TWI650583B - 最佳化之半導體透鏡製造方法及製造系統 - Google Patents

最佳化之半導體透鏡製造方法及製造系統 Download PDF

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Publication number
TWI650583B
TWI650583B TW106113106A TW106113106A TWI650583B TW I650583 B TWI650583 B TW I650583B TW 106113106 A TW106113106 A TW 106113106A TW 106113106 A TW106113106 A TW 106113106A TW I650583 B TWI650583 B TW I650583B
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TW
Taiwan
Prior art keywords
lenses
lens
substrate
group
lens array
Prior art date
Application number
TW106113106A
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English (en)
Chinese (zh)
Other versions
TW201802497A (zh
Inventor
李察Ｆ 卡爾森
約翰Ｒ 約瑟夫
梅爾Ｅ 瓦倫
湯瑪士Ａ 威爾寇克斯
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美商三流明公司
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Publication of TW201802497A publication Critical patent/TW201802497A/zh
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Publication of TWI650583B publication Critical patent/TWI650583B/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • G02B7/005—Motorised alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2208/00—Processes carried out in the presence of solid particles; Reactors therefor
    • B01J2208/00008—Controlling the process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J8/00—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0018—Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/10—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
TW106113106A 2016-04-19 2017-04-19 最佳化之半導體透鏡製造方法及製造系統 TWI650583B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/133,094 2016-04-19
US15/133,094 US9927558B2 (en) 2016-04-19 2016-04-19 Semiconductor lens optimization of fabrication

Publications (2)

Publication Number Publication Date
TW201802497A TW201802497A (zh) 2018-01-16
TWI650583B true TWI650583B (zh) 2019-02-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106113106A TWI650583B (zh) 2016-04-19 2017-04-19 最佳化之半導體透鏡製造方法及製造系統

Country Status (7)

Country Link
US (3) US9927558B2 (enExample)
EP (2) EP4224220A1 (enExample)
JP (2) JP6987783B2 (enExample)
CN (2) CN109416417A (enExample)
CA (1) CA3018888A1 (enExample)
TW (1) TWI650583B (enExample)
WO (1) WO2017184455A1 (enExample)

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US20130223846A1 (en) 2009-02-17 2013-08-29 Trilumina Corporation High speed free-space optical communications
US11095365B2 (en) 2011-08-26 2021-08-17 Lumentum Operations Llc Wide-angle illuminator module
US10630053B2 (en) 2015-07-30 2020-04-21 Optipulse Inc. High power laser grid structure
US10630055B2 (en) * 2017-06-16 2020-04-21 Optipulse Inc. Graphene lens structures for use with light engine and grid laser structures
AU2016298390B2 (en) 2015-07-30 2021-09-02 Optipulse Inc. Rigid high power and high speed lasing grid structures
US9927558B2 (en) 2016-04-19 2018-03-27 Trilumina Corp. Semiconductor lens optimization of fabrication
WO2019033111A1 (en) 2017-08-11 2019-02-14 Optipulse Inc. LASER GRID STRUCTURES FOR HIGH-SPEED WIRELESS DATA TRANSFERS
US10374705B2 (en) 2017-09-06 2019-08-06 Optipulse Inc. Method and apparatus for alignment of a line-of-sight communications link
JP2020149032A (ja) * 2018-10-05 2020-09-17 株式会社リコー 光学素子、表示装置、表示システムおよび移動体
CN111381334B (zh) * 2018-12-28 2021-06-15 中国科学院长春光学精密机械与物理研究所 一种用于光学系统中光路组件的对准方法
EP4073585A1 (en) 2019-12-10 2022-10-19 TRUMPF Photonic Components GmbH Method of lithographically forming an optical structure in a semiconductor substrate

Citations (5)

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JP3251150B2 (ja) * 1994-12-29 2002-01-28 日本板硝子株式会社 平板マイクロレンズアレイおよびその製造方法
CN101506715A (zh) * 2005-06-29 2009-08-12 瑞弗莱克塞特公司 用来在微透镜阵列薄膜中雕刻孔的方法和装置
TWI319815B (en) * 2006-10-31 2010-01-21 Molding technology of optics component with micro-lens array
US8021903B2 (en) * 2005-11-28 2011-09-20 Ytel Photonics Inc. Method for fabricating micro-lens and micro-lens integrated optoelectronic devices using selective etch of compound semiconductor
US8390931B2 (en) * 2003-11-26 2013-03-05 Aptina Imaging Corporation Micro-lenses for CMOS imagers and method for manufacturing micro-lenses

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JP3251150B2 (ja) * 1994-12-29 2002-01-28 日本板硝子株式会社 平板マイクロレンズアレイおよびその製造方法
US8390931B2 (en) * 2003-11-26 2013-03-05 Aptina Imaging Corporation Micro-lenses for CMOS imagers and method for manufacturing micro-lenses
CN101506715A (zh) * 2005-06-29 2009-08-12 瑞弗莱克塞特公司 用来在微透镜阵列薄膜中雕刻孔的方法和装置
US8021903B2 (en) * 2005-11-28 2011-09-20 Ytel Photonics Inc. Method for fabricating micro-lens and micro-lens integrated optoelectronic devices using selective etch of compound semiconductor
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Also Published As

Publication number Publication date
US20170299781A1 (en) 2017-10-19
JP6987783B2 (ja) 2022-01-05
TW201802497A (zh) 2018-01-16
JP2019514073A (ja) 2019-05-30
EP3446160A1 (en) 2019-02-27
JP2022043095A (ja) 2022-03-15
CN118169788A (zh) 2024-06-11
WO2017184455A1 (en) 2017-10-26
EP3446160B1 (en) 2023-11-08
US11187831B2 (en) 2021-11-30
CN109416417A (zh) 2019-03-01
US20180172885A1 (en) 2018-06-21
US9927558B2 (en) 2018-03-27
US20220082733A1 (en) 2022-03-17
EP4224220A1 (en) 2023-08-09
JP7402855B2 (ja) 2023-12-21
EP3446160A4 (en) 2019-12-18
CA3018888A1 (en) 2017-10-26

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