CH442535A - Monolithische Halbleitervorrichtung und Verfahren zu deren Herstellung - Google Patents
Monolithische Halbleitervorrichtung und Verfahren zu deren HerstellungInfo
- Publication number
- CH442535A CH442535A CH1504766A CH1504766A CH442535A CH 442535 A CH442535 A CH 442535A CH 1504766 A CH1504766 A CH 1504766A CH 1504766 A CH1504766 A CH 1504766A CH 442535 A CH442535 A CH 442535A
- Authority
- CH
- Switzerland
- Prior art keywords
- manufacturing
- same
- semiconductor device
- monolithic semiconductor
- monolithic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02167—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon carbide not containing oxygen, e.g. SiC, SiC:H or silicon carbonitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02293—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process formation of epitaxial layers by a deposition process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76297—Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/043—Dual dielectric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/05—Etch and refill
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/148—Silicon carbide
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US497332A US3400309A (en) | 1965-10-18 | 1965-10-18 | Monolithic silicon device containing dielectrically isolatng film of silicon carbide |
Publications (1)
Publication Number | Publication Date |
---|---|
CH442535A true CH442535A (de) | 1967-08-31 |
Family
ID=23976431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1504766A CH442535A (de) | 1965-10-18 | 1966-10-18 | Monolithische Halbleitervorrichtung und Verfahren zu deren Herstellung |
Country Status (8)
Country | Link |
---|---|
US (1) | US3400309A (de) |
CA (1) | CA926022A (de) |
CH (1) | CH442535A (de) |
DE (1) | DE1564191B2 (de) |
FR (1) | FR1497326A (de) |
GB (1) | GB1124853A (de) |
NL (1) | NL6614597A (de) |
SE (1) | SE339847B (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3905037A (en) * | 1966-12-30 | 1975-09-09 | Texas Instruments Inc | Integrated circuit components in insulated islands of integrated semiconductor materials in a single substrate |
US3497773A (en) * | 1967-02-20 | 1970-02-24 | Westinghouse Electric Corp | Passive circuit elements |
FR1527898A (fr) * | 1967-03-16 | 1968-06-07 | Radiotechnique Coprim Rtc | Agencement de dispositifs semi-conducteurs portés par un support commun et son procédé de fabrication |
US3490140A (en) * | 1967-10-05 | 1970-01-20 | Bell Telephone Labor Inc | Methods for making semiconductor devices |
US3789276A (en) * | 1968-07-15 | 1974-01-29 | Texas Instruments Inc | Multilayer microelectronic circuitry techniques |
JPS557946B2 (de) * | 1972-04-19 | 1980-02-29 | ||
JPS5226182A (en) * | 1975-08-25 | 1977-02-26 | Hitachi Ltd | Manufacturing method of semi-conductor unit |
FR2335046A1 (fr) * | 1975-12-12 | 1977-07-08 | Thomson Csf | Procede collectif de fabrication de dispositifs semi-conducteurs a jonction et dispositifs obtenus par ce procede |
JPS5272399A (en) * | 1975-12-13 | 1977-06-16 | Fujitsu Ltd | Method and apparatus for growth of single crystals of al2o3 from gas p hase |
DE2658304C2 (de) * | 1975-12-24 | 1984-12-20 | Tokyo Shibaura Electric Co., Ltd., Kawasaki, Kanagawa | Halbleitervorrichtung |
US4028149A (en) * | 1976-06-30 | 1977-06-07 | Ibm Corporation | Process for forming monocrystalline silicon carbide on silicon substrates |
GB1548520A (en) * | 1976-08-27 | 1979-07-18 | Tokyo Shibaura Electric Co | Method of manufacturing a semiconductor device |
US4161743A (en) * | 1977-03-28 | 1979-07-17 | Tokyo Shibaura Electric Co., Ltd. | Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat |
US4762806A (en) * | 1983-12-23 | 1988-08-09 | Sharp Kabushiki Kaisha | Process for producing a SiC semiconductor device |
US4524237A (en) * | 1984-02-08 | 1985-06-18 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Increased voltage photovoltaic cell |
US5229625A (en) * | 1986-08-18 | 1993-07-20 | Sharp Kabushiki Kaisha | Schottky barrier gate type field effect transistor |
JPH067594B2 (ja) * | 1987-11-20 | 1994-01-26 | 富士通株式会社 | 半導体基板の製造方法 |
US5011706A (en) * | 1989-04-12 | 1991-04-30 | Dow Corning Corporation | Method of forming coatings containing amorphous silicon carbide |
US5468674A (en) * | 1994-06-08 | 1995-11-21 | The United States Of America As Represented By The Secretary Of The Navy | Method for forming low and high minority carrier lifetime layers in a single semiconductor structure |
US5677230A (en) * | 1995-12-01 | 1997-10-14 | Motorola | Method of making wide bandgap semiconductor devices |
US7060516B2 (en) * | 2002-09-30 | 2006-06-13 | Bookham Technology, Plc | Method for integrating optical devices in a single epitaxial growth step |
US10861694B2 (en) * | 2017-01-17 | 2020-12-08 | Zf Friedrichshafen Ag | Method of manufacturing an insulation layer on silicon carbide |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2840494A (en) * | 1952-12-31 | 1958-06-24 | Henry W Parker | Manufacture of transistors |
NL244520A (de) * | 1958-10-23 | |||
US3158788A (en) * | 1960-08-15 | 1964-11-24 | Fairchild Camera Instr Co | Solid-state circuitry having discrete regions of semi-conductor material isolated by an insulating material |
-
1965
- 1965-10-18 US US497332A patent/US3400309A/en not_active Expired - Lifetime
-
1966
- 1966-09-28 CA CA971498A patent/CA926022A/en not_active Expired
- 1966-10-11 FR FR8068A patent/FR1497326A/fr not_active Expired
- 1966-10-13 GB GB45732/66A patent/GB1124853A/en not_active Expired
- 1966-10-15 DE DE1966J0032009 patent/DE1564191B2/de active Granted
- 1966-10-17 NL NL6614597A patent/NL6614597A/xx unknown
- 1966-10-18 CH CH1504766A patent/CH442535A/de unknown
- 1966-10-18 SE SE14135/66A patent/SE339847B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US3400309A (en) | 1968-09-03 |
DE1564191B2 (de) | 1976-11-11 |
SE339847B (de) | 1971-10-25 |
NL6614597A (de) | 1967-04-19 |
DE1564191A1 (de) | 1970-01-22 |
FR1497326A (fr) | 1967-10-06 |
GB1124853A (en) | 1968-08-21 |
CA926022A (en) | 1973-05-08 |
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