JP7398191B2 - 部品を装着するボンディングヘッド及び該ボンディングヘッドを備えているダイボンダ - Google Patents
部品を装着するボンディングヘッド及び該ボンディングヘッドを備えているダイボンダ Download PDFInfo
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- JP7398191B2 JP7398191B2 JP2018195498A JP2018195498A JP7398191B2 JP 7398191 B2 JP7398191 B2 JP 7398191B2 JP 2018195498 A JP2018195498 A JP 2018195498A JP 2018195498 A JP2018195498 A JP 2018195498A JP 7398191 B2 JP7398191 B2 JP 7398191B2
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- 238000005259 measurement Methods 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
- H02K1/22—Rotating parts of the magnetic circuit
- H02K1/27—Rotor cores with permanent magnets
- H02K1/2706—Inner rotors
- H02K1/272—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis
- H02K1/274—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets
- H02K1/2753—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets the rotor consisting of magnets or groups of magnets arranged with alternating polarity
- H02K1/276—Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/21—Devices for sensing speed or position, or actuated thereby
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/25—Devices for sensing temperature, or actuated thereby
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
- H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75822—Rotational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75824—Translational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75841—Means for moving parts of the bonding head
- H01L2224/75842—Rotational mechanism
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Description
-回転子が直接取り付けられている軸を回転させる本発明の駆動部は、直接駆動部であって、したがって、遊びがなく、したがって高精度に軸の回転位置に動かすことができる。これは、駆動部と軸との間に歯車が介在している既知のボンディングヘッドとは対照的である。
-エンコーダスケールが軸に取り付けられている円盤上に装着されているので直接的で、軸の回転位置の計測も、遊びのない計測である。
-歯車なしの、そして歯付きベルト等なしの軸の直接駆動は、摩耗がなく、どのような擦過も発生しない。これは、擦過によってICが損傷して、半導体チップが粒子によって汚染されることになるクリーンルーム環境において特に有利である。
-軸の軸線方向の変位、つまり軸のその長さ方向の軸線に沿った変位は、実質的に力がいらない。これは、ピッキング力またはボンディング力の増加時に軸の長さ方向の軸線に沿った変位によって、力発生器によって発生した力を増加させたり減少させたりする追加の力が発生しないことを意味している。これは、駆動部と軸との間に歯付き歯車やベルトが介在している既知のボンディングヘッドとは対照的である。
-本構成は、省スペースで、コンパクトで、半導体部品を装着するのに必要な比較的大きなボンディング力の発生を小さい空間及び小さい重量で可能にする。
-回転子を含めた軸の質量は、非常に小さい。軸が部品に衝突したときにその部品に作用する一時的な力は、軸の運動量、つまり質量と速度との積に比例し、所定の値を超えてはならず、そうでなければ、部品が損傷する可能性がある。質量がより小さいと、速度を高くすることが可能で、したがってサイクル時間が短くなる。
-空気軸受を備えているボンディングヘッドの構成によって、軸の摩擦のほぼない回転及び変位が可能になる。
-温度制御装置を備えているボンディングヘッドの構成によって、環境の温度変動のボンディングヘッドに対する、したがってボンディングプロセスに対する影響を最小にするか無くしてしまうことができる。
Claims (5)
- 軸(2)と、
軸(2)の軸線(6)を中心とした回転及び軸(2)の軸線(6)の長さ方向の所定のストローク(H)の動きを可能にする軸(2)用の軸受を有する筐体部(3)と、
軸(2)を軸線(6)を中心に回転させるのみの1つの駆動部と、
軸(2)の回転位置を計測するように構成されているエンコーダと、
力を軸線(6)の長さ方向に軸(2)に作用させるように構成されている空圧力発生器と、
を有し、
前記空圧力発生器は、圧縮空気の供給を受けることができる単一の圧力チャンバを有しており、前記単一の圧力チャンバに行き渡っている圧力は、前記軸(2)の端部に作用し、
前記1つの駆動部は固定子と回転子とを有している電気モータであって、
固定子は、筐体部(3)に取り付けられており、回転子は、軸(2)に取り付けられており、
回転子は複数の永久磁石(8)であって、全ての複数の前記永久磁石(8)が前記軸線(6)に垂直な単一平面内に位置し、円上に配置されており、円の中心に向いている領域が、交互に北極N及び南極Sである複数の永久磁石(8)を有しており、
固定子は、電流を作用させることが可能なコイル(7)を有しており、コイル(7)の全体を通して流れる電流によって発生した磁界は、軸線(6)を中心とした回転子の回転のみを引き起こし、
永久磁石(8)の軸線(6)の長さ方向に計測した長さ(L1)は、コイル(7)の軸線(6)の長さ方向に計測した有効長(L2)よりも、ストローク(H)だけ、短いか長く、したがって、前記所定のストローク内の前記軸(2)が軸方向に変位する際の前記軸線(6)に沿った力を変化させることが防止され、
前記ボンディングヘッド(1)は、前記軸線(6)に沿って前記軸(2)を移動させるためのコイルを備えていない、
部品を基板上に装着するボンディングヘッド(1)。 - 前記エンコーダは、軸(2)に固定されており、その縁に取り付けられているエンコーダスケールを備えている円形の円盤(9)と、エンコーダ読み取りヘッド(10)とを有し、
エンコーダスケールは、軸線(6)の長さ方向に延びている長線を有しており、
軸線(6)の長さ方向で計測した長線の長さ及び軸線(6)の長さ方向に延びているエンコーダ読み取りヘッド(10)の計測領域は、長線が軸(2)の全ストローク(H)にわたって、エンコーダ読み取りヘッド(10)の計測領域に位置するように互いに一致している、
請求項1に記載のボンディングヘッド。 - 軸受は、空気軸受であって、
筐体部(3)は、圧縮空気を供給する空気入口と、空気軸受から空気を排出する空気出口とを有しており、
空気入口は、いくつかの空気出口の間に、軸線(6)の長さ方向に配置されている、請求項1または2に記載のボンディングヘッド。 - ボンディングヘッド(1)の所定の部分の温度を所定の値に維持する役割のある温度制御装置をさらに有する、請求項1から3のいずれか一項に記載のボンディングヘッド。
- 請求項1から4のいずれか一項に記載のボンディングヘッドと、ボンディングヘッド(1)を軸線(6)の長さ方向に移動するように構成されている駆動部(17)とを備えているダイボンダ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH01396/17 | 2017-11-17 | ||
CH01396/17A CH714351A1 (de) | 2017-11-17 | 2017-11-17 | Bondkopf für die Montage von Bauelementen. |
CH00957/18 | 2018-08-06 | ||
CH00957/18A CH714384A2 (de) | 2017-11-17 | 2018-08-06 | Bondkopf für die Montage von Bauelementen und Die Bonder mit einem solchen Bondkopf. |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019096867A JP2019096867A (ja) | 2019-06-20 |
JP2019096867A5 JP2019096867A5 (ja) | 2021-11-18 |
JP7398191B2 true JP7398191B2 (ja) | 2023-12-14 |
Family
ID=66646772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018195498A Active JP7398191B2 (ja) | 2017-11-17 | 2018-10-17 | 部品を装着するボンディングヘッド及び該ボンディングヘッドを備えているダイボンダ |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7398191B2 (ja) |
KR (1) | KR102661560B1 (ja) |
CN (1) | CN110011439B (ja) |
CH (2) | CH714351A1 (ja) |
TW (1) | TW201923940A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020235598A1 (ja) | 2019-05-23 | 2020-11-26 | 日本製鉄株式会社 | 2次コイルモジュール、移動焼入れ装置及び移動焼入れ方法 |
GB2591132A (en) * | 2020-01-17 | 2021-07-21 | Asm Assembly Systems Singapore Pte Ltd | Tooling pin placement system |
Citations (7)
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US5952744A (en) | 1996-03-28 | 1999-09-14 | Anoiad Corporation | Rotary-linear actuator |
JP2003319633A (ja) | 2002-04-23 | 2003-11-07 | Matsushita Electric Ind Co Ltd | ボイスコイル型モータおよび作業ヘッド |
JP2008251727A (ja) | 2007-03-29 | 2008-10-16 | Shibaura Mechatronics Corp | 電子部品の実装装置 |
JP2008288473A (ja) | 2007-05-21 | 2008-11-27 | Panasonic Corp | ワイヤボンディング方法およびワイヤボンディング装置 |
JP2014123731A (ja) | 2012-12-21 | 2014-07-03 | Vesi Switzerland Ag | 基板上に半導体チップを実装するための熱圧着ボンディング方法および装置 |
JP2015113868A (ja) | 2013-12-09 | 2015-06-22 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 流体圧アクチュエータ |
JP2017144516A (ja) | 2016-02-17 | 2017-08-24 | 株式会社ディスコ | 加工装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2979772B2 (ja) * | 1991-09-13 | 1999-11-15 | 松下電器産業株式会社 | ダイボンディング装置 |
JP2998467B2 (ja) * | 1992-12-04 | 2000-01-11 | 松下電器産業株式会社 | 電子部品の実装用ヘッド |
DE60336274D1 (de) * | 2003-08-25 | 2011-04-14 | Husky Injection Molding | Antriebsanordnung zum Drehen und Verschieben einer Welle |
US8651159B2 (en) * | 2009-06-12 | 2014-02-18 | Asm Assembly Automation Ltd | Die bonder providing a large bonding force |
CH707480B1 (de) * | 2013-01-21 | 2016-08-31 | Besi Switzerland Ag | Bondkopf mit einem heiz- und kühlbaren Saugorgan. |
CH707934B1 (de) * | 2013-04-19 | 2017-04-28 | Besi Switzerland Ag | Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat. |
US9726204B2 (en) * | 2013-12-09 | 2017-08-08 | Samsung Electronics Co., Ltd. | Fluid pressure actuator |
-
2017
- 2017-11-17 CH CH01396/17A patent/CH714351A1/de not_active Application Discontinuation
-
2018
- 2018-08-06 CH CH00957/18A patent/CH714384A2/de not_active Application Discontinuation
- 2018-10-17 JP JP2018195498A patent/JP7398191B2/ja active Active
- 2018-11-07 TW TW107139446A patent/TW201923940A/zh unknown
- 2018-11-13 CN CN201811346241.6A patent/CN110011439B/zh active Active
- 2018-11-14 KR KR1020180139732A patent/KR102661560B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5952744A (en) | 1996-03-28 | 1999-09-14 | Anoiad Corporation | Rotary-linear actuator |
JP2003319633A (ja) | 2002-04-23 | 2003-11-07 | Matsushita Electric Ind Co Ltd | ボイスコイル型モータおよび作業ヘッド |
JP2008251727A (ja) | 2007-03-29 | 2008-10-16 | Shibaura Mechatronics Corp | 電子部品の実装装置 |
JP2008288473A (ja) | 2007-05-21 | 2008-11-27 | Panasonic Corp | ワイヤボンディング方法およびワイヤボンディング装置 |
JP2014123731A (ja) | 2012-12-21 | 2014-07-03 | Vesi Switzerland Ag | 基板上に半導体チップを実装するための熱圧着ボンディング方法および装置 |
JP2015113868A (ja) | 2013-12-09 | 2015-06-22 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 流体圧アクチュエータ |
JP2017144516A (ja) | 2016-02-17 | 2017-08-24 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201923940A (zh) | 2019-06-16 |
CN110011439A (zh) | 2019-07-12 |
KR20190056985A (ko) | 2019-05-27 |
CH714351A1 (de) | 2019-05-31 |
KR102661560B1 (ko) | 2024-04-26 |
JP2019096867A (ja) | 2019-06-20 |
CN110011439B (zh) | 2023-10-17 |
CH714384A2 (de) | 2019-05-31 |
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