CN100356600C - 热电模块 - Google Patents

热电模块 Download PDF

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Publication number
CN100356600C
CN100356600C CNB021584516A CN02158451A CN100356600C CN 100356600 C CN100356600 C CN 100356600C CN B021584516 A CNB021584516 A CN B021584516A CN 02158451 A CN02158451 A CN 02158451A CN 100356600 C CN100356600 C CN 100356600C
Authority
CN
China
Prior art keywords
insulating
holes
insulating substrate
conductive layer
thermoelectric module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB021584516A
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English (en)
Chinese (zh)
Other versions
CN1428875A (zh
Inventor
尾上胜彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Publication of CN1428875A publication Critical patent/CN1428875A/zh
Application granted granted Critical
Publication of CN100356600C publication Critical patent/CN100356600C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB021584516A 2001-12-27 2002-12-26 热电模块 Expired - Fee Related CN100356600C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001397462A JP4161572B2 (ja) 2001-12-27 2001-12-27 熱電モジュール
JP397462/2001 2001-12-27
JP397462/01 2001-12-27

Publications (2)

Publication Number Publication Date
CN1428875A CN1428875A (zh) 2003-07-09
CN100356600C true CN100356600C (zh) 2007-12-19

Family

ID=19189198

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB021584516A Expired - Fee Related CN100356600C (zh) 2001-12-27 2002-12-26 热电模块
CNU022926046U Expired - Lifetime CN2627654Y (zh) 2001-12-27 2002-12-26 热电模块

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNU022926046U Expired - Lifetime CN2627654Y (zh) 2001-12-27 2002-12-26 热电模块

Country Status (3)

Country Link
US (1) US20030121540A1 (enExample)
JP (1) JP4161572B2 (enExample)
CN (2) CN100356600C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101807662B (zh) * 2009-02-18 2012-09-05 财团法人工业技术研究院 热电元件及其制作方法、芯片堆叠结构及芯片封装结构

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4161572B2 (ja) * 2001-12-27 2008-10-08 ヤマハ株式会社 熱電モジュール
JP3999570B2 (ja) * 2002-05-29 2007-10-31 株式会社住田光学ガラス フィラメントランプ光量制御方法及びフィラメントランプ光量制御装置並びにフィラメントランプ光源装置
US20050183763A1 (en) * 2004-02-24 2005-08-25 Roger Christiansen Thermoelectric generation system utilizing a printed-circuit thermopile
US20070084499A1 (en) * 2005-10-14 2007-04-19 Biprodas Dutta Thermoelectric device produced by quantum confinement in nanostructures
US20070084495A1 (en) * 2005-10-14 2007-04-19 Biprodas Dutta Method for producing practical thermoelectric devices using quantum confinement in nanostructures
WO2007047451A2 (en) * 2005-10-14 2007-04-26 Zt3 Technologies, Inc. Thermoelectric device produced by quantum confinement in nanostructures, and methods therefor
US7310953B2 (en) 2005-11-09 2007-12-25 Emerson Climate Technologies, Inc. Refrigeration system including thermoelectric module
US20070101737A1 (en) 2005-11-09 2007-05-10 Masao Akei Refrigeration system including thermoelectric heat recovery and actuation
US7767564B2 (en) * 2005-12-09 2010-08-03 Zt3 Technologies, Inc. Nanowire electronic devices and method for producing the same
US7559215B2 (en) * 2005-12-09 2009-07-14 Zt3 Technologies, Inc. Methods of drawing high density nanowire arrays in a glassy matrix
US20070131269A1 (en) * 2005-12-09 2007-06-14 Biprodas Dutta High density nanowire arrays in glassy matrix
US8658880B2 (en) * 2005-12-09 2014-02-25 Zt3 Technologies, Inc. Methods of drawing wire arrays
TWI405361B (zh) * 2008-12-31 2013-08-11 財團法人工業技術研究院 熱電元件及其製程、晶片堆疊結構及晶片封裝結構
JP2011086737A (ja) * 2009-10-15 2011-04-28 Nippon Telegr & Teleph Corp <Ntt> 熱電変換モジュール
DE102010022668B4 (de) * 2010-06-04 2012-02-02 O-Flexx Technologies Gmbh Thermoelektrisches Element und Modul umfassend mehrere derartige Elemente
TWI443882B (zh) * 2010-11-15 2014-07-01 Ind Tech Res Inst 熱電轉換組件及其製造方法
JP5755895B2 (ja) * 2011-02-02 2015-07-29 電気化学工業株式会社 アルミニウム−ダイヤモンド系複合体及びその製造方法
KR101384981B1 (ko) * 2012-01-30 2014-04-14 연세대학교 산학협력단 열효율을 개선할 수 있는 구조를 갖는 열전 소자
DE102012102090A1 (de) * 2012-01-31 2013-08-01 Curamik Electronics Gmbh Thermoelektrisches Generatormodul, Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
KR20160094683A (ko) * 2015-02-02 2016-08-10 엘지이노텍 주식회사 차량용 음료수용장치
KR20190088701A (ko) * 2018-01-19 2019-07-29 엘지이노텍 주식회사 열전 소자
US11088037B2 (en) * 2018-08-29 2021-08-10 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device having probe pads and seal ring
CN112242480A (zh) * 2020-09-30 2021-01-19 西南电子技术研究所（中国电子科技集团公司第十研究所） 芯片级电子设备热电制冷方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687879A (en) * 1985-04-25 1987-08-18 Varo, Inc. Tiered thermoelectric unit and method of fabricating same
CN1190492A (zh) * 1996-05-28 1998-08-12 松下电工株式会社 热电组件的制造方法
JPH10313150A (ja) * 1997-05-13 1998-11-24 Nec Corp 温度制御型半導体モジュール
US5936192A (en) * 1996-12-20 1999-08-10 Aisin Seiki Kabushiki Kaisha Multi-stage electronic cooling device
CN2627654Y (zh) * 2001-12-27 2004-07-21 雅马哈株式会社 热电模块

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6492585B1 (en) * 2000-03-27 2002-12-10 Marlow Industries, Inc. Thermoelectric device assembly and method for fabrication of same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687879A (en) * 1985-04-25 1987-08-18 Varo, Inc. Tiered thermoelectric unit and method of fabricating same
CN1190492A (zh) * 1996-05-28 1998-08-12 松下电工株式会社 热电组件的制造方法
US5936192A (en) * 1996-12-20 1999-08-10 Aisin Seiki Kabushiki Kaisha Multi-stage electronic cooling device
JPH10313150A (ja) * 1997-05-13 1998-11-24 Nec Corp 温度制御型半導体モジュール
CN2627654Y (zh) * 2001-12-27 2004-07-21 雅马哈株式会社 热电模块

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101807662B (zh) * 2009-02-18 2012-09-05 财团法人工业技术研究院 热电元件及其制作方法、芯片堆叠结构及芯片封装结构

Also Published As

Publication number Publication date
US20030121540A1 (en) 2003-07-03
CN2627654Y (zh) 2004-07-21
JP2003197988A (ja) 2003-07-11
JP4161572B2 (ja) 2008-10-08
CN1428875A (zh) 2003-07-09

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Granted publication date: 20071219

Termination date: 20201226