CH649579A5 - Elektroplattierungsbad fuer das vernickeln unter verwendung von unloeslichen anoden. - Google Patents
Elektroplattierungsbad fuer das vernickeln unter verwendung von unloeslichen anoden. Download PDFInfo
- Publication number
- CH649579A5 CH649579A5 CH6755/81A CH675581A CH649579A5 CH 649579 A5 CH649579 A5 CH 649579A5 CH 6755/81 A CH6755/81 A CH 6755/81A CH 675581 A CH675581 A CH 675581A CH 649579 A5 CH649579 A5 CH 649579A5
- Authority
- CH
- Switzerland
- Prior art keywords
- nickel
- electroplating
- electroplating bath
- anodes
- bath
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title description 36
- 238000009713 electroplating Methods 0.000 title description 22
- 229910052759 nickel Inorganic materials 0.000 title description 16
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 12
- 239000004327 boric acid Substances 0.000 description 6
- SHHKMWMIKILKQW-UHFFFAOYSA-N 2-formylbenzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1C=O SHHKMWMIKILKQW-UHFFFAOYSA-N 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 150000002815 nickel Chemical class 0.000 description 4
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 4
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 4
- 239000000080 wetting agent Substances 0.000 description 4
- PQMFVUNERGGBPG-UHFFFAOYSA-N (6-bromopyridin-2-yl)hydrazine Chemical compound NNC1=CC=CC(Br)=N1 PQMFVUNERGGBPG-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 2
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229960003975 potassium Drugs 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- -1 potassium perfluoroalkyl sulfonates Chemical class 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Cosmetics (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19989480A | 1980-10-23 | 1980-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH649579A5 true CH649579A5 (de) | 1985-05-31 |
Family
ID=22739453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH6755/81A CH649579A5 (de) | 1980-10-23 | 1981-10-22 | Elektroplattierungsbad fuer das vernickeln unter verwendung von unloeslichen anoden. |
Country Status (15)
| Country | Link |
|---|---|
| JP (1) | JPS6020475B2 (da) |
| AU (1) | AU527954B2 (da) |
| BE (1) | BE890836A (da) |
| BR (1) | BR8106819A (da) |
| CA (1) | CA1180677A (da) |
| CH (1) | CH649579A5 (da) |
| DE (1) | DE3139641C2 (da) |
| DK (1) | DK422181A (da) |
| ES (1) | ES8302802A1 (da) |
| FR (1) | FR2492849A1 (da) |
| GB (1) | GB2085924B (da) |
| HK (1) | HK66786A (da) |
| IT (1) | IT1171598B (da) |
| NL (1) | NL8104808A (da) |
| SE (1) | SE8106250L (da) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1162505A (en) * | 1980-10-31 | 1984-02-21 | Donald R. Rosegren | Process for high speed nickel and gold electroplate system |
| US4543166A (en) * | 1984-10-01 | 1985-09-24 | Omi International Corporation | Zinc-alloy electrolyte and process |
| JP4904933B2 (ja) * | 2005-09-27 | 2012-03-28 | 日立電線株式会社 | ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔 |
| KR102281132B1 (ko) * | 2019-10-24 | 2021-07-26 | 일진머티리얼즈 주식회사 | 박막형 커패시터 제조용 전해니켈박 및 그의 제조방법 |
| CN112323096A (zh) * | 2020-09-23 | 2021-02-05 | 河北东恩企业管理咨询有限公司 | 一种含硫镍圆饼的制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3334032A (en) * | 1964-05-08 | 1967-08-01 | Hanson Van Winkle Munning Co | Electrodeposition of nickel |
| US3697391A (en) * | 1970-07-17 | 1972-10-10 | M & T Chemicals Inc | Electroplating processes and compositions |
| ZA721964B (en) * | 1971-04-01 | 1972-12-27 | M & T Chemicals Inc | Nickel plating |
-
1981
- 1981-09-24 DK DK422181A patent/DK422181A/da not_active Application Discontinuation
- 1981-09-25 AU AU75676/81A patent/AU527954B2/en not_active Ceased
- 1981-09-25 CA CA000386693A patent/CA1180677A/en not_active Expired
- 1981-10-06 DE DE3139641A patent/DE3139641C2/de not_active Expired
- 1981-10-09 ES ES506173A patent/ES8302802A1/es not_active Expired
- 1981-10-13 JP JP56163363A patent/JPS6020475B2/ja not_active Expired
- 1981-10-21 IT IT49529/81A patent/IT1171598B/it active
- 1981-10-22 BR BR8106819A patent/BR8106819A/pt not_active IP Right Cessation
- 1981-10-22 FR FR8119853A patent/FR2492849A1/fr active Granted
- 1981-10-22 BE BE0/206326A patent/BE890836A/fr not_active IP Right Cessation
- 1981-10-22 SE SE8106250A patent/SE8106250L/ unknown
- 1981-10-22 CH CH6755/81A patent/CH649579A5/de not_active IP Right Cessation
- 1981-10-23 NL NL8104808A patent/NL8104808A/nl not_active Application Discontinuation
- 1981-10-23 GB GB8132066A patent/GB2085924B/en not_active Expired
-
1986
- 1986-09-11 HK HK667/86A patent/HK66786A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| IT1171598B (it) | 1987-06-10 |
| DK422181A (da) | 1982-04-24 |
| DE3139641C2 (de) | 1986-07-31 |
| JPS5794589A (en) | 1982-06-12 |
| IT8149529A0 (it) | 1981-10-21 |
| BE890836A (fr) | 1982-04-22 |
| FR2492849A1 (fr) | 1982-04-30 |
| NL8104808A (nl) | 1982-05-17 |
| ES506173A0 (es) | 1983-01-16 |
| DE3139641A1 (de) | 1982-09-30 |
| HK66786A (en) | 1986-09-18 |
| AU527954B2 (en) | 1983-03-31 |
| CA1180677A (en) | 1985-01-08 |
| ES8302802A1 (es) | 1983-01-16 |
| BR8106819A (pt) | 1982-07-06 |
| SE8106250L (sv) | 1982-04-24 |
| GB2085924A (en) | 1982-05-06 |
| AU7567681A (en) | 1982-04-29 |
| GB2085924B (en) | 1983-06-02 |
| FR2492849B1 (da) | 1984-11-23 |
| JPS6020475B2 (ja) | 1985-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2103717B1 (de) | Pyrophosphat-basiertes Bad zur Abscheidung von Zinn-Legierungsschichten | |
| EP2130948B1 (de) | Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen | |
| DE2810523C2 (de) | Verfahren zur Herstellung eines Basismaterials für gedruckte Schaltkreise | |
| DE2708043A1 (de) | Plattierte metallische kathode | |
| CH647269A5 (de) | Plattierungsloesung fuer die ablagerung einer palladium/nickel-legierung. | |
| DE1496843A1 (de) | Elektroabscheidungsverfahren | |
| DE4023444A1 (de) | Cyanid-freies verfahren zur herstellung eines galvanischen kupferueberzuges | |
| DE69933533T2 (de) | Kupferfolie mit einer glänzenden Oberfläche mit hoher Oxidationsbeständigkeit und Verfahren zur Herstellung | |
| DE19741990C1 (de) | Elektrolyt zur galvanischen Abscheidung von spannungsarmen, rißfesten Rutheniumschichten, Verfahren zur Herstellung und Verwendung | |
| DE3402554C2 (da) | ||
| DE2751056A1 (de) | Verfahren und bad zur galvanischen abscheidung einer gold-kobalt-legierung | |
| DE1671426A1 (de) | Elektrode und Verfahren zu ihrer Herstellung | |
| CH649579A5 (de) | Elektroplattierungsbad fuer das vernickeln unter verwendung von unloeslichen anoden. | |
| DE3139815C2 (de) | Verfahren zur galvanischen Herstellung eines einen Metallhärter enthaltenden Goldüberzugs | |
| DE3530223C2 (da) | ||
| DE1956144C2 (de) | Wässriges saures Bad zur galvanischen Abscheidung eines Zinnüberzugs und Verfahren hierzu | |
| DE3122390A1 (de) | "waessriges galvanisches bad und verfahren zur abscheidung einer eine chromauflage vortaeuschenden kobalt-zink-legierung" | |
| DE3509367C1 (de) | Bad und Verfahren zur galvanischen Abscheidung von Gold/Zinn-Legierungsueberzuegen | |
| US4411744A (en) | Bath and process for high speed nickel electroplating | |
| DE3108466C2 (de) | Verwendung eines Acetylenalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung | |
| DE3219666A1 (de) | Bad zur galvanischen abscheidung von ruthenium auf einem substrat und ein verfahren zur abscheidung von ruthenium auf einem substrat mit diesem bad | |
| DE2333096C3 (de) | Galvanisch aufgebrachter mehrschichtiger Metallüberzug und Verfahren zu seiner Herstellung | |
| EP1997939B1 (de) | Hydraulikzylinder sowie dessen Herstellungsverfahren | |
| DE2948999C2 (de) | Wässriges, saures Bad zur galvanischen Abscheidung von Gold und Verfahren zur galvanischen Abscheidung von Hartgold unter seiner Verwendung | |
| WO1997035049A1 (de) | Bad und verfahren für die galvanische abscheidung von halbglanznickel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |