CH714351A1 - Bondkopf für die Montage von Bauelementen. - Google Patents

Bondkopf für die Montage von Bauelementen. Download PDF

Info

Publication number
CH714351A1
CH714351A1 CH01396/17A CH13962017A CH714351A1 CH 714351 A1 CH714351 A1 CH 714351A1 CH 01396/17 A CH01396/17 A CH 01396/17A CH 13962017 A CH13962017 A CH 13962017A CH 714351 A1 CH714351 A1 CH 714351A1
Authority
CH
Switzerland
Prior art keywords
shaft
axis
longitudinal direction
air
encoder
Prior art date
Application number
CH01396/17A
Other languages
German (de)
English (en)
Inventor
Kröhnert Rene
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Priority to CH01396/17A priority Critical patent/CH714351A1/de
Priority to CH00957/18A priority patent/CH714384A2/de
Priority to JP2018195498A priority patent/JP7398191B2/ja
Priority to FR1860164A priority patent/FR3073763B1/fr
Priority to US16/180,243 priority patent/US20190157122A1/en
Priority to TW107139446A priority patent/TW201923940A/zh
Priority to CN201811346241.6A priority patent/CN110011439B/zh
Priority to DE102018128615.5A priority patent/DE102018128615A1/de
Priority to KR1020180139732A priority patent/KR102661560B1/ko
Publication of CH714351A1 publication Critical patent/CH714351A1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/27—Rotor cores with permanent magnets
    • H02K1/2706—Inner rotors
    • H02K1/272—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis
    • H02K1/274—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets
    • H02K1/2753—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets the rotor consisting of magnets or groups of magnets arranged with alternating polarity
    • H02K1/276—Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/25—Devices for sensing temperature, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
    • H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75841—Means for moving parts of the bonding head
    • H01L2224/75842—Rotational mechanism

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
CH01396/17A 2017-11-17 2017-11-17 Bondkopf für die Montage von Bauelementen. CH714351A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CH01396/17A CH714351A1 (de) 2017-11-17 2017-11-17 Bondkopf für die Montage von Bauelementen.
CH00957/18A CH714384A2 (de) 2017-11-17 2018-08-06 Bondkopf für die Montage von Bauelementen und Die Bonder mit einem solchen Bondkopf.
JP2018195498A JP7398191B2 (ja) 2017-11-17 2018-10-17 部品を装着するボンディングヘッド及び該ボンディングヘッドを備えているダイボンダ
FR1860164A FR3073763B1 (fr) 2017-11-17 2018-11-05 Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage
US16/180,243 US20190157122A1 (en) 2017-11-17 2018-11-05 Bonding head for mounting components and die bonder with such a bonding head
TW107139446A TW201923940A (zh) 2017-11-17 2018-11-07 用於安裝組件的接合頭及具有此種接合頭的晶粒接合機
CN201811346241.6A CN110011439B (zh) 2017-11-17 2018-11-13 用于安装组件的结合头和具有这种结合头的贴片机
DE102018128615.5A DE102018128615A1 (de) 2017-11-17 2018-11-14 Bondkopf für die Montage von Bauelementen und Die Bonder mit einem solchen Bondkopf
KR1020180139732A KR102661560B1 (ko) 2017-11-17 2018-11-14 부품들을 장착하기 위한 본딩 헤드 및 그러한 본딩 헤드를 갖춘 다이 본더

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH01396/17A CH714351A1 (de) 2017-11-17 2017-11-17 Bondkopf für die Montage von Bauelementen.

Publications (1)

Publication Number Publication Date
CH714351A1 true CH714351A1 (de) 2019-05-31

Family

ID=66646772

Family Applications (2)

Application Number Title Priority Date Filing Date
CH01396/17A CH714351A1 (de) 2017-11-17 2017-11-17 Bondkopf für die Montage von Bauelementen.
CH00957/18A CH714384A2 (de) 2017-11-17 2018-08-06 Bondkopf für die Montage von Bauelementen und Die Bonder mit einem solchen Bondkopf.

Family Applications After (1)

Application Number Title Priority Date Filing Date
CH00957/18A CH714384A2 (de) 2017-11-17 2018-08-06 Bondkopf für die Montage von Bauelementen und Die Bonder mit einem solchen Bondkopf.

Country Status (5)

Country Link
JP (1) JP7398191B2 (zh)
KR (1) KR102661560B1 (zh)
CN (1) CN110011439B (zh)
CH (2) CH714351A1 (zh)
TW (1) TW201923940A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113891947B (zh) 2019-05-23 2023-06-13 日本制铁株式会社 次级线圈模块、移动淬火装置及移动淬火方法
GB2591132A (en) * 2020-01-17 2021-07-21 Asm Assembly Systems Singapore Pte Ltd Tooling pin placement system
JP2024080318A (ja) 2022-12-02 2024-06-13 三星電子株式会社 実装装置及び実装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952744A (en) * 1996-03-28 1999-09-14 Anoiad Corporation Rotary-linear actuator
US20140175159A1 (en) * 2012-12-21 2014-06-26 Besi Switzerland Ag Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A Substrate
US20140202636A1 (en) * 2013-01-21 2014-07-24 Besi Switzerland Ag Bonding Head With A Heatable And Coolable Suction Member
US20140311652A1 (en) * 2013-04-19 2014-10-23 Besi Switzerland Ag Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2979772B2 (ja) * 1991-09-13 1999-11-15 松下電器産業株式会社 ダイボンディング装置
JP2998467B2 (ja) * 1992-12-04 2000-01-11 松下電器産業株式会社 電子部品の実装用ヘッド
JP3800126B2 (ja) 2002-04-23 2006-07-26 松下電器産業株式会社 作業ヘッド
JP4365370B2 (ja) * 2003-08-25 2009-11-18 ハスキー インジェクション モールディング システムズ リミテッド 軸を回転及び並進させるための駆動アセンブリ
JP5068571B2 (ja) 2007-03-29 2012-11-07 芝浦メカトロニクス株式会社 電子部品の実装装置
JP2008288473A (ja) 2007-05-21 2008-11-27 Panasonic Corp ワイヤボンディング方法およびワイヤボンディング装置
US8651159B2 (en) * 2009-06-12 2014-02-18 Asm Assembly Automation Ltd Die bonder providing a large bonding force
JP6372031B2 (ja) 2013-12-09 2018-08-15 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 流体圧アクチュエータ
US9726204B2 (en) * 2013-12-09 2017-08-08 Samsung Electronics Co., Ltd. Fluid pressure actuator
JP6664986B2 (ja) * 2016-02-17 2020-03-13 株式会社ディスコ 加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952744A (en) * 1996-03-28 1999-09-14 Anoiad Corporation Rotary-linear actuator
US20140175159A1 (en) * 2012-12-21 2014-06-26 Besi Switzerland Ag Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A Substrate
US20140202636A1 (en) * 2013-01-21 2014-07-24 Besi Switzerland Ag Bonding Head With A Heatable And Coolable Suction Member
US20140311652A1 (en) * 2013-04-19 2014-10-23 Besi Switzerland Ag Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate

Also Published As

Publication number Publication date
JP2019096867A (ja) 2019-06-20
JP7398191B2 (ja) 2023-12-14
KR20190056985A (ko) 2019-05-27
KR102661560B1 (ko) 2024-04-26
CN110011439B (zh) 2023-10-17
CN110011439A (zh) 2019-07-12
CH714384A2 (de) 2019-05-31
TW201923940A (zh) 2019-06-16

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