BR7602045A - Elemento construtivo semicondutor - Google Patents

Elemento construtivo semicondutor

Info

Publication number
BR7602045A
BR7602045A BR7602045A BR7602045A BR7602045A BR 7602045 A BR7602045 A BR 7602045A BR 7602045 A BR7602045 A BR 7602045A BR 7602045 A BR7602045 A BR 7602045A BR 7602045 A BR7602045 A BR 7602045A
Authority
BR
Brazil
Prior art keywords
semiconductor
constructive element
constructive
semiconductor constructive
Prior art date
Application number
BR7602045A
Other languages
English (en)
Inventor
H Froloff
T Tovar
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of BR7602045A publication Critical patent/BR7602045A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
BR7602045A 1975-04-05 1976-04-02 Elemento construtivo semicondutor BR7602045A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2514922A DE2514922C2 (de) 1975-04-05 1975-04-05 Gegen thermische Wechselbelastung beständiges Halbleiterbauelement

Publications (1)

Publication Number Publication Date
BR7602045A true BR7602045A (pt) 1976-10-05

Family

ID=5943167

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7602045A BR7602045A (pt) 1975-04-05 1976-04-02 Elemento construtivo semicondutor

Country Status (5)

Country Link
US (1) US4005454A (pt)
BR (1) BR7602045A (pt)
CH (1) CH619073A5 (pt)
DE (1) DE2514922C2 (pt)
GB (2) GB1548756A (pt)

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US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
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JP2007512489A (ja) * 2003-11-24 2007-05-17 アルーマナ、マイクロウ、エルエルシー 可変容量形コンプレッサの制御に適したマイクロバルブ・デバイス
JP2007525630A (ja) * 2004-02-27 2007-09-06 アルーマナ、マイクロウ、エルエルシー ハイブリッド・マイクロ／マクロ・プレート弁
JP5196422B2 (ja) * 2004-03-05 2013-05-15 ドゥンアン、マイクロスタック、インク マイクロバルブ形成のための選択的ボンディング
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US4005454A (en) 1977-01-25
DE2514922A1 (de) 1976-10-14
GB1548756A (en) 1979-07-18
DE2514922C2 (de) 1983-01-27
CH619073A5 (pt) 1980-08-29
GB1548755A (en) 1979-07-18

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