CH660275A5 - Verfahren zum herstellen eines mit einem verbindungsnetzwerk versehenen bauteils und nach dem verfahren hergestelltes bauteil. - Google Patents

Verfahren zum herstellen eines mit einem verbindungsnetzwerk versehenen bauteils und nach dem verfahren hergestelltes bauteil. Download PDF

Info

Publication number
CH660275A5
CH660275A5 CH2234/82A CH223482A CH660275A5 CH 660275 A5 CH660275 A5 CH 660275A5 CH 2234/82 A CH2234/82 A CH 2234/82A CH 223482 A CH223482 A CH 223482A CH 660275 A5 CH660275 A5 CH 660275A5
Authority
CH
Switzerland
Prior art keywords
layer
conductor
network
points
carrier
Prior art date
Application number
CH2234/82A
Other languages
German (de)
English (en)
Inventor
Charles L Lassen
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of CH660275A5 publication Critical patent/CH660275A5/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CH2234/82A 1981-04-14 1982-04-13 Verfahren zum herstellen eines mit einem verbindungsnetzwerk versehenen bauteils und nach dem verfahren hergestelltes bauteil. CH660275A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/254,132 US4500389A (en) 1981-04-14 1981-04-14 Process for the manufacture of substrates to interconnect electronic components

Publications (1)

Publication Number Publication Date
CH660275A5 true CH660275A5 (de) 1987-03-31

Family

ID=22963047

Family Applications (1)

Application Number Title Priority Date Filing Date
CH2234/82A CH660275A5 (de) 1981-04-14 1982-04-13 Verfahren zum herstellen eines mit einem verbindungsnetzwerk versehenen bauteils und nach dem verfahren hergestelltes bauteil.

Country Status (13)

Country Link
US (1) US4500389A (OSRAM)
JP (1) JPS5979594A (OSRAM)
AT (1) AT385624B (OSRAM)
AU (1) AU559827B2 (OSRAM)
CA (1) CA1189196A (OSRAM)
CH (1) CH660275A5 (OSRAM)
DE (1) DE3211025A1 (OSRAM)
ES (3) ES8304363A1 (OSRAM)
FR (1) FR2503931B1 (OSRAM)
GB (2) GB2096834B (OSRAM)
IT (1) IT1147672B (OSRAM)
NL (1) NL191641C (OSRAM)
SE (1) SE449678B (OSRAM)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3373610D1 (en) * 1982-12-22 1987-10-15 Ibm Method and apparatus for embedding wire in a photocurable adhesive
EP0168602A1 (en) * 1984-06-25 1986-01-22 Kollmorgen Technologies Corporation Method for making interconnection circuit boards
US4581098A (en) * 1984-10-19 1986-04-08 International Business Machines Corporation MLC green sheet process
GB2168857A (en) * 1984-11-14 1986-06-25 Int Standard Electric Corp Method and structure for interconnecting high frequency components
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4743710A (en) * 1985-10-18 1988-05-10 Kollmorgen Technologies Corporation Coaxial interconnection boards
US4679321A (en) * 1985-10-18 1987-07-14 Kollmorgen Technologies Corporation Method for making coaxial interconnection boards
US4972050A (en) * 1989-06-30 1990-11-20 Kollmorgen Corporation Wire scribed circuit boards and methods of their manufacture
JP2811811B2 (ja) * 1989-10-03 1998-10-15 三菱電機株式会社 液晶表示装置
DE69122570T2 (de) * 1990-07-25 1997-02-13 Hitachi Chemical Co Ltd Leiterplatte mit Verbindung von Koaxialleitern untereinander
DE4037488A1 (de) * 1990-11-24 1992-05-27 Bosch Gmbh Robert Leistungsbausteine mit elektrisch isolierender thermischer ankopplung
US6211485B1 (en) 1996-06-05 2001-04-03 Larry W. Burgess Blind via laser drilling system
US6631558B2 (en) 1996-06-05 2003-10-14 Laservia Corporation Blind via laser drilling system
US7062845B2 (en) 1996-06-05 2006-06-20 Laservia Corporation Conveyorized blind microvia laser drilling system
US6005991A (en) * 1997-11-26 1999-12-21 Us Conec Ltd Printed circuit board assembly having a flexible optical circuit and associated fabrication method
DE102006059127A1 (de) 2006-09-25 2008-03-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Anordnung optoelektronischer Bauelemente und Anordnung optoelektronischer Bauelemente
DE102012223077A1 (de) * 2012-12-13 2014-06-18 Robert Bosch Gmbh Kontaktanordnung für einen mehrlagigen Schaltungsträger

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE394600B (sv) * 1967-03-17 1977-07-04 Thams J P B Forfarande for framstellning av en beleggning med onskad ytstruktur pa ett foremal
US3499219A (en) * 1967-11-06 1970-03-10 Bunker Ramo Interconnection means and method of fabrication thereof
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
DE1690347A1 (de) * 1968-02-24 1971-05-13 Telefunken Patent Verfahren zur Herstellung einer Verdrahtungsplatte
US3674602A (en) * 1969-10-09 1972-07-04 Photocircuits Corp Apparatus for making wire scribed circuit boards
JPS5550399B1 (OSRAM) * 1970-03-05 1980-12-17
GB1379558A (en) * 1971-05-15 1975-01-02 Int Computers Ltd Methods of manufacture of multilayer circuit structures
CA1001320A (en) * 1972-02-28 1976-12-07 Robert P. Burr Electric wiring assemblies
US4030190A (en) * 1976-03-30 1977-06-21 International Business Machines Corporation Method for forming a multilayer printed circuit board
ZA781637B (en) * 1977-06-20 1979-02-28 Kollmorgen Tech Corp Wire scribed circuit board and method for the manufacture thereof
ZA775455B (en) * 1977-08-09 1978-07-26 Kollmorgen Tech Corp Improved methods and apparatus for making scribed circuit boards
US4258468A (en) * 1978-12-14 1981-03-31 Western Electric Company, Inc. Forming vias through multilayer circuit boards
JPS5810893A (ja) * 1981-07-14 1983-01-21 日本電気株式会社 配線板およびその製造方法
JPS5857782A (ja) * 1981-10-01 1983-04-06 日本電気株式会社 配線板およびその製造方法
DE3373610D1 (en) * 1982-12-22 1987-10-15 Ibm Method and apparatus for embedding wire in a photocurable adhesive

Also Published As

Publication number Publication date
ES511413A0 (es) 1983-03-01
SE449678B (sv) 1987-05-11
AT385624B (de) 1988-04-25
ATA116582A (de) 1987-09-15
NL191641C (nl) 1995-11-20
US4500389A (en) 1985-02-19
GB2146177A (en) 1985-04-11
CA1189196A (en) 1985-06-18
DE3211025C2 (OSRAM) 1991-11-21
ES8304363A1 (es) 1983-03-01
GB2096834A (en) 1982-10-20
FR2503931A1 (fr) 1982-10-15
SE8202170L (sv) 1982-10-15
NL8201570A (nl) 1982-11-01
ES513838A0 (es) 1985-03-16
FR2503931B1 (fr) 1986-02-21
ES8503920A1 (es) 1985-03-16
AU559827B2 (en) 1987-03-19
GB2096834B (en) 1985-10-23
IT8248207A0 (it) 1982-04-09
AU8793982A (en) 1984-03-08
ES8400213A1 (es) 1983-11-01
ES513839A0 (es) 1983-11-01
NL191641B (nl) 1995-07-17
GB8422466D0 (en) 1984-10-10
JPS5979594A (ja) 1984-05-08
GB2146177B (en) 1985-10-23
DE3211025A1 (de) 1982-10-21
IT1147672B (it) 1986-11-26

Similar Documents

Publication Publication Date Title
DE3211025A1 (de) Verbindungsnetzwerk fuer bauelemente und verfahren zu dessen herstellung
DE69007452T2 (de) Mehrlagenschaltungsstruktur.
DE602005001932T2 (de) Verfahren zur herstellung eines schaltungsträgers und verwendung des verfahrens
DE3635800C2 (OSRAM)
DE3624627A1 (de) Verfahren zum herstellen von drahtgeschriebenen leiterplatten
DE2911620A1 (de) Verfahren zum herstellen von leitenden durchgehenden bohrungen in schaltungsplatten
DE3639420A1 (de) Elektrisches verbindungsbauteil und verfahren zu dessen herstellung
DE112005000952T5 (de) Elektronik-Modul und Verfahren zur Herstellung desselben
DE3824008A1 (de) Elektronische schaltung sowie verfahren zu deren herstellung
DE3700910A1 (de) Verfahren zum aufbau elektrischer schaltungen auf einer grundplatte
EP1169893B1 (de) Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
DE3635799C2 (OSRAM)
EP0166105B1 (de) Flexible Leiterplatte und Verfahren zu ihrer Herstellung
DE69723801T2 (de) Herstellungsverfahren einer Kontaktgitter-Halbleiterpackung
CH543218A (de) Verfahren zum Herstellen einer gedruckten Schaltung auf einem Metallkern
EP0968631B1 (de) Verfahren zur bildung metallischer leitermuster auf elektrisch isolierenden unterlagen
WO1993003593A1 (de) Elektrische verbindung, insbesondere durchkontaktierung bei einer leiterplatte
DE1142926B (de) Verfahren zur Herstellung gedruckter Schaltungsplatten
DE69837840T2 (de) Verfahren zur herstellung einer gedruckten leiterplatte
DE69803664T2 (de) Verfahren zur herstellung von gedruckten leiterplatten und so hergestellte gedruckte leiterplatten
DE1937508C3 (de) Verfahren zur Herstellung eines mit elektrischen Leitungsbahnen und/oder elektrischen Durchkontaktierungen versehenen Isolierstoffträgers
EP4342267A1 (de) Verfahren zur herstellung einer leiterplatte und leiterplatte mit mindestens einem eingebetteten elektronischen bauteil
WO1985000085A1 (fr) Carte imprimee pour le montage en surface de circuits integres miniature et procede de fabrication de telles cartes imprimees
CH658157A5 (de) Verfahren zum herstellen von leiterplatten mit mindestens zwei leiterzugebenen.
DE1665395B1 (de) Verfahren zur herstellung gedruckter leiterplatten

Legal Events

Date Code Title Description
PUE Assignment

Owner name: KOLLMORGEN CORPORATION

PUE Assignment

Owner name: ADVANCED INTERCONNECTION TECHNOLOGY, INC.

PL Patent ceased