KR102661560B1 - 부품들을 장착하기 위한 본딩 헤드 및 그러한 본딩 헤드를 갖춘 다이 본더 - Google Patents

부품들을 장착하기 위한 본딩 헤드 및 그러한 본딩 헤드를 갖춘 다이 본더 Download PDF

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Publication number
KR102661560B1
KR102661560B1 KR1020180139732A KR20180139732A KR102661560B1 KR 102661560 B1 KR102661560 B1 KR 102661560B1 KR 1020180139732 A KR1020180139732 A KR 1020180139732A KR 20180139732 A KR20180139732 A KR 20180139732A KR 102661560 B1 KR102661560 B1 KR 102661560B1
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KR
South Korea
Prior art keywords
shaft
bonding head
axis
longitudinal direction
air
Prior art date
Application number
KR1020180139732A
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English (en)
Korean (ko)
Other versions
KR20190056985A (ko
Inventor
레네 크뢰네르트
Original Assignee
베시 스위처랜드 아게
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Application filed by 베시 스위처랜드 아게 filed Critical 베시 스위처랜드 아게
Publication of KR20190056985A publication Critical patent/KR20190056985A/ko
Application granted granted Critical
Publication of KR102661560B1 publication Critical patent/KR102661560B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/27—Rotor cores with permanent magnets
    • H02K1/2706—Inner rotors
    • H02K1/272—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis
    • H02K1/274—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets
    • H02K1/2753—Inner rotors the magnetisation axis of the magnets being perpendicular to the rotor axis the rotor consisting of two or more circumferentially positioned magnets the rotor consisting of magnets or groups of magnets arranged with alternating polarity
    • H02K1/276—Magnets embedded in the magnetic core, e.g. interior permanent magnets [IPM]
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/25—Devices for sensing temperature, or actuated thereby
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
    • H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75841—Means for moving parts of the bonding head
    • H01L2224/75842—Rotational mechanism

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
KR1020180139732A 2017-11-17 2018-11-14 부품들을 장착하기 위한 본딩 헤드 및 그러한 본딩 헤드를 갖춘 다이 본더 KR102661560B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH01396/17A CH714351A1 (de) 2017-11-17 2017-11-17 Bondkopf für die Montage von Bauelementen.
CH01396/17 2017-11-17
CH00957/18A CH714384A2 (de) 2017-11-17 2018-08-06 Bondkopf für die Montage von Bauelementen und Die Bonder mit einem solchen Bondkopf.
CH00957/18 2018-08-06

Publications (2)

Publication Number Publication Date
KR20190056985A KR20190056985A (ko) 2019-05-27
KR102661560B1 true KR102661560B1 (ko) 2024-04-26

Family

ID=66646772

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180139732A KR102661560B1 (ko) 2017-11-17 2018-11-14 부품들을 장착하기 위한 본딩 헤드 및 그러한 본딩 헤드를 갖춘 다이 본더

Country Status (5)

Country Link
JP (1) JP7398191B2 (ja)
KR (1) KR102661560B1 (ja)
CN (1) CN110011439B (ja)
CH (2) CH714351A1 (ja)
TW (1) TW201923940A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113891947B (zh) 2019-05-23 2023-06-13 日本制铁株式会社 次级线圈模块、移动淬火装置及移动淬火方法
GB2591132A (en) * 2020-01-17 2021-07-21 Asm Assembly Systems Singapore Pte Ltd Tooling pin placement system
JP2024080318A (ja) 2022-12-02 2024-06-13 三星電子株式会社 実装装置及び実装方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003319633A (ja) * 2002-04-23 2003-11-07 Matsushita Electric Ind Co Ltd ボイスコイル型モータおよび作業ヘッド

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JP2979772B2 (ja) * 1991-09-13 1999-11-15 松下電器産業株式会社 ダイボンディング装置
JP2998467B2 (ja) * 1992-12-04 2000-01-11 松下電器産業株式会社 電子部品の実装用ヘッド
US5952744A (en) * 1996-03-28 1999-09-14 Anoiad Corporation Rotary-linear actuator
JP4365370B2 (ja) * 2003-08-25 2009-11-18 ハスキー インジェクション モールディング システムズ リミテッド 軸を回転及び並進させるための駆動アセンブリ
JP5068571B2 (ja) 2007-03-29 2012-11-07 芝浦メカトロニクス株式会社 電子部品の実装装置
JP2008288473A (ja) 2007-05-21 2008-11-27 Panasonic Corp ワイヤボンディング方法およびワイヤボンディング装置
US8651159B2 (en) * 2009-06-12 2014-02-18 Asm Assembly Automation Ltd Die bonder providing a large bonding force
CH707378A1 (de) * 2012-12-21 2014-06-30 Besi Switzerland Ag Thermokompressionsverfahren und Vorrichtung für die Montage von Halbleiterchips auf einem Substrat.
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP6372031B2 (ja) 2013-12-09 2018-08-15 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 流体圧アクチュエータ
US9726204B2 (en) * 2013-12-09 2017-08-08 Samsung Electronics Co., Ltd. Fluid pressure actuator
JP6664986B2 (ja) * 2016-02-17 2020-03-13 株式会社ディスコ 加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003319633A (ja) * 2002-04-23 2003-11-07 Matsushita Electric Ind Co Ltd ボイスコイル型モータおよび作業ヘッド

Also Published As

Publication number Publication date
JP2019096867A (ja) 2019-06-20
CH714351A1 (de) 2019-05-31
JP7398191B2 (ja) 2023-12-14
KR20190056985A (ko) 2019-05-27
CN110011439B (zh) 2023-10-17
CN110011439A (zh) 2019-07-12
CH714384A2 (de) 2019-05-31
TW201923940A (zh) 2019-06-16

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