CA2860909C - Offsetting shielding and enhancing coupling in metallized smart cards - Google Patents

Offsetting shielding and enhancing coupling in metallized smart cards Download PDF

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Publication number
CA2860909C
CA2860909C CA2860909A CA2860909A CA2860909C CA 2860909 C CA2860909 C CA 2860909C CA 2860909 A CA2860909 A CA 2860909A CA 2860909 A CA2860909 A CA 2860909A CA 2860909 C CA2860909 C CA 2860909C
Authority
CA
Canada
Prior art keywords
antenna
module
smart card
contact pads
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2860909A
Other languages
English (en)
French (fr)
Other versions
CA2860909A1 (en
Inventor
David Finn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Feinics Amatech Teoranta Ltd
Original Assignee
Feinics Amatech Teoranta Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/600,140 external-priority patent/US8991712B2/en
Priority claimed from US13/730,811 external-priority patent/US9165240B2/en
Application filed by Feinics Amatech Teoranta Ltd filed Critical Feinics Amatech Teoranta Ltd
Publication of CA2860909A1 publication Critical patent/CA2860909A1/en
Application granted granted Critical
Publication of CA2860909C publication Critical patent/CA2860909C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
CA2860909A 2012-01-23 2013-01-23 Offsetting shielding and enhancing coupling in metallized smart cards Active CA2860909C (en)

Applications Claiming Priority (19)

Application Number Priority Date Filing Date Title
US201261589434P 2012-01-23 2012-01-23
US61/589,434 2012-01-23
US201261619951P 2012-04-04 2012-04-04
US61/619,951 2012-04-04
US201261624384P 2012-04-15 2012-04-15
US61/624,384 2012-04-15
US201261693262P 2012-08-25 2012-08-25
US61/693,262 2012-08-25
US13/600,140 2012-08-30
US13/600,140 US8991712B2 (en) 2010-08-12 2012-08-30 Coupling in and to RFID smart cards
US201261697825P 2012-09-07 2012-09-07
US61/697,825 2012-09-07
US201261732414P 2012-12-03 2012-12-03
US61/732,414 2012-12-03
US201261737746P 2012-12-15 2012-12-15
US61/737,746 2012-12-15
US13/730,811 2012-12-28
US13/730,811 US9165240B2 (en) 2009-10-15 2012-12-28 Coupling in and to RFID smart cards
PCT/EP2013/051175 WO2013110625A1 (en) 2012-01-23 2013-01-23 Offsetting shielding and enhancing coupling in metallized smart cards

Publications (2)

Publication Number Publication Date
CA2860909A1 CA2860909A1 (en) 2013-08-01
CA2860909C true CA2860909C (en) 2021-11-16

Family

ID=47722223

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2860909A Active CA2860909C (en) 2012-01-23 2013-01-23 Offsetting shielding and enhancing coupling in metallized smart cards

Country Status (9)

Country Link
EP (1) EP2807700A1 (ko)
JP (1) JP2015513712A (ko)
KR (1) KR20140117614A (ko)
CN (1) CN104471791A (ko)
AU (1) AU2013211649A1 (ko)
BR (1) BR112014018042A8 (ko)
CA (1) CA2860909C (ko)
MX (1) MX2014008936A (ko)
WO (1) WO2013110625A1 (ko)

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US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9697459B2 (en) 2014-08-10 2017-07-04 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US11386317B2 (en) 2013-01-18 2022-07-12 Amatech Group Limited Transponder chip module with module antenna(s) and coupling frame(s)
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
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EP3547225A1 (en) * 2013-11-13 2019-10-02 Féinics AmaTech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
EP3123400B1 (en) * 2014-03-26 2020-09-30 Féinics AmaTech Teoranta Transponder chip module with coupling frame
EP3198528B1 (en) * 2014-09-22 2020-08-26 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
WO2016046184A1 (en) * 2014-09-22 2016-03-31 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
US9858521B2 (en) 2014-10-14 2018-01-02 Confidex Oy RFID transponder and RFID transponder web
ES2827026T3 (es) * 2015-07-08 2021-05-19 Composecure Llc Tarjeta inteligente de metal con capacidad de interfaz dual
US10318859B2 (en) 2015-07-08 2019-06-11 Composecure, Llc Dual interface metal smart card with booster antenna
CN105205527A (zh) * 2015-09-15 2015-12-30 武汉天喻信息产业股份有限公司 一种金属射频卡
FR3047101B1 (fr) * 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
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US11267172B2 (en) * 2016-07-27 2022-03-08 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
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JP6888402B2 (ja) * 2017-05-01 2021-06-16 凸版印刷株式会社 基板モジュール
EP3673415B1 (en) * 2017-08-25 2022-05-25 CPI Card Group -Colorado, Inc. Weighted transaction card
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Also Published As

Publication number Publication date
MX2014008936A (es) 2015-06-02
CA2860909A1 (en) 2013-08-01
WO2013110625A1 (en) 2013-08-01
JP2015513712A (ja) 2015-05-14
KR20140117614A (ko) 2014-10-07
CN104471791A (zh) 2015-03-25
BR112014018042A8 (pt) 2017-07-11
BR112014018042A2 (ko) 2017-06-20
EP2807700A1 (en) 2014-12-03
AU2013211649A1 (en) 2014-07-31

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