CH619073A5 - - Google Patents

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Publication number
CH619073A5
CH619073A5 CH202776A CH202776A CH619073A5 CH 619073 A5 CH619073 A5 CH 619073A5 CH 202776 A CH202776 A CH 202776A CH 202776 A CH202776 A CH 202776A CH 619073 A5 CH619073 A5 CH 619073A5
Authority
CH
Switzerland
Prior art keywords
solders
tin
cadmium
soft
semiconductor
Prior art date
Application number
CH202776A
Other languages
German (de)
English (en)
Inventor
Helmuth Froloff
Theodor Tovar
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of CH619073A5 publication Critical patent/CH619073A5/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
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    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
CH202776A 1975-04-05 1976-02-19 CH619073A5 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2514922A DE2514922C2 (de) 1975-04-05 1975-04-05 Gegen thermische Wechselbelastung beständiges Halbleiterbauelement

Publications (1)

Publication Number Publication Date
CH619073A5 true CH619073A5 (en:Method) 1980-08-29

Family

ID=5943167

Family Applications (1)

Application Number Title Priority Date Filing Date
CH202776A CH619073A5 (en:Method) 1975-04-05 1976-02-19

Country Status (5)

Country Link
US (1) US4005454A (en:Method)
BR (1) BR7602045A (en:Method)
CH (1) CH619073A5 (en:Method)
DE (1) DE2514922C2 (en:Method)
GB (2) GB1548756A (en:Method)

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WO1980001967A1 (en) * 1979-03-08 1980-09-18 Gen Electric Thermo-compression bonding a semiconductor to strain buffer
US4498096A (en) * 1981-01-30 1985-02-05 Motorola, Inc. Button rectifier package for non-planar die
JPS59193036A (ja) * 1983-04-16 1984-11-01 Toshiba Corp 半導体装置の製造方法
DE3513530A1 (de) * 1984-06-01 1985-12-05 Bbc Brown Boveri & Cie Verfahren zur herstellung von leistungshalbleitermodulen mit isoliertem aufbau
US4954870A (en) * 1984-12-28 1990-09-04 Kabushiki Kaisha Toshiba Semiconductor device
DE3736671C1 (en) * 1987-10-29 1989-06-08 Semikron Elektronik Gmbh Method for producing semiconductor components
DE4107660C2 (de) * 1991-03-09 1995-05-04 Bosch Gmbh Robert Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen
US5441576A (en) * 1993-02-01 1995-08-15 Bierschenk; James L. Thermoelectric cooler
GB2300375B (en) * 1994-08-01 1998-02-25 Nippon Denso Co Bonding method for electric element
JP3271475B2 (ja) * 1994-08-01 2002-04-02 株式会社デンソー 電気素子の接合材料および接合方法
DE19632378B4 (de) * 1996-08-10 2007-01-25 Robert Bosch Gmbh Diffusionslötverbindung und Verfahren zur Herstellung von Diffusionslötverbindungen
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
KR20010090720A (ko) 1998-09-03 2001-10-19 추후제출 비례 마이크로기계 장치
US6523560B1 (en) 1998-09-03 2003-02-25 General Electric Corporation Microvalve with pressure equalization
US7011378B2 (en) 1998-09-03 2006-03-14 Ge Novasensor, Inc. Proportional micromechanical valve
US6139979A (en) * 1999-01-28 2000-10-31 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
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US6845962B1 (en) * 2000-03-22 2005-01-25 Kelsey-Hayes Company Thermally actuated microvalve device
US6505811B1 (en) 2000-06-27 2003-01-14 Kelsey-Hayes Company High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate
US6897567B2 (en) * 2000-07-31 2005-05-24 Romh Co., Ltd. Method of making wireless semiconductor device, and leadframe used therefor
US20070251586A1 (en) * 2003-11-24 2007-11-01 Fuller Edward N Electro-pneumatic control valve with microvalve pilot
US8011388B2 (en) * 2003-11-24 2011-09-06 Microstaq, INC Thermally actuated microvalve with multiple fluid ports
KR20060109959A (ko) * 2003-11-24 2006-10-23 알루미나 마이크로 엘엘씨 가변형 변위 압축기 제어용 마이크로밸브 장치
EP1723359A2 (en) * 2004-02-27 2006-11-22 Alumina Micro LLC Hybrid micro/macro plate valve
US7803281B2 (en) * 2004-03-05 2010-09-28 Microstaq, Inc. Selective bonding for forming a microvalve
US7181919B2 (en) * 2004-03-31 2007-02-27 Denso Corporation System utilizing waste heat of internal combustion engine
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US4005454A (en) 1977-01-25
DE2514922C2 (de) 1983-01-27
BR7602045A (pt) 1976-10-05
GB1548755A (en) 1979-07-18
GB1548756A (en) 1979-07-18
DE2514922A1 (de) 1976-10-14

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