JPS5794589A - Rapid electroplating bath and method - Google Patents
Rapid electroplating bath and methodInfo
- Publication number
- JPS5794589A JPS5794589A JP56163363A JP16336381A JPS5794589A JP S5794589 A JPS5794589 A JP S5794589A JP 56163363 A JP56163363 A JP 56163363A JP 16336381 A JP16336381 A JP 16336381A JP S5794589 A JPS5794589 A JP S5794589A
- Authority
- JP
- Japan
- Prior art keywords
- electroplating bath
- rapid electroplating
- rapid
- bath
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Cosmetics (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19989480A | 1980-10-23 | 1980-10-23 | |
US199894 | 1980-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5794589A true JPS5794589A (en) | 1982-06-12 |
JPS6020475B2 JPS6020475B2 (en) | 1985-05-22 |
Family
ID=22739453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56163363A Expired JPS6020475B2 (en) | 1980-10-23 | 1981-10-13 | High-speed electroplating bath and plating method |
Country Status (15)
Country | Link |
---|---|
JP (1) | JPS6020475B2 (en) |
AU (1) | AU527954B2 (en) |
BE (1) | BE890836A (en) |
BR (1) | BR8106819A (en) |
CA (1) | CA1180677A (en) |
CH (1) | CH649579A5 (en) |
DE (1) | DE3139641C2 (en) |
DK (1) | DK422181A (en) |
ES (1) | ES8302802A1 (en) |
FR (1) | FR2492849A1 (en) |
GB (1) | GB2085924B (en) |
HK (1) | HK66786A (en) |
IT (1) | IT1171598B (en) |
NL (1) | NL8104808A (en) |
SE (1) | SE8106250L (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007119902A (en) * | 2005-09-27 | 2007-05-17 | Hitachi Cable Ltd | Nickel plating solution and its preparation method, nickel plating method, and printed wiring board copper foil |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1162505A (en) * | 1980-10-31 | 1984-02-21 | Donald R. Rosegren | Process for high speed nickel and gold electroplate system |
US4543166A (en) * | 1984-10-01 | 1985-09-24 | Omi International Corporation | Zinc-alloy electrolyte and process |
KR102281132B1 (en) * | 2019-10-24 | 2021-07-26 | 일진머티리얼즈 주식회사 | Electrolytic Nickel Foil for Thin Film-type Capacitor and Production Method of the Same |
CN112323096A (en) * | 2020-09-23 | 2021-02-05 | 河北东恩企业管理咨询有限公司 | Preparation method of sulfur-nickel-containing round cake |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3334032A (en) * | 1964-05-08 | 1967-08-01 | Hanson Van Winkle Munning Co | Electrodeposition of nickel |
US3697391A (en) * | 1970-07-17 | 1972-10-10 | M & T Chemicals Inc | Electroplating processes and compositions |
ZA721964B (en) * | 1971-04-01 | 1972-12-27 | M & T Chemicals Inc | Nickel plating |
-
1981
- 1981-09-24 DK DK422181A patent/DK422181A/en not_active Application Discontinuation
- 1981-09-25 CA CA000386693A patent/CA1180677A/en not_active Expired
- 1981-09-25 AU AU75676/81A patent/AU527954B2/en not_active Ceased
- 1981-10-06 DE DE3139641A patent/DE3139641C2/en not_active Expired
- 1981-10-09 ES ES506173A patent/ES8302802A1/en not_active Expired
- 1981-10-13 JP JP56163363A patent/JPS6020475B2/en not_active Expired
- 1981-10-21 IT IT49529/81A patent/IT1171598B/en active
- 1981-10-22 BR BR8106819A patent/BR8106819A/en not_active IP Right Cessation
- 1981-10-22 SE SE8106250A patent/SE8106250L/en unknown
- 1981-10-22 BE BE0/206326A patent/BE890836A/en not_active IP Right Cessation
- 1981-10-22 CH CH6755/81A patent/CH649579A5/en not_active IP Right Cessation
- 1981-10-22 FR FR8119853A patent/FR2492849A1/en active Granted
- 1981-10-23 GB GB8132066A patent/GB2085924B/en not_active Expired
- 1981-10-23 NL NL8104808A patent/NL8104808A/en not_active Application Discontinuation
-
1986
- 1986-09-11 HK HK667/86A patent/HK66786A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007119902A (en) * | 2005-09-27 | 2007-05-17 | Hitachi Cable Ltd | Nickel plating solution and its preparation method, nickel plating method, and printed wiring board copper foil |
Also Published As
Publication number | Publication date |
---|---|
ES506173A0 (en) | 1983-01-16 |
BR8106819A (en) | 1982-07-06 |
DK422181A (en) | 1982-04-24 |
IT8149529A0 (en) | 1981-10-21 |
HK66786A (en) | 1986-09-18 |
NL8104808A (en) | 1982-05-17 |
SE8106250L (en) | 1982-04-24 |
GB2085924A (en) | 1982-05-06 |
BE890836A (en) | 1982-04-22 |
IT1171598B (en) | 1987-06-10 |
GB2085924B (en) | 1983-06-02 |
FR2492849A1 (en) | 1982-04-30 |
FR2492849B1 (en) | 1984-11-23 |
DE3139641C2 (en) | 1986-07-31 |
ES8302802A1 (en) | 1983-01-16 |
DE3139641A1 (en) | 1982-09-30 |
CA1180677A (en) | 1985-01-08 |
AU527954B2 (en) | 1983-03-31 |
CH649579A5 (en) | 1985-05-31 |
AU7567681A (en) | 1982-04-29 |
JPS6020475B2 (en) | 1985-05-22 |
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