CH499877A - Halbleiterbauelement und Verfahren zu dessen Herstellung - Google Patents

Halbleiterbauelement und Verfahren zu dessen Herstellung

Info

Publication number
CH499877A
CH499877A CH1471369A CH1471369A CH499877A CH 499877 A CH499877 A CH 499877A CH 1471369 A CH1471369 A CH 1471369A CH 1471369 A CH1471369 A CH 1471369A CH 499877 A CH499877 A CH 499877A
Authority
CH
Switzerland
Prior art keywords
manufacture
semiconductor component
semiconductor
component
Prior art date
Application number
CH1471369A
Other languages
English (en)
Inventor
Karl-Heinz Dr Zschauer
Guenter Dr Winstel
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH499877A publication Critical patent/CH499877A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N80/00—Bulk negative-resistance effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
CH1471369A 1968-09-30 1969-09-30 Halbleiterbauelement und Verfahren zu dessen Herstellung CH499877A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681789063 DE1789063A1 (de) 1968-09-30 1968-09-30 Traeger fuer Halbleiterbauelemente

Publications (1)

Publication Number Publication Date
CH499877A true CH499877A (de) 1970-11-30

Family

ID=5706785

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1471369A CH499877A (de) 1968-09-30 1969-09-30 Halbleiterbauelement und Verfahren zu dessen Herstellung

Country Status (8)

Country Link
US (1) US3611065A (de)
AT (1) AT323253B (de)
CH (1) CH499877A (de)
DE (1) DE1789063A1 (de)
FR (1) FR2019192A1 (de)
GB (1) GB1242660A (de)
NL (1) NL6913107A (de)
SE (1) SE364848B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546787A (en) * 1977-06-17 1979-01-19 Matsushita Electric Ind Co Ltd Luminous element
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
US4685987A (en) * 1983-09-02 1987-08-11 The Bergquist Company Method of preparing interfacings of heat sinks with electrical devices
US4916515A (en) * 1985-06-03 1990-04-10 Levi Clifford A Microwave circuit integrating
US5596231A (en) * 1991-08-05 1997-01-21 Asat, Limited High power dissipation plastic encapsulated package for integrated circuit die
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
US5679457A (en) * 1995-05-19 1997-10-21 The Bergquist Company Thermally conductive interface for electronic devices
US6090484A (en) * 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
GB2334633B (en) * 1998-02-21 2002-09-25 Mitel Corp Low leakage electrostatic discharge protection system
US6486561B1 (en) * 2000-09-12 2002-11-26 Luminary Logic, Ltd. Semiconductor light emitting element formed on a clear or translucent substrate
JP1775145S (ja) 2023-01-10 2024-07-10 眼鏡

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414968A (en) * 1965-02-23 1968-12-10 Solitron Devices Method of assembly of power transistors
US3506886A (en) * 1965-03-08 1970-04-14 Itt High power transistor assembly
US3479570A (en) * 1966-06-14 1969-11-18 Rca Corp Encapsulation and connection structure for high power and high frequency semiconductor devices
US3489956A (en) * 1966-09-30 1970-01-13 Nippon Electric Co Semiconductor device container
GB1181459A (en) * 1966-09-30 1970-02-18 Nippon Electric Co Improvements in Semiconductor Structures
US3471923A (en) * 1966-12-09 1969-10-14 Rca Corp Method of making diode arrays
JPS4697Y1 (de) * 1967-03-09 1971-01-06
US3469017A (en) * 1967-12-12 1969-09-23 Rca Corp Encapsulated semiconductor device having internal shielding
US3478161A (en) * 1968-03-13 1969-11-11 Rca Corp Strip-line power transistor package

Also Published As

Publication number Publication date
FR2019192A1 (de) 1970-06-26
AT323253B (de) 1975-07-10
GB1242660A (en) 1971-08-11
DE1789063A1 (de) 1971-12-30
NL6913107A (de) 1970-04-01
US3611065A (en) 1971-10-05
SE364848B (de) 1974-03-04

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Legal Events

Date Code Title Description
PL Patent ceased