CH538551A - Appareil pour le dépôt de couches minces par pulvérisation cathodique sur un support conducteur - Google Patents

Appareil pour le dépôt de couches minces par pulvérisation cathodique sur un support conducteur

Info

Publication number
CH538551A
CH538551A CH998071A CH998071A CH538551A CH 538551 A CH538551 A CH 538551A CH 998071 A CH998071 A CH 998071A CH 998071 A CH998071 A CH 998071A CH 538551 A CH538551 A CH 538551A
Authority
CH
Switzerland
Prior art keywords
thin films
conductive support
depositing thin
cathodic sputtering
cathodic
Prior art date
Application number
CH998071A
Other languages
English (en)
French (fr)
Inventor
Labedan Pierre
Masotti Robert
Original Assignee
Progil
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Progil filed Critical Progil
Publication of CH538551A publication Critical patent/CH538551A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
    • H01M4/88—Processes of manufacture
    • H01M4/8825—Methods for deposition of the catalytic active composition
    • H01M4/8867—Vapour deposition
    • H01M4/8871—Sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
CH998071A 1970-07-10 1971-07-07 Appareil pour le dépôt de couches minces par pulvérisation cathodique sur un support conducteur CH538551A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7026730A FR2098563A5 (enrdf_load_html_response) 1970-07-10 1970-07-10

Publications (1)

Publication Number Publication Date
CH538551A true CH538551A (fr) 1973-06-30

Family

ID=9058937

Family Applications (1)

Application Number Title Priority Date Filing Date
CH998071A CH538551A (fr) 1970-07-10 1971-07-07 Appareil pour le dépôt de couches minces par pulvérisation cathodique sur un support conducteur

Country Status (13)

Country Link
US (1) US3779885A (enrdf_load_html_response)
JP (1) JPS5520747Y2 (enrdf_load_html_response)
AT (1) AT304220B (enrdf_load_html_response)
BE (1) BE769722A (enrdf_load_html_response)
CA (2) CA994708A (enrdf_load_html_response)
CH (1) CH538551A (enrdf_load_html_response)
DE (1) DE2134377C3 (enrdf_load_html_response)
ES (1) ES393087A1 (enrdf_load_html_response)
FR (1) FR2098563A5 (enrdf_load_html_response)
GB (1) GB1333617A (enrdf_load_html_response)
NL (1) NL7109534A (enrdf_load_html_response)
SE (1) SE366778B (enrdf_load_html_response)
SU (1) SU405215A3 (enrdf_load_html_response)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU5889880A (en) * 1979-07-02 1981-01-15 Olin Corporation Manufacture of low overvoltage electrodes by cathodic sputtering
DE3107914A1 (de) * 1981-03-02 1982-09-16 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum beschichten von formteilen durch katodenzerstaeubung
US4451344A (en) * 1982-03-26 1984-05-29 International Business Machines Corp. Method of making edge protected ferrite core
US4812217A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for feeding and coating articles in a controlled atmosphere
US5279724A (en) * 1991-12-26 1994-01-18 Xerox Corporation Dual sputtering source
US5322606A (en) * 1991-12-26 1994-06-21 Xerox Corporation Use of rotary solenoid as a shutter actuator on a rotating arm
EP0647352A1 (en) 1992-06-26 1995-04-12 Materials Research Corporation Transport system for wafer processing line
KR20230008774A (ko) * 2020-06-23 2023-01-16 미쿠니 일렉트론 코포레이션 유도결합플라즈마에 의해 스퍼터링 성막을 수행하는 성막장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1758531A (en) * 1926-10-22 1930-05-13 Elektrodenzerstaubung M B H Ge Vacuum dispersion coating process
US3294670A (en) * 1963-10-07 1966-12-27 Western Electric Co Apparatus for processing materials in a controlled atmosphere
LU45647A1 (enrdf_load_html_response) * 1964-03-12 1965-09-13
LU52106A1 (enrdf_load_html_response) * 1966-10-05 1968-05-07
US3594301A (en) * 1968-11-22 1971-07-20 Gen Electric Sputter coating apparatus

Also Published As

Publication number Publication date
ES393087A1 (es) 1973-10-01
US3779885A (en) 1973-12-18
CA981622A (en) 1976-01-13
GB1333617A (en) 1973-10-10
SE366778B (enrdf_load_html_response) 1974-05-06
JPS5149723U (enrdf_load_html_response) 1976-04-15
FR2098563A5 (enrdf_load_html_response) 1972-03-10
AT304220B (de) 1972-12-27
SU405215A3 (enrdf_load_html_response) 1973-10-22
CA994708A (fr) 1976-08-10
BE769722A (fr) 1971-11-16
DE2134377B2 (de) 1974-04-25
JPS5520747Y2 (enrdf_load_html_response) 1980-05-19
NL7109534A (enrdf_load_html_response) 1972-01-12
DE2134377A1 (de) 1972-01-13
DE2134377C3 (de) 1974-11-28

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Legal Events

Date Code Title Description
PL Patent ceased