CN100371763C - 一种投影显示器及用于投影显示器的封装微镜片阵列 - Google Patents
一种投影显示器及用于投影显示器的封装微镜片阵列 Download PDFInfo
- Publication number
- CN100371763C CN100371763C CNB2004100546591A CN200410054659A CN100371763C CN 100371763 C CN100371763 C CN 100371763C CN B2004100546591 A CNB2004100546591 A CN B2004100546591A CN 200410054659 A CN200410054659 A CN 200410054659A CN 100371763 C CN100371763 C CN 100371763C
- Authority
- CN
- China
- Prior art keywords
- micromirror
- projection display
- array
- packaged
- micromirror array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005538 encapsulation Methods 0.000 title claims description 70
- 239000000758 substrate Substances 0.000 claims description 176
- 230000003287 optical effect Effects 0.000 claims description 97
- 239000000463 material Substances 0.000 claims description 86
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 229910052782 aluminium Inorganic materials 0.000 claims description 23
- 239000004411 aluminium Substances 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 239000002516 radical scavenger Substances 0.000 claims description 10
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 9
- 239000010453 quartz Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 150000004767 nitrides Chemical class 0.000 claims description 6
- 230000003068 static effect Effects 0.000 claims description 6
- 238000000149 argon plasma sintering Methods 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 4
- 239000003153 chemical reaction reagent Substances 0.000 claims 1
- 239000003086 colorant Substances 0.000 claims 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical group [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims 1
- 238000001914 filtration Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 238000012797 qualification Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 165
- 238000000034 method Methods 0.000 description 39
- 238000005530 etching Methods 0.000 description 27
- 229920002120 photoresistant polymer Polymers 0.000 description 27
- 238000000151 deposition Methods 0.000 description 20
- 230000008021 deposition Effects 0.000 description 16
- 229910052581 Si3N4 Inorganic materials 0.000 description 15
- 239000007789 gas Substances 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 15
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 13
- 239000000460 chlorine Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 235000012239 silicon dioxide Nutrition 0.000 description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 229910021417 amorphous silicon Inorganic materials 0.000 description 8
- 238000000926 separation method Methods 0.000 description 8
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 7
- 229910052801 chlorine Inorganic materials 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 7
- IGELFKKMDLGCJO-UHFFFAOYSA-N xenon difluoride Chemical compound F[Xe]F IGELFKKMDLGCJO-UHFFFAOYSA-N 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920005591 polysilicon Polymers 0.000 description 6
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 229910052723 transition metal Inorganic materials 0.000 description 5
- 150000003624 transition metals Chemical class 0.000 description 5
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 229910015844 BCl3 Inorganic materials 0.000 description 4
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 4
- 238000004380 ashing Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 230000003760 hair shine Effects 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910018125 Al-Si Inorganic materials 0.000 description 2
- 229910017150 AlTi Inorganic materials 0.000 description 2
- 229910018182 Al—Cu Inorganic materials 0.000 description 2
- 229910018520 Al—Si Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910007991 Si-N Inorganic materials 0.000 description 2
- 229910006294 Si—N Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 229910002109 metal ceramic alloy Inorganic materials 0.000 description 2
- 239000000078 metal ceramic alloy Substances 0.000 description 2
- XZWYZXLIPXDOLR-UHFFFAOYSA-N metformin Chemical compound CN(C)C(=N)NC(N)=N XZWYZXLIPXDOLR-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- BLIQUJLAJXRXSG-UHFFFAOYSA-N 1-benzyl-3-(trifluoromethyl)pyrrolidin-1-ium-3-carboxylate Chemical compound C1C(C(=O)O)(C(F)(F)F)CCN1CC1=CC=CC=C1 BLIQUJLAJXRXSG-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 102000052666 B-Cell Lymphoma 3 Human genes 0.000 description 1
- 108700009171 B-Cell Lymphoma 3 Proteins 0.000 description 1
- 101150072667 Bcl3 gene Proteins 0.000 description 1
- 229910014263 BrF3 Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 244000283207 Indigofera tinctoria Species 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000592274 Polypodium vulgare Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910004166 TaN Inorganic materials 0.000 description 1
- 244000078912 Trichosanthes cucumerina Species 0.000 description 1
- 235000008322 Trichosanthes cucumerina Nutrition 0.000 description 1
- TZHYBRCGYCPGBQ-UHFFFAOYSA-N [B].[N] Chemical compound [B].[N] TZHYBRCGYCPGBQ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- VQYHBXLHGKQYOY-UHFFFAOYSA-N aluminum oxygen(2-) titanium(4+) Chemical compound [O-2].[Al+3].[Ti+4] VQYHBXLHGKQYOY-UHFFFAOYSA-N 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- RWRIWBAIICGTTQ-UHFFFAOYSA-N difluoromethane Chemical compound FCF RWRIWBAIICGTTQ-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 210000001525 retina Anatomy 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- FQFKTKUFHWNTBN-UHFFFAOYSA-N trifluoro-$l^{3}-bromane Chemical compound FBr(F)F FQFKTKUFHWNTBN-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/28—Reflectors in projection beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/74—Projection arrangements for image reproduction, e.g. using eidophor
- H04N5/7416—Projection arrangements for image reproduction, e.g. using eidophor involving the use of a spatial light modulator, e.g. a light valve, controlled by a video signal
- H04N5/7458—Projection arrangements for image reproduction, e.g. using eidophor involving the use of a spatial light modulator, e.g. a light valve, controlled by a video signal the modulator being an array of deformable mirrors, e.g. digital micromirror device [DMD]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0369—Static structures characterized by their profile
- B81B2203/0384—Static structures characterized by their profile sloped profile
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Projection Apparatus (AREA)
- Micromachines (AREA)
- Transforming Electric Information Into Light Information (AREA)
- Led Device Packages (AREA)
- Prostheses (AREA)
- Hybrid Cells (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/631,536 | 2000-08-03 | ||
| US09/631,536 US6529310B1 (en) | 1998-09-24 | 2000-08-03 | Deflectable spatial light modulator having superimposed hinge and deflectable element |
| US22924600P | 2000-08-30 | 2000-08-30 | |
| US60/229,246 | 2000-08-30 | ||
| US09/732,445 US6523961B2 (en) | 2000-08-30 | 2000-12-07 | Projection system and mirror elements for improved contrast ratio in spatial light modulators |
| US09/732,445 | 2000-12-07 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB018136087A Division CN100392467C (zh) | 2000-08-03 | 2001-08-03 | 将图像投射到目标物上的方法和系统 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1567020A CN1567020A (zh) | 2005-01-19 |
| CN100371763C true CN100371763C (zh) | 2008-02-27 |
Family
ID=27397927
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100546591A Expired - Fee Related CN100371763C (zh) | 2000-08-03 | 2001-08-03 | 一种投影显示器及用于投影显示器的封装微镜片阵列 |
| CNB2004100546572A Expired - Fee Related CN100412602C (zh) | 2000-08-03 | 2001-08-03 | 一种具有微镜片阵列的小片 |
| CNB2004100546604A Expired - Fee Related CN100412604C (zh) | 2000-08-03 | 2001-08-03 | 一种用于投影电视的微镜片阵列 |
| CNB018136087A Expired - Fee Related CN100392467C (zh) | 2000-08-03 | 2001-08-03 | 将图像投射到目标物上的方法和系统 |
| CNB2004100546587A Expired - Fee Related CN100412603C (zh) | 2000-08-03 | 2001-08-03 | 一种具有改进的微镜片阵列的投影电视 |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100546572A Expired - Fee Related CN100412602C (zh) | 2000-08-03 | 2001-08-03 | 一种具有微镜片阵列的小片 |
| CNB2004100546604A Expired - Fee Related CN100412604C (zh) | 2000-08-03 | 2001-08-03 | 一种用于投影电视的微镜片阵列 |
| CNB018136087A Expired - Fee Related CN100392467C (zh) | 2000-08-03 | 2001-08-03 | 将图像投射到目标物上的方法和系统 |
| CNB2004100546587A Expired - Fee Related CN100412603C (zh) | 2000-08-03 | 2001-08-03 | 一种具有改进的微镜片阵列的投影电视 |
Country Status (8)
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6969635B2 (en) | 2000-12-07 | 2005-11-29 | Reflectivity, Inc. | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| US7300162B2 (en) | 2000-08-30 | 2007-11-27 | Texas Instruments Incorporated | Projection display |
| US7307775B2 (en) * | 2000-12-07 | 2007-12-11 | Texas Instruments Incorporated | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| US7023606B2 (en) | 2001-08-03 | 2006-04-04 | Reflectivity, Inc | Micromirror array for projection TV |
| SG111972A1 (en) * | 2002-10-17 | 2005-06-29 | Agency Science Tech & Res | Wafer-level package for micro-electro-mechanical systems |
| US7042622B2 (en) | 2003-10-30 | 2006-05-09 | Reflectivity, Inc | Micromirror and post arrangements on substrates |
| US7397517B2 (en) * | 2003-05-30 | 2008-07-08 | Kazuhiro Ohara | Display system and signal processing using diamond-shaped DMDs |
| US6871958B2 (en) | 2003-08-18 | 2005-03-29 | Evans & Sutherland Computer Corporation | Wide angle scanner for panoramic display |
| US7012669B2 (en) | 2003-08-18 | 2006-03-14 | Evans & Sutherland Computer Corporation | Reflection barrier for panoramic display |
| US7334902B2 (en) | 2003-08-18 | 2008-02-26 | Evans & Sutherland Computer Corporation | Wide angle scanner for panoramic display |
| US6861277B1 (en) * | 2003-10-02 | 2005-03-01 | Hewlett-Packard Development Company, L.P. | Method of forming MEMS device |
| US6995830B2 (en) * | 2003-12-22 | 2006-02-07 | Asml Netherlands B.V. | Lithographic projection apparatus and device manufacturing method |
| US7057794B2 (en) * | 2004-05-19 | 2006-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Micromirror for MEMS device |
| US7273693B2 (en) * | 2004-07-30 | 2007-09-25 | Hewlett-Packard Development Company, L.P. | Method for forming a planar mirror using a sacrificial oxide |
| US7038831B2 (en) * | 2004-09-30 | 2006-05-02 | Lucent Technologies, Inc. | Micromirror apparatus with improved in-plane rotation tolerance |
| KR100815358B1 (ko) * | 2004-10-08 | 2008-03-19 | 삼성전기주식회사 | 경사진 광투과성 덮개를 가진 광변조기 패키지 |
| JP4568579B2 (ja) | 2004-10-29 | 2010-10-27 | 富士通株式会社 | 光スイッチ |
| IL165212A (en) | 2004-11-15 | 2012-05-31 | Elbit Systems Electro Optics Elop Ltd | Device for scanning light |
| US7372617B2 (en) * | 2005-07-06 | 2008-05-13 | Peter Enoksson | Hidden hinge MEMS device |
| GB2453104B (en) | 2007-09-19 | 2012-04-25 | Wolfson Microelectronics Plc | Mems device and process |
| US11157977B1 (en) | 2007-10-26 | 2021-10-26 | Zazzle Inc. | Sales system using apparel modeling system and method |
| TWI418850B (zh) | 2007-11-09 | 2013-12-11 | 尼康股份有限公司 | 微致動器、光學設備、顯示裝置、曝光裝置及設備製造方法 |
| JP2009233836A (ja) * | 2008-03-28 | 2009-10-15 | Yamaha Corp | Ｍｅｍｓおよびｍｅｍｓ製造方法 |
| DE102008001038B4 (de) | 2008-04-08 | 2016-08-11 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit Schrägstruktur und entsprechendes Herstellungsverfahren |
| US8537446B2 (en) * | 2008-04-08 | 2013-09-17 | Cornell University | Multi-axis, large tilt angle, wafer level micromirror array for large scale beam steering applications |
| US8096182B2 (en) * | 2008-05-29 | 2012-01-17 | Freescale Semiconductor, Inc. | Capacitive sensor with stress relief that compensates for package stress |
| JP5151756B2 (ja) * | 2008-07-16 | 2013-02-27 | 株式会社豊田中央研究所 | 光学装置 |
| US10719862B2 (en) | 2008-07-29 | 2020-07-21 | Zazzle Inc. | System and method for intake of manufacturing patterns and applying them to the automated production of interactive, customizable product |
| EP2454636B1 (en) * | 2009-07-17 | 2013-06-05 | Carl Zeiss SMT GmbH | Microlithographic projection exposure apparatus and method of measuring a parameter related to an optical surface contained therein |
| KR101912092B1 (ko) | 2010-10-05 | 2018-10-26 | 삼성전자 주식회사 | 액체 렌즈 |
| KR101912093B1 (ko) * | 2010-10-29 | 2018-10-26 | 삼성전자 주식회사 | 광학 장치 |
| CN102087414B (zh) * | 2010-11-03 | 2012-12-26 | 凝辉(天津)科技有限责任公司 | 一种阵列式分区投影方法 |
| CN102683474B (zh) * | 2011-03-18 | 2014-11-05 | 浙江大立科技股份有限公司 | 一种基于复合牺牲层的红外探测器制作方法 |
| US9641826B1 (en) | 2011-10-06 | 2017-05-02 | Evans & Sutherland Computer Corporation | System and method for displaying distant 3-D stereo on a dome surface |
| US10969743B2 (en) | 2011-12-29 | 2021-04-06 | Zazzle Inc. | System and method for the efficient recording of large aperture wave fronts of visible and near visible light |
| KR101653117B1 (ko) | 2012-07-26 | 2016-08-31 | 애플 인크. | 이중 축 주사 미러 |
| US9110354B2 (en) * | 2012-09-20 | 2015-08-18 | Palo Alto Research Center Incorporated | Steerable illumination source for a compact camera |
| KR20150063540A (ko) * | 2012-10-23 | 2015-06-09 | 애플 인크. | 마이크로 기계 디바이스의 제조 |
| DE102013213842A1 (de) * | 2013-07-16 | 2015-01-22 | Carl Zeiss Smt Gmbh | Optisches Bauelement |
| DE102013217269A1 (de) * | 2013-08-29 | 2015-03-05 | Carl Zeiss Smt Gmbh | Mikrospiegel-Array |
| CN103777450A (zh) * | 2014-01-06 | 2014-05-07 | 吴震 | 发光装置、投影显示装置和发光系统 |
| CN103777445B (zh) * | 2014-01-06 | 2018-12-25 | 杨毅 | 投影显示装置 |
| JP2016029430A (ja) * | 2014-07-25 | 2016-03-03 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
| DE102015200626B3 (de) | 2015-01-16 | 2016-07-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS Aktuator, System mit einer Mehrzahl vom MEMS Aktuatoren und Verfahren zum Herstellen eines MEMS Aktuators |
| CN104835908A (zh) * | 2015-04-17 | 2015-08-12 | 上海华虹宏力半导体制造有限公司 | 用于3d amr的氮化钽刻蚀方法 |
| US10589980B2 (en) * | 2017-04-07 | 2020-03-17 | Texas Instruments Incorporated | Isolated protrusion/recession features in a micro electro mechanical system |
| DE102018207783B4 (de) * | 2018-05-17 | 2022-11-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS-Array aus MEMS mit jeweils einem beweglichen Strukturelement |
| CN111246187B (zh) * | 2018-11-29 | 2022-07-29 | 青岛海信激光显示股份有限公司 | 光阀驱动控制方法及投影设备 |
| KR102211618B1 (ko) * | 2019-07-26 | 2021-02-02 | 인하대학교 산학협력단 | 3차원 플로팅 이미지 구현 장치용 역반사 마이크로 미러 어레이 |
| CN113675722B (zh) * | 2021-07-14 | 2024-10-29 | 威科赛乐微电子股份有限公司 | 一种Cap layer层蚀刻优化方法 |
| WO2025127562A1 (ko) * | 2023-12-14 | 2025-06-19 | 엘지이노텍 주식회사 | 프로젝트 장치 및 이를 포함하는 전자 디바이스 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08304892A (ja) * | 1995-05-11 | 1996-11-22 | Asahi Optical Co Ltd | ストロボ付カメラ |
| JPH08304924A (ja) * | 1995-05-10 | 1996-11-22 | Nikon Corp | プロジェクター装置 |
| US5659374A (en) * | 1992-10-23 | 1997-08-19 | Texas Instruments Incorporated | Method of repairing defective pixels |
| US5696619A (en) * | 1995-02-27 | 1997-12-09 | Texas Instruments Incorporated | Micromechanical device having an improved beam |
| JPH10319330A (ja) * | 1997-05-08 | 1998-12-04 | Texas Instr Inc <Ti> | 改善されたコントラスト比を有する空間光変調器 |
| JPH11344680A (ja) * | 1998-04-10 | 1999-12-14 | Samsung Electronics Co Ltd | 画像表示装置用マイクロミラ―デバイス |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4592628A (en) * | 1981-07-01 | 1986-06-03 | International Business Machines | Mirror array light valve |
| US6288828B1 (en) * | 1997-09-10 | 2001-09-11 | Light And Sound Design Ltd. | Programmable light beam shape altering device using programmable micromirrors |
| KR100243190B1 (ko) * | 1996-06-10 | 2000-02-01 | 윤종용 | 가동미러장치 및 그 제조방법 |
| US6123985A (en) * | 1998-10-28 | 2000-09-26 | Solus Micro Technologies, Inc. | Method of fabricating a membrane-actuated charge controlled mirror (CCM) |
| US6222667B1 (en) * | 1999-02-09 | 2001-04-24 | Advanced Optics Electronics, Inc. | Electro-optic light valve array |
| US6175443B1 (en) * | 1999-05-01 | 2001-01-16 | Lucent Technologies, Inc. | Article comprising a deformable segmented mirror |
-
2001
- 2001-08-03 CN CNB2004100546591A patent/CN100371763C/zh not_active Expired - Fee Related
- 2001-08-03 CN CNB2004100546572A patent/CN100412602C/zh not_active Expired - Fee Related
- 2001-08-03 CN CNB2004100546604A patent/CN100412604C/zh not_active Expired - Fee Related
- 2001-08-03 AT AT05000599T patent/ATE354814T1/de not_active IP Right Cessation
- 2001-08-03 DE DE20122616U patent/DE20122616U1/de not_active Expired - Lifetime
- 2001-08-03 EP EP01959466A patent/EP1315993A4/en not_active Ceased
- 2001-08-03 DE DE20122370U patent/DE20122370U1/de not_active Expired - Lifetime
- 2001-08-03 DE DE20122373U patent/DE20122373U1/de not_active Expired - Lifetime
- 2001-08-03 DE DE20122614U patent/DE20122614U1/de not_active Expired - Lifetime
- 2001-08-03 CN CNB018136087A patent/CN100392467C/zh not_active Expired - Fee Related
- 2001-08-03 DE DE20122372U patent/DE20122372U1/de not_active Expired - Lifetime
- 2001-08-03 DE DE20122618U patent/DE20122618U1/de not_active Expired - Lifetime
- 2001-08-03 DE DE60126849T patent/DE60126849T2/de not_active Expired - Fee Related
- 2001-08-03 WO PCT/US2001/024332 patent/WO2002012925A2/en active Application Filing
- 2001-08-03 AU AU2001281019A patent/AU2001281019A1/en not_active Abandoned
- 2001-08-03 CN CNB2004100546587A patent/CN100412603C/zh not_active Expired - Fee Related
- 2001-08-03 DE DE20122617U patent/DE20122617U1/de not_active Expired - Lifetime
- 2001-08-03 JP JP2002517555A patent/JP3889705B2/ja not_active Expired - Fee Related
- 2001-08-03 DE DE20122371U patent/DE20122371U1/de not_active Expired - Lifetime
- 2001-08-03 DE DE20122615U patent/DE20122615U1/de not_active Expired - Lifetime
-
2003
- 2003-02-03 KR KR1020037001542A patent/KR100724081B1/ko not_active Expired - Fee Related
-
2004
- 2004-09-03 JP JP2004257715A patent/JP3889757B2/ja not_active Expired - Fee Related
- 2004-09-17 JP JP2004272333A patent/JP3889759B2/ja not_active Expired - Fee Related
- 2004-09-17 JP JP2004272332A patent/JP3768514B2/ja not_active Expired - Fee Related
-
2005
- 2005-12-07 JP JP2005353848A patent/JP2006178447A/ja not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5659374A (en) * | 1992-10-23 | 1997-08-19 | Texas Instruments Incorporated | Method of repairing defective pixels |
| US5696619A (en) * | 1995-02-27 | 1997-12-09 | Texas Instruments Incorporated | Micromechanical device having an improved beam |
| JPH08304924A (ja) * | 1995-05-10 | 1996-11-22 | Nikon Corp | プロジェクター装置 |
| JPH08304892A (ja) * | 1995-05-11 | 1996-11-22 | Asahi Optical Co Ltd | ストロボ付カメラ |
| JPH10319330A (ja) * | 1997-05-08 | 1998-12-04 | Texas Instr Inc <Ti> | 改善されたコントラスト比を有する空間光変調器 |
| JPH11344680A (ja) * | 1998-04-10 | 1999-12-14 | Samsung Electronics Co Ltd | 画像表示装置用マイクロミラ―デバイス |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100371763C (zh) | 一种投影显示器及用于投影显示器的封装微镜片阵列 | |
| US7018052B2 (en) | Projection TV with improved micromirror array | |
| US7023606B2 (en) | Micromirror array for projection TV | |
| US6962419B2 (en) | Micromirror elements, package for the micromirror elements, and projection system therefor | |
| CN100535706C (zh) | 空间光调制器、操作空间光调制器的方法及投影系统 | |
| JP2007503598A (ja) | マイクロミラーのヒンジとミラープレートとの間の空間を低減したマイクロミラー | |
| JP2006528794A (ja) | マイクロミラーアレイの隣接したマイクロミラー間の隙間を低減したマイクロミラーアレイ | |
| KR20060040653A (ko) | 정전기장을 이용하여 미소거울들의 결합을 향상시키기 위한메커니즘을 구비한 미소거울들 | |
| KR20050106428A (ko) | 투사 디스플레이의 미소거울 및 미소거울 배열을 위한 힌지구조 | |
| JP2006528793A (ja) | ピッチの大きさが小さいマイクロミラーアレイ装置 | |
| US7751113B2 (en) | Micromirrors having mirror plates with tapered edges | |
| CN101213481B (zh) | 微镜阵列装置及其制造方法 | |
| EP1553437B1 (en) | Singulated wafer die having micromirrors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080227 |