CN100341901C - 聚合物合成和由聚合物制得的膜 - Google Patents

聚合物合成和由聚合物制得的膜 Download PDF

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Publication number
CN100341901C
CN100341901C CNB021190720A CN02119072A CN100341901C CN 100341901 C CN100341901 C CN 100341901C CN B021190720 A CNB021190720 A CN B021190720A CN 02119072 A CN02119072 A CN 02119072A CN 100341901 C CN100341901 C CN 100341901C
Authority
CN
China
Prior art keywords
ester
diacrylate
divinyl
monomers
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB021190720A
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English (en)
Chinese (zh)
Other versions
CN1384123A (zh
Inventor
R·H·戈尔
M·K·加拉格尔
Y·尤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Publication of CN1384123A publication Critical patent/CN1384123A/zh
Application granted granted Critical
Publication of CN100341901C publication Critical patent/CN100341901C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/04—Polymerisation in solution
    • C08F2/06—Organic solvent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Polymerisation Methods In General (AREA)
CNB021190720A 2001-03-26 2002-03-26 聚合物合成和由聚合物制得的膜 Expired - Fee Related CN100341901C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27890401P 2001-03-26 2001-03-26
US60/278,904 2001-03-26

Publications (2)

Publication Number Publication Date
CN1384123A CN1384123A (zh) 2002-12-11
CN100341901C true CN100341901C (zh) 2007-10-10

Family

ID=23066886

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021190720A Expired - Fee Related CN100341901C (zh) 2001-03-26 2002-03-26 聚合物合成和由聚合物制得的膜

Country Status (6)

Country Link
US (1) US6903175B2 (enExample)
EP (1) EP1245586A3 (enExample)
JP (1) JP2003048905A (enExample)
KR (1) KR20020076136A (enExample)
CN (1) CN100341901C (enExample)
TW (1) TW584639B (enExample)

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US7635741B2 (en) 2002-02-15 2009-12-22 Dow Global Technologies Inc. Multifunctional monomers and their use in making cross-linked polymers and porous films
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US7115321B2 (en) * 2002-07-26 2006-10-03 Kimberly-Clark Worldwide, Inc. Absorbent binder coating
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JP4885724B2 (ja) 2003-10-21 2012-02-29 ダウ グローバル テクノロジーズ エルエルシー 結合メソゲン性ポラゲン形成性部分を含有する多官能性モノマー及びそれからのポリアリーレン組成物
WO2005037761A2 (en) 2003-10-21 2005-04-28 Dow Global Technologies Inc. Multifunctional ethynyl substituted monomers and polyarylene compositions therefrom
KR100597418B1 (ko) * 2004-07-19 2006-07-05 주식회사 성림화학 고분자 중합체 제조용 용매 및 이를 이용한 고분자 중합방법
KR100662176B1 (ko) 2004-12-30 2006-12-27 제일모직주식회사 이방성 도전 필름용 조성물
JP5175098B2 (ja) * 2005-08-03 2013-04-03 株式会社Ｄｎｐファインケミカル 重合体組成物の製造方法および重合体組成物
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
US20070106050A1 (en) * 2005-11-08 2007-05-10 Sokolowski Alex D Crosslinked poly(arylene ether) composition, method, and article
US20100264225A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
KR20080084812A (ko) 2005-11-22 2008-09-19 쇼킹 테크놀로지스 인코포레이티드 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스
US7619131B2 (en) * 2005-12-02 2009-11-17 Kimberly-Clark Worldwide, Inc. Articles comprising transparent/translucent polymer composition
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
US20080032049A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having high aspect ratio particles
US7968010B2 (en) * 2006-07-29 2011-06-28 Shocking Technologies, Inc. Method for electroplating a substrate
JP2010521058A (ja) 2006-09-24 2010-06-17 ショッキング テクノロジーズ，インコーポレイテッド ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法
CN101595535A (zh) * 2006-09-24 2009-12-02 肖克科技有限公司 利用电压可切换电介质材料和光辅助进行电镀衬底器件的技术
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US20090050856A1 (en) * 2007-08-20 2009-02-26 Lex Kosowsky Voltage switchable dielectric material incorporating modified high aspect ratio particles
US8206614B2 (en) * 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US20090220771A1 (en) * 2008-02-12 2009-09-03 Robert Fleming Voltage switchable dielectric material with superior physical properties for structural applications
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
WO2010033635A1 (en) * 2008-09-17 2010-03-25 Shocking Technologies, Inc. Voltage switchable dielectric material containing boron compound
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
WO2010039902A2 (en) 2008-09-30 2010-04-08 Shocking Technologies, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US20100148129A1 (en) * 2008-12-15 2010-06-17 Lex Kosowsky Voltage Switchable Dielectric Material Containing Insulative and/or Low-Dielectric Core Shell Particles
US20100159259A1 (en) * 2008-12-19 2010-06-24 Lex Kosowsky Voltage switchable dielectric material incorporating p and n type material
EP2389410A1 (en) * 2009-01-23 2011-11-30 Shocking Technologies Inc Dielectric composition
US8399773B2 (en) * 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
EP2412212A1 (en) * 2009-03-26 2012-02-01 Shocking Technologies Inc Components having voltage switchable dielectric materials
US9053844B2 (en) * 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
JP5882583B2 (ja) * 2010-02-04 2016-03-09 東京応化工業株式会社 エアギャップ形成用シリカ系被膜形成材料及びエアギャップ形成方法
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US10093752B2 (en) * 2013-06-13 2018-10-09 Gwangju Institute Of Science And Technology Homopolymer nanoparticles by self-emulsion polymerization reaction and preparation method thereof
JP6146512B2 (ja) * 2016-05-10 2017-06-14 三菱ケミカル株式会社 半導体リソグラフィー用重合体およびその製造方法
CN110117417B (zh) * 2018-02-07 2021-03-26 比亚迪股份有限公司 聚合物电解质膜及其制备方法和锂离子电池

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US4988568A (en) * 1988-03-30 1991-01-29 Nippon Zeon Co., Ltd. Hydrophilic fine gel particles and process for production thereof
US5837790A (en) * 1994-10-24 1998-11-17 Amcol International Corporation Precipitation polymerization process for producing an oil adsorbent polymer capable of entrapping solid particles and liquids and the product thereof
US5863996A (en) * 1980-12-30 1999-01-26 National Research Development Corporation Solution polymerization to form sol of crosslinked particles
EP1035183A1 (en) * 1998-09-25 2000-09-13 Catalysts & Chemicals Industries Co., Ltd. Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film

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US5863996A (en) * 1980-12-30 1999-01-26 National Research Development Corporation Solution polymerization to form sol of crosslinked particles
US4988568A (en) * 1988-03-30 1991-01-29 Nippon Zeon Co., Ltd. Hydrophilic fine gel particles and process for production thereof
US5837790A (en) * 1994-10-24 1998-11-17 Amcol International Corporation Precipitation polymerization process for producing an oil adsorbent polymer capable of entrapping solid particles and liquids and the product thereof
EP1035183A1 (en) * 1998-09-25 2000-09-13 Catalysts & Chemicals Industries Co., Ltd. Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film

Also Published As

Publication number Publication date
EP1245586A2 (en) 2002-10-02
CN1384123A (zh) 2002-12-11
JP2003048905A (ja) 2003-02-21
TW584639B (en) 2004-04-21
US6903175B2 (en) 2005-06-07
KR20020076136A (ko) 2002-10-09
US20030008989A1 (en) 2003-01-09
EP1245586A3 (en) 2002-10-16

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C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20071010