JP2003048905A - 溶液ポリマー粒子の製造方法 - Google Patents

溶液ポリマー粒子の製造方法

Info

Publication number
JP2003048905A
JP2003048905A JP2002086105A JP2002086105A JP2003048905A JP 2003048905 A JP2003048905 A JP 2003048905A JP 2002086105 A JP2002086105 A JP 2002086105A JP 2002086105 A JP2002086105 A JP 2002086105A JP 2003048905 A JP2003048905 A JP 2003048905A
Authority
JP
Japan
Prior art keywords
meth
particle size
monomers
dielectric
polymer particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002086105A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003048905A5 (enExample
Inventor
Robert H Gore
ロバート・エイチ・ゴア
Michael K Gallagher
マイケル・ケー・ギャラガー
Yujian You
ユジアン・ヨウ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Publication of JP2003048905A publication Critical patent/JP2003048905A/ja
Publication of JP2003048905A5 publication Critical patent/JP2003048905A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/04—Polymerisation in solution
    • C08F2/06—Organic solvent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
JP2002086105A 2001-03-26 2002-03-26 溶液ポリマー粒子の製造方法 Pending JP2003048905A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27890401P 2001-03-26 2001-03-26
US60/278904 2001-03-26

Publications (2)

Publication Number Publication Date
JP2003048905A true JP2003048905A (ja) 2003-02-21
JP2003048905A5 JP2003048905A5 (enExample) 2005-09-08

Family

ID=23066886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002086105A Pending JP2003048905A (ja) 2001-03-26 2002-03-26 溶液ポリマー粒子の製造方法

Country Status (6)

Country Link
US (1) US6903175B2 (enExample)
EP (1) EP1245586A3 (enExample)
JP (1) JP2003048905A (enExample)
KR (1) KR20020076136A (enExample)
CN (1) CN100341901C (enExample)
TW (1) TW584639B (enExample)

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JP2010270334A (ja) * 2001-03-30 2010-12-02 Rohm & Haas Co 改良されたコーティング及びコーティング組成物
KR101085942B1 (ko) 2003-05-19 2011-11-22 롬 앤드 하스 캄파니 중합나노입자의 고 고형분 제조방법
JP2016186079A (ja) * 2016-05-10 2016-10-27 三菱レイヨン株式会社 半導体リソグラフィー用重合体およびその製造方法

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US7825491B2 (en) * 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US20100038119A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
WO2001017320A1 (en) 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US6998148B1 (en) * 2001-03-28 2006-02-14 Shipley Company, L.L.C. Porous materials
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US7635741B2 (en) 2002-02-15 2009-12-22 Dow Global Technologies Inc. Multifunctional monomers and their use in making cross-linked polymers and porous films
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US7115321B2 (en) * 2002-07-26 2006-10-03 Kimberly-Clark Worldwide, Inc. Absorbent binder coating
US7205259B2 (en) * 2002-07-26 2007-04-17 Kimberly-Clark Worldwide, Inc. Absorbent binder desiccant composition and articles incorporating it
US7153754B2 (en) * 2002-08-29 2006-12-26 Micron Technology, Inc. Methods for forming porous insulators from “void” creating materials and structures and semiconductor devices including same
US6812132B2 (en) * 2003-03-21 2004-11-02 Intel Corporation Filling small dimension vias using supercritical carbon dioxide
US7626059B2 (en) 2003-10-21 2009-12-01 Dow Global Technologies Inc. Multifunctional ethynyl substituted monomers and polyarylene compositions therefrom
JP4885724B2 (ja) 2003-10-21 2012-02-29 ダウ グローバル テクノロジーズ エルエルシー 結合メソゲン性ポラゲン形成性部分を含有する多官能性モノマー及びそれからのポリアリーレン組成物
KR100597418B1 (ko) * 2004-07-19 2006-07-05 주식회사 성림화학 고분자 중합체 제조용 용매 및 이를 이용한 고분자 중합방법
KR100662176B1 (ko) 2004-12-30 2006-12-27 제일모직주식회사 이방성 도전 필름용 조성물
EP2404940B1 (en) * 2005-08-03 2014-12-24 The Inctec Inc. Method for producing polymer composition and polymer composition
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
US20070106050A1 (en) * 2005-11-08 2007-05-10 Sokolowski Alex D Crosslinked poly(arylene ether) composition, method, and article
US7923844B2 (en) * 2005-11-22 2011-04-12 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US20100263200A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
US7619131B2 (en) * 2005-12-02 2009-11-17 Kimberly-Clark Worldwide, Inc. Articles comprising transparent/translucent polymer composition
US7981325B2 (en) * 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
US20080032049A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having high aspect ratio particles
JP2010504437A (ja) * 2006-09-24 2010-02-12 ショッキング テクノロジーズ インコーポレイテッド 電圧で切替可能な誘電体材料および光補助を用いた基板デバイスをメッキする技法
EP2084748A4 (en) 2006-09-24 2011-09-28 Shocking Technologies Inc VOLTAGE GRADUATED RESPONSE VOLTAGE-SWITCHABLE DIELECTRIC MATERIAL, AND METHOD FOR MANUFACTURING THE SAME
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US20090050856A1 (en) * 2007-08-20 2009-02-26 Lex Kosowsky Voltage switchable dielectric material incorporating modified high aspect ratio particles
US8206614B2 (en) * 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US20090220771A1 (en) * 2008-02-12 2009-09-03 Robert Fleming Voltage switchable dielectric material with superior physical properties for structural applications
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
US20100065785A1 (en) * 2008-09-17 2010-03-18 Lex Kosowsky Voltage switchable dielectric material containing boron compound
JP2012504870A (ja) 2008-09-30 2012-02-23 ショッキング テクノロジーズ インコーポレイテッド 導電コアシェル粒子を含有する電圧で切替可能な誘電体材料
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US20100148129A1 (en) * 2008-12-15 2010-06-17 Lex Kosowsky Voltage Switchable Dielectric Material Containing Insulative and/or Low-Dielectric Core Shell Particles
US20100159259A1 (en) * 2008-12-19 2010-06-24 Lex Kosowsky Voltage switchable dielectric material incorporating p and n type material
KR20110112843A (ko) * 2009-01-23 2011-10-13 쇼킹 테크놀로지스 인코포레이티드 유전체 조성물
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) * 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
KR101679099B1 (ko) * 2009-03-26 2016-11-23 쇼킹 테크놀로지스 인코포레이티드 전압 스위칭형 유전 물질을 갖는 소자
US9053844B2 (en) * 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
JP5882583B2 (ja) * 2010-02-04 2016-03-09 東京応化工業株式会社 エアギャップ形成用シリカ系被膜形成材料及びエアギャップ形成方法
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US10093752B2 (en) * 2013-06-13 2018-10-09 Gwangju Institute Of Science And Technology Homopolymer nanoparticles by self-emulsion polymerization reaction and preparation method thereof
CN110117417B (zh) * 2018-02-07 2021-03-26 比亚迪股份有限公司 聚合物电解质膜及其制备方法和锂离子电池

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JP2001210142A (ja) * 1999-10-01 2001-08-03 Shipley Co Llc 多孔性物質
JP2002284997A (ja) * 2000-10-10 2002-10-03 Shipley Co Llc 多孔性有機ポリシリカ誘電体形成用の組成物

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JPS62250001A (ja) * 1986-04-22 1987-10-30 Kansai Paint Co Ltd 高屈折率重合体微粒子の分散液の製造方法
JP2001210142A (ja) * 1999-10-01 2001-08-03 Shipley Co Llc 多孔性物質
JP2002284997A (ja) * 2000-10-10 2002-10-03 Shipley Co Llc 多孔性有機ポリシリカ誘電体形成用の組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010270334A (ja) * 2001-03-30 2010-12-02 Rohm & Haas Co 改良されたコーティング及びコーティング組成物
KR101085942B1 (ko) 2003-05-19 2011-11-22 롬 앤드 하스 캄파니 중합나노입자의 고 고형분 제조방법
JP2016186079A (ja) * 2016-05-10 2016-10-27 三菱レイヨン株式会社 半導体リソグラフィー用重合体およびその製造方法

Also Published As

Publication number Publication date
EP1245586A3 (en) 2002-10-16
KR20020076136A (ko) 2002-10-09
TW584639B (en) 2004-04-21
CN1384123A (zh) 2002-12-11
EP1245586A2 (en) 2002-10-02
US20030008989A1 (en) 2003-01-09
US6903175B2 (en) 2005-06-07
CN100341901C (zh) 2007-10-10

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