CH671653A5 - - Google Patents
Download PDFInfo
- Publication number
- CH671653A5 CH671653A5 CH4337/86A CH433786A CH671653A5 CH 671653 A5 CH671653 A5 CH 671653A5 CH 4337/86 A CH4337/86 A CH 4337/86A CH 433786 A CH433786 A CH 433786A CH 671653 A5 CH671653 A5 CH 671653A5
- Authority
- CH
- Switzerland
- Prior art keywords
- metal
- metal silicide
- silicon body
- bonding
- sintering
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
- H10W20/44—Conductive materials thereof
- H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
- H10W20/4432—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/063—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
- H10W20/44—Conductive materials thereof
- H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
- H10W20/4437—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being a transition metal
- H10W20/4441—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being a transition metal the principal metal being a refractory metal
Landscapes
- Ceramic Products (AREA)
- Electrodes Of Semiconductors (AREA)
- Pressure Sensors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH4337/86A CH671653A5 (enFirst) | 1986-11-03 | 1986-11-03 | |
| DE19873721929 DE3721929A1 (de) | 1986-11-03 | 1987-07-02 | Verfahren zur herstellung hermetisch dichter elektrischer leiterbahnen in halbleiterelementen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH4337/86A CH671653A5 (enFirst) | 1986-11-03 | 1986-11-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH671653A5 true CH671653A5 (enFirst) | 1989-09-15 |
Family
ID=4274212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH4337/86A CH671653A5 (enFirst) | 1986-11-03 | 1986-11-03 |
Country Status (2)
| Country | Link |
|---|---|
| CH (1) | CH671653A5 (enFirst) |
| DE (1) | DE3721929A1 (enFirst) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19741924C2 (de) * | 1997-09-23 | 2000-03-02 | Siemens Ag | Verfahren zum elektrochemischen Verbinden und Verbundteil |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1138401A (en) * | 1965-05-06 | 1969-01-01 | Mallory & Co Inc P R | Bonding |
-
1986
- 1986-11-03 CH CH4337/86A patent/CH671653A5/de not_active IP Right Cessation
-
1987
- 1987-07-02 DE DE19873721929 patent/DE3721929A1/de active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE3721929C2 (enFirst) | 1990-02-08 |
| DE3721929A1 (de) | 1988-05-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased | ||
| PL | Patent ceased |