CA3018888A1 - Semiconductor lens optimization of fabrication - Google Patents
Semiconductor lens optimization of fabrication Download PDFInfo
- Publication number
- CA3018888A1 CA3018888A1 CA3018888A CA3018888A CA3018888A1 CA 3018888 A1 CA3018888 A1 CA 3018888A1 CA 3018888 A CA3018888 A CA 3018888A CA 3018888 A CA3018888 A CA 3018888A CA 3018888 A1 CA3018888 A1 CA 3018888A1
- Authority
- CA
- Canada
- Prior art keywords
- lenses
- lens
- substrate
- laser
- lens array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000004065 semiconductor Substances 0.000 title abstract description 7
- 238000005457 optimization Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 238000005530 etching Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims description 70
- 239000000463 material Substances 0.000 claims description 43
- 229920002120 photoresistant polymer Polymers 0.000 claims description 43
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000000347 anisotropic wet etching Methods 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 7
- 238000001020 plasma etching Methods 0.000 claims description 7
- 238000001039 wet etching Methods 0.000 claims description 7
- 238000001312 dry etching Methods 0.000 claims description 6
- 230000015654 memory Effects 0.000 claims description 5
- 238000000206 photolithography Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 9
- 238000003491 array Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
- G02B7/005—Motorised alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2208/00—Processes carried out in the presence of solid particles; Reactors therefor
- B01J2208/00008—Controlling the process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J8/00—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0018—Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/10—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Laser Beam Processing (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/133,094 US9927558B2 (en) | 2016-04-19 | 2016-04-19 | Semiconductor lens optimization of fabrication |
| US15/133,094 | 2016-04-19 | ||
| PCT/US2017/027674 WO2017184455A1 (en) | 2016-04-19 | 2017-04-14 | Semiconductor lens optimization of fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA3018888A1 true CA3018888A1 (en) | 2017-10-26 |
Family
ID=60038117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA3018888A Abandoned CA3018888A1 (en) | 2016-04-19 | 2017-04-14 | Semiconductor lens optimization of fabrication |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US9927558B2 (enExample) |
| EP (2) | EP3446160B1 (enExample) |
| JP (2) | JP6987783B2 (enExample) |
| CN (2) | CN109416417A (enExample) |
| CA (1) | CA3018888A1 (enExample) |
| TW (1) | TWI650583B (enExample) |
| WO (1) | WO2017184455A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130223846A1 (en) | 2009-02-17 | 2013-08-29 | Trilumina Corporation | High speed free-space optical communications |
| US11095365B2 (en) | 2011-08-26 | 2021-08-17 | Lumentum Operations Llc | Wide-angle illuminator module |
| EP3329562B1 (en) | 2015-07-30 | 2024-03-13 | Optipulse Inc. | Rigid high power and high speed lasing grid structures |
| US10630055B2 (en) * | 2017-06-16 | 2020-04-21 | Optipulse Inc. | Graphene lens structures for use with light engine and grid laser structures |
| US10630053B2 (en) | 2015-07-30 | 2020-04-21 | Optipulse Inc. | High power laser grid structure |
| US9927558B2 (en) | 2016-04-19 | 2018-03-27 | Trilumina Corp. | Semiconductor lens optimization of fabrication |
| AU2018316346B2 (en) | 2017-08-11 | 2024-01-25 | Optipulse Inc. | Laser grid structures for wireless high speed data transfers |
| US10374705B2 (en) | 2017-09-06 | 2019-08-06 | Optipulse Inc. | Method and apparatus for alignment of a line-of-sight communications link |
| JP2020149032A (ja) * | 2018-10-05 | 2020-09-17 | 株式会社リコー | 光学素子、表示装置、表示システムおよび移動体 |
| CN111381334B (zh) * | 2018-12-28 | 2021-06-15 | 中国科学院长春光学精密机械与物理研究所 | 一种用于光学系统中光路组件的对准方法 |
| EP4073585A1 (en) * | 2019-12-10 | 2022-10-19 | TRUMPF Photonic Components GmbH | Method of lithographically forming an optical structure in a semiconductor substrate |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5073041A (en) * | 1990-11-13 | 1991-12-17 | Bell Communications Research, Inc. | Integrated assembly comprising vertical cavity surface-emitting laser array with Fresnel microlenses |
| US5316640A (en) * | 1991-06-19 | 1994-05-31 | Matsushita Electric Industrial Co., Ltd. | Fabricating method of micro lens |
| JP3251150B2 (ja) * | 1994-12-29 | 2002-01-28 | 日本板硝子株式会社 | 平板マイクロレンズアレイおよびその製造方法 |
| JP3570194B2 (ja) * | 1998-01-19 | 2004-09-29 | セイコーエプソン株式会社 | 液晶装置、それを用いた電子機器及び液晶装置の製造方法 |
| US6835535B2 (en) * | 2000-07-31 | 2004-12-28 | Corning Incorporated | Microlens arrays having high focusing efficiency |
| KR20050005357A (ko) | 2003-07-01 | 2005-01-13 | 삼성전자주식회사 | 마이크로렌즈 제작방법 및 이를 이용한 광모듈 제작방법 |
| US7307788B2 (en) * | 2004-12-03 | 2007-12-11 | Micron Technology, Inc. | Gapless microlens array and method of fabrication |
| US7333267B2 (en) | 2003-11-26 | 2008-02-19 | Micron Technology, Inc. | Micro-lenses for CMOS imagers |
| WO2007002796A2 (en) * | 2005-06-29 | 2007-01-04 | Reflexite Corporation | Collimating microlens array |
| KR20070055764A (ko) * | 2005-11-28 | 2007-05-31 | 광주과학기술원 | 화합물 반도체의 선택적 식각을 이용한 마이크로렌즈 및마이크로 렌즈가 집적된 광전소자 제조 방법 |
| CN101473439B (zh) * | 2006-04-17 | 2013-03-27 | 全视技术有限公司 | 阵列成像系统及相关方法 |
| EP2016620A2 (en) * | 2006-04-17 | 2009-01-21 | Omnivision Cdm Optics, Inc. | Arrayed imaging systems and associated methods |
| TWI319815B (en) * | 2006-10-31 | 2010-01-21 | Molding technology of optics component with micro-lens array | |
| US10038304B2 (en) * | 2009-02-17 | 2018-07-31 | Trilumina Corp. | Laser arrays for variable optical properties |
| US8995493B2 (en) * | 2009-02-17 | 2015-03-31 | Trilumina Corp. | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation |
| KR101632311B1 (ko) * | 2010-12-30 | 2016-06-22 | 삼성전자주식회사 | 패널 형태의 면 카메라, 이를 적용한 광 터치스크린 및 디스플레이 장치 |
| JP5985661B2 (ja) * | 2012-02-15 | 2016-09-06 | アップル インコーポレイテッド | 走査深度エンジン |
| US9065239B2 (en) | 2012-04-17 | 2015-06-23 | Trilumina Corp. | Multibeam array of top emitting VCSEL elements |
| WO2014175901A1 (en) * | 2013-04-22 | 2014-10-30 | Joseph John R | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation |
| US9369677B2 (en) | 2012-11-30 | 2016-06-14 | Qualcomm Technologies International, Ltd. | Image assistance for indoor positioning |
| JP6175761B2 (ja) | 2012-12-03 | 2017-08-09 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
| US10249661B2 (en) * | 2014-08-22 | 2019-04-02 | Visera Technologies Company Limited | Imaging devices with dummy patterns |
| US9927558B2 (en) | 2016-04-19 | 2018-03-27 | Trilumina Corp. | Semiconductor lens optimization of fabrication |
| TWI886529B (zh) * | 2023-08-01 | 2025-06-11 | 友達光電股份有限公司 | 顯示面板 |
-
2016
- 2016-04-19 US US15/133,094 patent/US9927558B2/en active Active
-
2017
- 2017-04-14 EP EP17786386.7A patent/EP3446160B1/en active Active
- 2017-04-14 CN CN201780024803.2A patent/CN109416417A/zh active Pending
- 2017-04-14 CA CA3018888A patent/CA3018888A1/en not_active Abandoned
- 2017-04-14 CN CN202410469662.7A patent/CN118169788A/zh active Pending
- 2017-04-14 JP JP2018554755A patent/JP6987783B2/ja active Active
- 2017-04-14 EP EP23166710.6A patent/EP4224220A1/en active Pending
- 2017-04-14 WO PCT/US2017/027674 patent/WO2017184455A1/en not_active Ceased
- 2017-04-19 TW TW106113106A patent/TWI650583B/zh active
-
2018
- 2018-02-15 US US15/898,048 patent/US11187831B2/en active Active
-
2021
- 2021-11-22 US US17/455,996 patent/US20220082733A1/en active Pending
- 2021-12-01 JP JP2021195716A patent/JP7402855B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN118169788A (zh) | 2024-06-11 |
| US20180172885A1 (en) | 2018-06-21 |
| JP2022043095A (ja) | 2022-03-15 |
| US20170299781A1 (en) | 2017-10-19 |
| TWI650583B (zh) | 2019-02-11 |
| EP3446160A4 (en) | 2019-12-18 |
| JP7402855B2 (ja) | 2023-12-21 |
| JP2019514073A (ja) | 2019-05-30 |
| US11187831B2 (en) | 2021-11-30 |
| CN109416417A (zh) | 2019-03-01 |
| EP3446160B1 (en) | 2023-11-08 |
| WO2017184455A1 (en) | 2017-10-26 |
| JP6987783B2 (ja) | 2022-01-05 |
| US9927558B2 (en) | 2018-03-27 |
| EP3446160A1 (en) | 2019-02-27 |
| US20220082733A1 (en) | 2022-03-17 |
| EP4224220A1 (en) | 2023-08-09 |
| TW201802497A (zh) | 2018-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |
Effective date: 20180924 |
|
| FZDE | Discontinued |
Effective date: 20220603 |
|
| FZDE | Discontinued |
Effective date: 20220603 |