EP1245586A3 - Polymer synthesis and films therefrom - Google Patents

Polymer synthesis and films therefrom Download PDF

Info

Publication number
EP1245586A3
EP1245586A3 EP02252074A EP02252074A EP1245586A3 EP 1245586 A3 EP1245586 A3 EP 1245586A3 EP 02252074 A EP02252074 A EP 02252074A EP 02252074 A EP02252074 A EP 02252074A EP 1245586 A3 EP1245586 A3 EP 1245586A3
Authority
EP
European Patent Office
Prior art keywords
polymer synthesis
films therefrom
cross
linked polymers
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02252074A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1245586A2 (en
Inventor
Robert H. Gore
Michael K. Gallagher
Yujian You
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Publication of EP1245586A2 publication Critical patent/EP1245586A2/en
Publication of EP1245586A3 publication Critical patent/EP1245586A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/04—Polymerisation in solution
    • C08F2/06—Organic solvent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Polymerisation Methods In General (AREA)
EP02252074A 2001-03-26 2002-03-22 Polymer synthesis and films therefrom Withdrawn EP1245586A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27890401P 2001-03-26 2001-03-26
US278904P 2001-03-26

Publications (2)

Publication Number Publication Date
EP1245586A2 EP1245586A2 (en) 2002-10-02
EP1245586A3 true EP1245586A3 (en) 2002-10-16

Family

ID=23066886

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02252074A Withdrawn EP1245586A3 (en) 2001-03-26 2002-03-22 Polymer synthesis and films therefrom

Country Status (6)

Country Link
US (1) US6903175B2 (enExample)
EP (1) EP1245586A3 (enExample)
JP (1) JP2003048905A (enExample)
KR (1) KR20020076136A (enExample)
CN (1) CN100341901C (enExample)
TW (1) TW584639B (enExample)

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US20100038119A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US7825491B2 (en) * 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US6998148B1 (en) * 2001-03-28 2006-02-14 Shipley Company, L.L.C. Porous materials
US6939922B2 (en) * 2001-03-30 2005-09-06 Rohm And Haas Company Coating and coating composition
US6780499B2 (en) * 2001-05-03 2004-08-24 International Business Machines Corporation Ordered two-phase dielectric film, and semiconductor device containing the same
US20030162890A1 (en) * 2002-02-15 2003-08-28 Kalantar Thomas H. Nanoscale polymerized hydrocarbon particles and methods of making and using such particles
US7635741B2 (en) 2002-02-15 2009-12-22 Dow Global Technologies Inc. Multifunctional monomers and their use in making cross-linked polymers and porous films
US7205259B2 (en) * 2002-07-26 2007-04-17 Kimberly-Clark Worldwide, Inc. Absorbent binder desiccant composition and articles incorporating it
US7115321B2 (en) * 2002-07-26 2006-10-03 Kimberly-Clark Worldwide, Inc. Absorbent binder coating
US7153754B2 (en) * 2002-08-29 2006-12-26 Micron Technology, Inc. Methods for forming porous insulators from “void” creating materials and structures and semiconductor devices including same
US6812132B2 (en) * 2003-03-21 2004-11-02 Intel Corporation Filling small dimension vias using supercritical carbon dioxide
JP3999746B2 (ja) 2003-05-19 2007-10-31 ローム アンド ハース カンパニー ポリマーナノ粒子の高固形分調製方法
JP4885724B2 (ja) 2003-10-21 2012-02-29 ダウ グローバル テクノロジーズ エルエルシー 結合メソゲン性ポラゲン形成性部分を含有する多官能性モノマー及びそれからのポリアリーレン組成物
WO2005037761A2 (en) 2003-10-21 2005-04-28 Dow Global Technologies Inc. Multifunctional ethynyl substituted monomers and polyarylene compositions therefrom
KR100597418B1 (ko) * 2004-07-19 2006-07-05 주식회사 성림화학 고분자 중합체 제조용 용매 및 이를 이용한 고분자 중합방법
KR100662176B1 (ko) 2004-12-30 2006-12-27 제일모직주식회사 이방성 도전 필름용 조성물
JP5175098B2 (ja) * 2005-08-03 2013-04-03 株式会社Ｄｎｐファインケミカル 重合体組成物の製造方法および重合体組成物
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
US20070106050A1 (en) * 2005-11-08 2007-05-10 Sokolowski Alex D Crosslinked poly(arylene ether) composition, method, and article
US20100264225A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
KR20080084812A (ko) 2005-11-22 2008-09-19 쇼킹 테크놀로지스 인코포레이티드 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스
US7619131B2 (en) * 2005-12-02 2009-11-17 Kimberly-Clark Worldwide, Inc. Articles comprising transparent/translucent polymer composition
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
US20080032049A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having high aspect ratio particles
US7968010B2 (en) * 2006-07-29 2011-06-28 Shocking Technologies, Inc. Method for electroplating a substrate
JP2010521058A (ja) 2006-09-24 2010-06-17 ショッキング テクノロジーズ，インコーポレイテッド ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法
CN101595535A (zh) * 2006-09-24 2009-12-02 肖克科技有限公司 利用电压可切换电介质材料和光辅助进行电镀衬底器件的技术
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US20090050856A1 (en) * 2007-08-20 2009-02-26 Lex Kosowsky Voltage switchable dielectric material incorporating modified high aspect ratio particles
US8206614B2 (en) * 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US20090220771A1 (en) * 2008-02-12 2009-09-03 Robert Fleming Voltage switchable dielectric material with superior physical properties for structural applications
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
WO2010033635A1 (en) * 2008-09-17 2010-03-25 Shocking Technologies, Inc. Voltage switchable dielectric material containing boron compound
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
WO2010039902A2 (en) 2008-09-30 2010-04-08 Shocking Technologies, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US20100148129A1 (en) * 2008-12-15 2010-06-17 Lex Kosowsky Voltage Switchable Dielectric Material Containing Insulative and/or Low-Dielectric Core Shell Particles
US20100159259A1 (en) * 2008-12-19 2010-06-24 Lex Kosowsky Voltage switchable dielectric material incorporating p and n type material
EP2389410A1 (en) * 2009-01-23 2011-11-30 Shocking Technologies Inc Dielectric composition
US8399773B2 (en) * 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
EP2412212A1 (en) * 2009-03-26 2012-02-01 Shocking Technologies Inc Components having voltage switchable dielectric materials
US9053844B2 (en) * 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
JP5882583B2 (ja) * 2010-02-04 2016-03-09 東京応化工業株式会社 エアギャップ形成用シリカ系被膜形成材料及びエアギャップ形成方法
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US10093752B2 (en) * 2013-06-13 2018-10-09 Gwangju Institute Of Science And Technology Homopolymer nanoparticles by self-emulsion polymerization reaction and preparation method thereof
JP6146512B2 (ja) * 2016-05-10 2017-06-14 三菱ケミカル株式会社 半導体リソグラフィー用重合体およびその製造方法
CN110117417B (zh) * 2018-02-07 2021-03-26 比亚迪股份有限公司 聚合物电解质膜及其制备方法和锂离子电池

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5863996A (en) * 1980-12-30 1999-01-26 National Research Development Corporation Solution polymerization to form sol of crosslinked particles

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KR100618304B1 (ko) 1998-09-25 2006-08-31 쇼꾸바이 카세이 고교 가부시키가이샤 낮은 유전상수를 지니는 실리카-포함 필름을 형성하기위한 코팅 액체 및 그의 필름으로 코팅된 기질
DE19903391A1 (de) * 1999-01-29 2000-08-03 Bayer Ag Wäßriges Überzugsmittel, Verfahren zu seiner Herstellung und seine Verwendung
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US6271273B1 (en) * 2000-07-14 2001-08-07 Shipley Company, L.L.C. Porous materials
WO2002025374A2 (en) * 2000-09-19 2002-03-28 Shipley Company, L.L.C. Antireflective composition
TW588072B (en) * 2000-10-10 2004-05-21 Shipley Co Llc Antireflective porogens

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
US5863996A (en) * 1980-12-30 1999-01-26 National Research Development Corporation Solution polymerization to form sol of crosslinked particles

Also Published As

Publication number Publication date
EP1245586A2 (en) 2002-10-02
CN1384123A (zh) 2002-12-11
JP2003048905A (ja) 2003-02-21
TW584639B (en) 2004-04-21
US6903175B2 (en) 2005-06-07
CN100341901C (zh) 2007-10-10
KR20020076136A (ko) 2002-10-09
US20030008989A1 (en) 2003-01-09

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