CH603831A5 - - Google Patents

Info

Publication number
CH603831A5
CH603831A5 CH956276A CH956276A CH603831A5 CH 603831 A5 CH603831 A5 CH 603831A5 CH 956276 A CH956276 A CH 956276A CH 956276 A CH956276 A CH 956276A CH 603831 A5 CH603831 A5 CH 603831A5
Authority
CH
Switzerland
Application number
CH956276A
Inventor
Richard Dr Doetzer
Klaus Stoeger
Josef Stadter
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH603831A5 publication Critical patent/CH603831A5/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/42—Electroplating: Baths therefor from solutions of light metals
    • C25D3/44—Aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
CH956276A 1975-08-21 1976-07-27 CH603831A5 (sh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2537256A DE2537256C3 (de) 1975-08-21 1975-08-21 Vorrichtung zum galvanischen Abscheiden von Aluminium

Publications (1)

Publication Number Publication Date
CH603831A5 true CH603831A5 (sh) 1978-08-31

Family

ID=5954521

Family Applications (1)

Application Number Title Priority Date Filing Date
CH956276A CH603831A5 (sh) 1975-08-21 1976-07-27

Country Status (6)

Country Link
US (1) US4053383A (sh)
JP (1) JPS5854196B2 (sh)
AT (1) AT343432B (sh)
CH (1) CH603831A5 (sh)
DE (1) DE2537256C3 (sh)
GB (1) GB1521418A (sh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2719641A1 (de) * 1977-05-03 1978-11-09 Montblanc Simplo Gmbh Galvanisierbad zum abscheiden von metallen, z.b. aluminium in aprotischen loesungsmitteln und inerter atmosphaere
DE2719680A1 (de) * 1977-05-03 1978-11-09 Montblanc Simplo Gmbh Anlage zum aluminieren
DE2901586A1 (de) * 1979-01-17 1980-07-31 Montblanc Simplo Gmbh Aluminierzelle
DE3102021C2 (de) * 1981-01-22 1984-02-23 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen Abscheiden von Aluminium
DE3111786A1 (de) * 1981-03-25 1982-10-07 Siemens AG, 1000 Berlin und 8000 München Elektrisch isolierende schutzeinrichtung
DE3112919A1 (de) * 1981-03-31 1982-10-07 Siemens AG, 1000 Berlin und 8000 München "metallbeschichtete eisenwerkstoffe"
DE3150545A1 (de) * 1981-07-10 1983-06-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zum betreiben einer galvanisiereinrichtung
DE3138072C1 (de) * 1981-09-24 1982-11-04 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Aufheizen von Aluminierbaedern mit aprotischen Elektrolitsystemen
DE3231855A1 (de) * 1982-08-26 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen abscheiden von aluminium
US4759831A (en) * 1986-07-04 1988-07-26 Siemens Aktiengesellschaft Electroplating apparatus particularly for electro-deposition of aluminum
JP2530893B2 (ja) * 1988-08-05 1996-09-04 日新製鋼株式会社 常温型溶融塩電気アルミニウムめっき装置及びその給電装置
JPH06240499A (ja) * 1993-02-12 1994-08-30 Yamaha Corp メッキ方法及びその装置
JP4064132B2 (ja) * 2002-03-18 2008-03-19 株式会社荏原製作所 基板処理装置及び基板処理方法
US20070214620A1 (en) * 2003-06-11 2007-09-20 Mitsuru Miyazaki Substrate processing apparatus and substrate processing method
ITBO20090326A1 (it) * 2009-05-19 2010-11-20 Cabro S P A Dispositivo e metodo per l'elettrodeposizione di alluminio su substrati conduttori
FR2958300B1 (fr) * 2010-03-31 2012-05-04 Snecma Dispositif pour controler des caracteristiques physiques d'un bain d'electrodeposition metallique.
CN102534738A (zh) * 2010-12-21 2012-07-04 苏州市甘泉自动化环保设备厂 一种自动行车
US9246024B2 (en) 2011-07-14 2016-01-26 International Business Machines Corporation Photovoltaic device with aluminum plated back surface field and method of forming same
CN113802169B (zh) * 2021-10-12 2023-06-20 合鸿新材科技有限公司 一种电镀设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1838666A (en) * 1925-08-12 1931-12-29 Colin G Fink Electroplating apparatus
US2760930A (en) * 1952-01-31 1956-08-28 Nat Lead Co Electrolytic cell of the diaphragm type
US2897129A (en) * 1957-03-04 1959-07-28 Titanium Metals Corp Electrode handling and storing apparatus

Also Published As

Publication number Publication date
AT343432B (de) 1978-05-26
DE2537256B2 (de) 1978-09-21
US4053383A (en) 1977-10-11
GB1521418A (en) 1978-08-16
ATA558376A (de) 1977-09-15
DE2537256C3 (de) 1979-05-17
JPS5854196B2 (ja) 1983-12-03
DE2537256A1 (de) 1977-02-24
JPS5226324A (en) 1977-02-26

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Legal Events

Date Code Title Description
PL Patent ceased