CA2870760C - Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique - Google Patents
Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique Download PDFInfo
- Publication number
- CA2870760C CA2870760C CA2870760A CA2870760A CA2870760C CA 2870760 C CA2870760 C CA 2870760C CA 2870760 A CA2870760 A CA 2870760A CA 2870760 A CA2870760 A CA 2870760A CA 2870760 C CA2870760 C CA 2870760C
- Authority
- CA
- Canada
- Prior art keywords
- solution
- platinum
- bath
- salt
- electrolytic bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1253599 | 2012-04-19 | ||
| FR1253599A FR2989694B1 (fr) | 2012-04-19 | 2012-04-19 | Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique |
| PCT/FR2013/050855 WO2013156737A1 (fr) | 2012-04-19 | 2013-04-18 | Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2870760A1 CA2870760A1 (fr) | 2013-10-24 |
| CA2870760C true CA2870760C (fr) | 2021-02-23 |
Family
ID=47002945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2870760A Active CA2870760C (fr) | 2012-04-19 | 2013-04-18 | Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9752243B2 (cg-RX-API-DMAC10.html) |
| EP (1) | EP2839059B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP6290179B2 (cg-RX-API-DMAC10.html) |
| CN (1) | CN104271811B (cg-RX-API-DMAC10.html) |
| BR (1) | BR112014026033B1 (cg-RX-API-DMAC10.html) |
| CA (1) | CA2870760C (cg-RX-API-DMAC10.html) |
| FR (1) | FR2989694B1 (cg-RX-API-DMAC10.html) |
| IN (1) | IN2014DN08735A (cg-RX-API-DMAC10.html) |
| RU (1) | RU2625923C2 (cg-RX-API-DMAC10.html) |
| WO (1) | WO2013156737A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104975312A (zh) * | 2015-07-30 | 2015-10-14 | 江苏金曼科技有限责任公司 | 一种延长镀液使用寿命的电镀方法 |
| FR3058165B1 (fr) | 2016-10-27 | 2018-12-14 | Safran Aircraft Engines | Procede et dispositif de regeneration de bain de platine |
| FR3066505B1 (fr) | 2017-05-16 | 2021-04-09 | Safran Aircraft Engines | Procede et dispositif ameliores de filtration de bain de platine par electrodialyse |
| CN110894617A (zh) * | 2018-09-13 | 2020-03-20 | 深圳市永达锐国际科技有限公司 | 3d铂金电铸工艺方法 |
| CN114214685A (zh) * | 2021-09-22 | 2022-03-22 | 湘潭大学 | 高温防护涂层及其制备方法与应用 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL124423C (cg-RX-API-DMAC10.html) * | 1963-03-20 | |||
| US3285839A (en) * | 1963-12-16 | 1966-11-15 | American Chem & Refining Co | Method and bath for electroplating rhenium |
| GB1431548A (en) * | 1972-09-21 | 1976-04-07 | Engelhard Ind Ltd | Electrodeposition of plantinum |
| US4182724A (en) * | 1976-04-06 | 1980-01-08 | Rustenburg Platinum Mines Limited | Compositions containing platinum |
| SU707382A1 (ru) * | 1978-05-30 | 2000-06-20 | Р.В. Джагацпанян | Электролит платинирования |
| SU954527A1 (ru) * | 1980-12-30 | 1982-08-30 | Предприятие П/Я В-2287 | Электролит дл платинировани титана |
| US4427502A (en) * | 1981-11-16 | 1984-01-24 | Bell Telephone Laboratories, Incorporated | Platinum and platinum alloy electroplating baths and processes |
| GB8821005D0 (en) * | 1988-09-07 | 1988-10-05 | Johnson Matthey Plc | Improvements in plating |
| US5041196A (en) * | 1989-12-26 | 1991-08-20 | Olin Corporation | Electrochemical method for producing chlorine dioxide solutions |
| JPH04333589A (ja) * | 1990-06-29 | 1992-11-20 | Electroplating Eng Of Japan Co | 高硬度白金材料の製造方法及びその高硬度白金材料 |
| JP2577832B2 (ja) * | 1990-06-29 | 1997-02-05 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 白金電鋳浴 |
| IL98550A (en) * | 1990-06-29 | 1996-07-23 | Electroplating Eng | Baths for the investment of platinum and for the production of platinum products by electricity, methods for investing platinum and for the production of platinum products that use them and products produced by them |
| US5788823A (en) * | 1996-07-23 | 1998-08-04 | Howmet Research Corporation | Platinum modified aluminide diffusion coating and method |
| GB2351089B (en) * | 1999-06-15 | 2001-04-18 | Hong Kong Productivity Council | Platinum electroforming/electroplating bath and method |
-
2012
- 2012-04-19 FR FR1253599A patent/FR2989694B1/fr active Active
-
2013
- 2013-04-18 BR BR112014026033-8A patent/BR112014026033B1/pt active IP Right Grant
- 2013-04-18 CN CN201380023550.9A patent/CN104271811B/zh active Active
- 2013-04-18 JP JP2015506292A patent/JP6290179B2/ja active Active
- 2013-04-18 CA CA2870760A patent/CA2870760C/fr active Active
- 2013-04-18 EP EP13722499.4A patent/EP2839059B1/fr active Active
- 2013-04-18 US US14/395,190 patent/US9752243B2/en active Active
- 2013-04-18 RU RU2014146284A patent/RU2625923C2/ru active
- 2013-04-18 WO PCT/FR2013/050855 patent/WO2013156737A1/fr not_active Ceased
- 2013-04-18 IN IN8735DEN2014 patent/IN2014DN08735A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2839059B1 (fr) | 2016-04-13 |
| BR112014026033A2 (pt) | 2017-06-27 |
| US20150075996A1 (en) | 2015-03-19 |
| FR2989694A1 (fr) | 2013-10-25 |
| FR2989694B1 (fr) | 2015-02-27 |
| EP2839059A1 (fr) | 2015-02-25 |
| JP6290179B2 (ja) | 2018-03-07 |
| JP2015514873A (ja) | 2015-05-21 |
| US9752243B2 (en) | 2017-09-05 |
| CN104271811B (zh) | 2016-10-12 |
| BR112014026033B1 (pt) | 2020-11-24 |
| CN104271811A (zh) | 2015-01-07 |
| RU2014146284A (ru) | 2016-06-10 |
| CA2870760A1 (fr) | 2013-10-24 |
| RU2625923C2 (ru) | 2017-07-19 |
| WO2013156737A1 (fr) | 2013-10-24 |
| IN2014DN08735A (cg-RX-API-DMAC10.html) | 2015-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |
Effective date: 20180302 |
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| MPN | Maintenance fee for patent paid |
Free format text: FEE DESCRIPTION TEXT: MF (PATENT, 12TH ANNIV.) - STANDARD Year of fee payment: 12 |
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| U00 | Fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U00-U101 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE REQUEST RECEIVED Effective date: 20250404 |
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| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-U102 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE FEE PAYMENT PAID IN FULL Effective date: 20250404 |
|
| MPN | Maintenance fee for patent paid |
Free format text: FEE DESCRIPTION TEXT: MF (PATENT, 13TH ANNIV.) - STANDARD Year of fee payment: 13 |
|
| U00 | Fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U00-U101 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE REQUEST RECEIVED Effective date: 20260408 |
|
| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-U102 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE FEE PAYMENT PAID IN FULL Effective date: 20260408 |