CN100420357C - 接合构件的加工尺寸决定方法及装置 - Google Patents

接合构件的加工尺寸决定方法及装置 Download PDF

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Publication number
CN100420357C
CN100420357C CNB031458483A CN03145848A CN100420357C CN 100420357 C CN100420357 C CN 100420357C CN B031458483 A CNB031458483 A CN B031458483A CN 03145848 A CN03145848 A CN 03145848A CN 100420357 C CN100420357 C CN 100420357C
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CN
China
Prior art keywords
size
conductive film
bonding
anisotropic conductive
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031458483A
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English (en)
Chinese (zh)
Other versions
CN1482850A (zh
Inventor
山本章博
小林荣
江口信三
村田和弘
吉田浩一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1482850A publication Critical patent/CN1482850A/zh
Application granted granted Critical
Publication of CN100420357C publication Critical patent/CN100420357C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CNB031458483A 2002-07-10 2003-07-10 接合构件的加工尺寸决定方法及装置 Expired - Fee Related CN100420357C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002-200971 2002-07-10
JP2002200971 2002-07-10
JP2002200971 2002-07-10
JP2003192147 2003-07-04
JP2003-192147 2003-07-04
JP2003192147A JP4137725B2 (ja) 2002-07-10 2003-07-04 接合部材の加工寸法決定方法および装置

Publications (2)

Publication Number Publication Date
CN1482850A CN1482850A (zh) 2004-03-17
CN100420357C true CN100420357C (zh) 2008-09-17

Family

ID=32072147

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031458483A Expired - Fee Related CN100420357C (zh) 2002-07-10 2003-07-10 接合构件的加工尺寸决定方法及装置

Country Status (3)

Country Link
US (2) US6889738B2 (enExample)
JP (1) JP4137725B2 (enExample)
CN (1) CN100420357C (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040261930A1 (en) * 2003-03-04 2004-12-30 Shibaura Mechatronics Corporation Method of bonding substrates and apparatus for bonding substrates
KR100589412B1 (ko) * 2003-11-29 2006-06-14 삼성에스디아이 주식회사 플라즈마 디스플레이 패널 및 그 제조 방법
US20050134557A1 (en) * 2003-12-19 2005-06-23 Xu-Wen Feng ACF assembly apparatus and method
JP4119401B2 (ja) * 2004-05-28 2008-07-16 Ｔｄｋ株式会社 磁気ヘッド微動アクチュエータの接着方法
KR100703532B1 (ko) * 2005-09-09 2007-04-03 삼성에스디아이 주식회사 기판 합착장치 및 이를 이용한 기판 합착방법
US20070102092A1 (en) * 2005-11-10 2007-05-10 International Business Machines Corporation Method for manufacturing multilayer flexible circuits
JP2009294645A (ja) * 2008-05-07 2009-12-17 Nitto Denko Corp 光学表示装置製造システムに適用される製造管理システム及び製造管理方法
US20120202300A1 (en) * 2011-02-03 2012-08-09 Texas Instruments Incorporated Die bonder including automatic bond line thickness measurement
JP2013011800A (ja) * 2011-06-30 2013-01-17 Fujifilm Corp パターン位相差フィルム、その製造方法、光学積層体の製造方法、及び３ｄ画像表示装置
TWI491333B (zh) * 2014-04-17 2015-07-01 Chipmos Technologies Inc 薄膜封裝結構
JP6443715B2 (ja) * 2014-04-24 2018-12-26 日本電産リード株式会社 基板検査治具設計方法
JP6382055B2 (ja) * 2014-10-07 2018-08-29 東京エレクトロン株式会社 被処理体を処理する方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08107268A (ja) * 1994-10-06 1996-04-23 Matsushita Electric Ind Co Ltd 異方性導電テープの貼着装置及び異方性導電テープの貼着方法
US5711989A (en) * 1992-11-19 1998-01-27 Nordson Corporation Computer controlled method for dispensing viscous fluid
US6023666A (en) * 1998-07-20 2000-02-08 Micron Technology, Inc. In-line method of monitoring die attach material adhesive weight

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3622665B2 (ja) * 1999-12-10 2005-02-23 セイコーエプソン株式会社 接続構造、電気光学装置および電子機器
JP3645511B2 (ja) * 2001-10-09 2005-05-11 株式会社ルネサステクノロジ 半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5711989A (en) * 1992-11-19 1998-01-27 Nordson Corporation Computer controlled method for dispensing viscous fluid
JPH08107268A (ja) * 1994-10-06 1996-04-23 Matsushita Electric Ind Co Ltd 異方性導電テープの貼着装置及び異方性導電テープの貼着方法
US6023666A (en) * 1998-07-20 2000-02-08 Micron Technology, Inc. In-line method of monitoring die attach material adhesive weight

Also Published As

Publication number Publication date
US20050098254A1 (en) 2005-05-12
JP2004096087A (ja) 2004-03-25
US7195682B2 (en) 2007-03-27
CN1482850A (zh) 2004-03-17
US20040069397A1 (en) 2004-04-15
JP4137725B2 (ja) 2008-08-20
US6889738B2 (en) 2005-05-10

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080917

Termination date: 20120710