膜及其制造方法 |
CN114032525B (zh) * | 2021-11-04 | 2023-09-12 | 西南科技大学 | 金刚石-多层石墨烯复合阴极材料及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283430A (ja) * | 1994-04-12 | 1995-10-27 | Matsushita Electric Ind Co Ltd | 太陽電池の製造方法 |
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2006
- 2006-10-24 CN CNB2006100162514A patent/CN100424899C/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283430A (ja) * | 1994-04-12 | 1995-10-27 | Matsushita Electric Ind Co Ltd | 太陽電池の製造方法 |
Non-Patent Citations (6)
Title |
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Aqueous Solution Route to High-Aspect-Ratio Zinc OxideNanostructures on Indium Tin Oxide Substrates. Chen-Hao Ku, Jih-Jen Wu.Journal of Physical Chemistry B,Vol.110 No.26. 2006 |
Aqueous Solution Route to High-Aspect-Ratio Zinc OxideNanostructures on Indium Tin Oxide Substrates. Chen-Hao Ku, Jih-Jen Wu.Journal of Physical Chemistry B,Vol.110 No.26. 2006 * |
MOCVD制备的ZnO薄膜及其在太阳电池背电极应用. 陈新亮,徐步衡,薛俊明,赵颖,张晓丹,耿新华.半导体学报,第26卷第12期. 2005 |
MOCVD制备的ZnO薄膜及其在太阳电池背电极应用. 陈新亮,徐步衡,薛俊明,赵颖,张晓丹,耿新华.半导体学报,第26卷第12期. 2005 * |
Zinc oxide phosphors synthesized bycathodicelectrodeposition. Yanwei,Huang,Ning,Yao,Binglin,Zhang.2006 19th international Vacuum Nanoelectronics Conference and 50th international Field Emission Symposium(IEEE Cat.No.06TH8886). 2006 |
Zinc oxide phosphors synthesized bycathodicelectrodeposition. Yanwei,Huang,Ning,Yao,Binglin,Zhang.2006 19th international Vacuum Nanoelectronics Conference and 50th international Field Emission Symposium(IEEE Cat.No.06TH8886). 2006 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160192480A1 (en) * | 2014-12-30 | 2016-06-30 | Clemson University Research Foundation | Electronic device including transparent and flexible mica substrate and method for manufacturing the same |
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CN1945858A (zh) | 2007-04-11 |
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Effective date of registration: 20090206 Address after: Jiangnan hi tech Zone, South Ring Road, Licheng District, Quanzhou, Fujian Patentee after: Fujian Golden Sun Solar Technic Co., Ltd. Address before: Nankai District Wei Jin Road, Tianjin City No. 94 Patentee before: Nankai University |
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Effective date of registration: 20111121 Address after: 362000 Jiangnan hi tech Zone, South Ring Road, Licheng District, Fujian, Quanzhou Co-patentee after: Beijing Jingcheng Boyang Optoelectronic Equipment Co.,Ltd. Patentee after: Fujian Golden Sun Solar Technic Co., Ltd. Address before: 362000 Jiangnan hi tech Zone, South Ring Road, Licheng District, Fujian, Quanzhou Patentee before: Fujian Golden Sun Solar Technic Co., Ltd. |
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