CH659753A5 - Verfahren und vorrichtung zum herstellen von leiterplatten. - Google Patents
Verfahren und vorrichtung zum herstellen von leiterplatten. Download PDFInfo
- Publication number
- CH659753A5 CH659753A5 CH2557/83A CH255783A CH659753A5 CH 659753 A5 CH659753 A5 CH 659753A5 CH 2557/83 A CH2557/83 A CH 2557/83A CH 255783 A CH255783 A CH 255783A CH 659753 A5 CH659753 A5 CH 659753A5
- Authority
- CH
- Switzerland
- Prior art keywords
- screen printing
- film
- perforations
- screen
- metal
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 27
- 238000007650 screen-printing Methods 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 11
- 238000011049 filling Methods 0.000 claims description 11
- 239000011888 foil Substances 0.000 claims description 8
- 239000003973 paint Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 2
- 238000005553 drilling Methods 0.000 claims 1
- 239000002985 plastic film Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 239000010410 layer Substances 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000007605 air drying Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000000454 electroless metal deposition Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- GJCXHYNLSNVSQZ-UHFFFAOYSA-L [Cu](Cl)Cl.Cl Chemical compound [Cu](Cl)Cl.Cl GJCXHYNLSNVSQZ-UHFFFAOYSA-L 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3217983A DE3217983C2 (de) | 1982-05-13 | 1982-05-13 | Verfahren zum Herstellen einer Abdeckmaske |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH659753A5 true CH659753A5 (de) | 1987-02-13 |
Family
ID=6163461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH2557/83A CH659753A5 (de) | 1982-05-13 | 1983-05-10 | Verfahren und vorrichtung zum herstellen von leiterplatten. |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS58206192A (da) |
| CA (1) | CA1196731A (da) |
| CH (1) | CH659753A5 (da) |
| DE (1) | DE3217983C2 (da) |
| DK (1) | DK210983A (da) |
| GB (1) | GB2120017B (da) |
| IT (1) | IT1197651B (da) |
| NL (1) | NL8301586A (da) |
| SE (1) | SE8302619L (da) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3514093A1 (de) * | 1985-04-16 | 1986-10-23 | Kaspar 5241 Gebhardshain Eidenberg | Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen |
| US4748742A (en) * | 1986-11-26 | 1988-06-07 | Multitek Corporation | Method for temporarily sealing holes in printed circuit boards |
| US4884337A (en) * | 1986-11-26 | 1989-12-05 | Epicor Technology, Inc. | Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material |
| US6276055B1 (en) | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| AU2001274958A1 (en) | 2000-05-31 | 2001-12-11 | Honeywell International, Inc. | Filling method |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| AU2001264968A1 (en) | 2000-05-31 | 2001-12-11 | Honeywell International, Inc. | Filling device |
| CN110557889A (zh) * | 2018-05-30 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | 一种铝片网版塞孔的制作方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1249966B (de) * | 1967-09-14 | Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) | Verfahren zum Herstellen von metallisierten Wandungen von Bohrungen in gedruckten Leiterplatten | |
| GB1042234A (en) * | 1965-03-05 | 1966-09-14 | Mullard Ltd | Multilayer printed circuits |
| GB1194853A (en) * | 1967-02-16 | 1970-06-17 | Btr Industries Ltd | A Method of Forming Printed Circuits |
| JPS52118261A (en) * | 1976-03-30 | 1977-10-04 | Matsushita Electric Ind Co Ltd | Method of producing through hole printed circuit board |
| JPS5658797A (en) * | 1979-10-18 | 1981-05-21 | Yashima Denki Kk | Ac power control circuit in induction motor |
| JPS5667985A (en) * | 1979-11-08 | 1981-06-08 | Matsushita Electric Ind Co Ltd | Method of printing ink using metal mask |
-
1982
- 1982-05-13 DE DE3217983A patent/DE3217983C2/de not_active Expired
-
1983
- 1983-05-03 GB GB08312009A patent/GB2120017B/en not_active Expired
- 1983-05-04 NL NL8301586A patent/NL8301586A/nl not_active Application Discontinuation
- 1983-05-06 SE SE8302619A patent/SE8302619L/xx not_active Application Discontinuation
- 1983-05-10 JP JP58083445A patent/JPS58206192A/ja active Pending
- 1983-05-10 CH CH2557/83A patent/CH659753A5/de not_active IP Right Cessation
- 1983-05-11 DK DK210983A patent/DK210983A/da not_active Application Discontinuation
- 1983-05-13 CA CA000428115A patent/CA1196731A/en not_active Expired
- 1983-05-13 IT IT48288/83A patent/IT1197651B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| DK210983A (da) | 1983-11-14 |
| IT1197651B (it) | 1988-12-06 |
| DK210983D0 (da) | 1983-05-11 |
| JPS58206192A (ja) | 1983-12-01 |
| IT8348288A0 (it) | 1983-05-13 |
| GB8312009D0 (en) | 1983-06-08 |
| NL8301586A (nl) | 1983-12-01 |
| SE8302619L (sv) | 1983-11-14 |
| GB2120017A (en) | 1983-11-23 |
| DE3217983A1 (de) | 1983-11-17 |
| SE8302619D0 (sv) | 1983-05-06 |
| GB2120017B (en) | 1986-02-19 |
| DE3217983C2 (de) | 1984-03-29 |
| CA1196731A (en) | 1985-11-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |